10AS048K2F35E2SG - 480K Logic Elements SoC FPGA | Intel
부품 번호: 10AS048K2F35E2SG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
10AS048K2F35E2SG 개요
An FPGA, or field-programmable gate array, is a semiconductor device containing configurable logic, routing, and embedded resources that engineers can program after manufacturing. A system-on-chip FPGA extends that concept by integrating processing subsystems and FPGA fabric on one die. In the system hierarchy, it can be understood as programmable logic fabric combined with an application processor system, a platform device within embedded computing, and ultimately a member of the broader integrated-circuit family. Its value is the ability to implement parallel hardware acceleration, custom interfaces, and control logic alongside software running on embedded processors.
The principal verified features are 480,000 logic elements, a 1.5 GHz stated frequency, and dual ARM Cortex-A9 MPCore processors with CoreSight. The device also provides 256 KB of memory according to the supplied listing and uses 1152-ball BGA packaging. These attributes make it appropriate for designs that require substantial programmable capacity while retaining processor-based control and debug support. The 35 mm by 35 mm body is consistent with a high-ball-count surface-mount package and requires careful PCB escape routing, controlled impedance, thermal analysis, and high-density assembly capability.
The SoC architecture separates software-executed control and management tasks from parallel logic implemented in the FPGA fabric. Custom datapaths, protocol bridges, filtering functions, and interface controllers can operate concurrently, while the ARM subsystem supports operating-system, control, and supervisory workloads. This division helps systems achieve deterministic hardware performance without moving every function into software. Designers still need to validate power integrity, clock distribution, configuration support, boot storage, processor peripherals, and tool compatibility against the complete manufacturer documentation before release.
Typical applications include industrial automation controllers, communications infrastructure, medical diagnostic equipment, test and measurement platforms, aerospace and defense signal processing, and high-performance embedded computing. The 480,000 logic elements provide capacity for multiple parallel functions, while the dual ARM Cortex-A9 MPCore subsystem supports software control. The 1152-ball package is especially suitable for complex boards with many high-speed signals, but it increases routing, inspection, thermal, and assembly constraints compared with smaller FPGA packages.
A key design consideration is that a BGA FPGA cannot be treated as a simple two-leaded component. Engineers must plan the complete footprint, via field, fanout, decoupling network, clocking, configuration interface, and thermal path. Electrical specifications not present in the supplied verification must remain rather than being inferred. Confirm pinout, transceiver counts, I/O standards, speed grades, operating temperature, power rails, and maximum currents from the official Intel documentation before schematic release.
This page combines the verified distributor specifications, package identity, sourcing links, application context, and design cautions into a concise engineering reference. Pricing and availability are current only as of 2026-09-05; current distributor stock, lifecycle classification, and complete electrical ratings must be confirmed before procurement or design sign-off.
드롭인 대체품: 10AS048K2F35E2SG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS048K2F35E2SG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Logic Elements, DSP Blocks, Package Code.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AS048K2F35E2LG
✅ 드롭인✓ 재고 있음
$4150 / 개
데이터시트 보기 →10AS048K2F35E1HG
✅ 드롭인✓ 재고 있음
$2650 / 개
데이터시트 보기 →10AS048K1F35E1HG
✅ 드롭인✓ 재고 있음
$3850 / 개
데이터시트 보기 →10AS048K1F35I1HG
✅ 드롭인✓ 재고 있음
$3263.87 / 개
데이터시트 보기 →10AS048H4F34E3SG
✅ 드롭인✓ 재고 있음
$2250 / 개
데이터시트 보기 →10AS048K2F35E2SG 최대 정격 & 전기적 특성
| Product Type | System On Chip (SoC) IC Arria 10 SX FPGA |
| Processor Cores | Dual ARM Cortex-A9 MPCore |
| Debug Technology | ARM CoreSight |
| Logic Elements | 480000 |
| Specified Frequency | 1.5 GHz |
| Memory | 256 KB |
| Technology | CMOS |
| 패키지 | 1152-FBGA, FC (35x35 mm) |
| Package Category | FCBGA |
| Terminal Count | 1152 |
| Terminal Form | Ball |
| Package Code | BGA |
| Package Shape | Square |
| Nominal Supply | 0.95 V |
| RoHS 상태 | Compliant |
| 실장 유형 | Surface Mount |
10AS048K2F35E2SG square 핀 구성 가이드
10AS048K2F35E2SG(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AS048K2F35E2SG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AS048K2F35E2SG 적합 용도: 6 애플리케이션s: Industrial Automation Controller, Communications Infrastructure, Medical Diagnostic Equipment, Test and Measurement Platform, Aerospace and Defense Signal Processing, High-Performance Embedded Computing.
Industrial Automation Controller
10AS048K2F35E2SG fits industrial automation controllers that need parallel hardware control and embedded software on one device. Its 480000 logic elements can implement real-time interface conversion, filtering, motor-control datapaths, protocol bridges, and safety-oriented monitoring logic. Dual ARM Cortex-A9 MPCore processors provide a platform for supervisory control, communications, diagnostics, and operating-system services, while CoreSight technology supports system-level debug. The 1152-ball FCBGA package offers 1152 terminals for dense I/O and high-speed connectivity, but it requires a full via field, controlled escape routing, and robust assembly. The verified sources do not state an industrial temperature grade or complete I/O counts, so those parameters remain [DATA_NEEDED: industrial temperature and I/O details] before deployment in a production controller.
추천
Communications Infrastructure
10AS048K2F35E2SG can support communications infrastructure requiring deterministic parallel processing, high-density interfaces, and processor-based management. The 480000 logic elements are suitable for packet processing, protocol termination, traffic shaping, encryption assistance, and custom high-speed datapaths, while dual ARM Cortex-A9 MPCore cores can run control-plane software, network management, and diagnostics. The 1.5 GHz stated frequency supports substantial processing bandwidth, although the complete transceiver count, maximum data rate, and supported electrical standards are [DATA_NEEDED: communications electrical specifications]. A 1152-ball FCBGA device also permits extensive connectivity but demands impedance-controlled routing, clean power distribution, reference-clock planning, and careful signal-integrity validation. Use the official Intel pinout and device handbook to map transceiver and general-purpose I/O resources before board implementation.
추천
Medical Diagnostic Equipment
10AS048K2F35E2SG is relevant to medical diagnostic equipment where acquisition, filtering, image processing, and control functions must operate under strict timing constraints. The 480000 logic elements can implement sensor-interface logic, digital filtering, beamforming assistance, data compression, and other parallel processing functions. Dual ARM Cortex-A9 MPCore processors can manage user interfaces, device control, data storage, and communications. CoreSight technology provides a structured processor debug platform during development. However, medical use requires system-level validation beyond component specifications, including noise, thermal behavior, reliability, lifecycle, and applicable regulatory requirements. The supplied data does not provide medical-grade certification, operating-temperature limits, radiation behavior, or safety documentation. Those values remain [DATA_NEEDED: medical qualification parameters], and designers must perform the required system validation before clinical deployment.
추천
Test and Measurement Platform
10AS048K2F35E2SG suits a test and measurement platform that combines instrument-level signal processing with embedded control. Its 480000 logic elements can accelerate waveform analysis, correlation, filtering, encoding, trigger logic, and custom measurement algorithms. Dual ARM Cortex-A9 MPCore processors can run calibration routines, user interfaces, data logging, and remote-control software, while CoreSight technology supports processor debugging. The 1.5 GHz stated frequency and 256 KB listed memory provide a starting point for architecture planning, but usable memory architecture, external-memory interfaces, and signal-integrity limits are not fully specified in the supplied data. Use controlled-impedance PCB design, low-noise power, deterministic clocking, and calibration-aware signal paths. Values for ADC or DAC interfaces, analog bandwidth, and measurement accuracy are system-level requirements and remain [DATA_NEEDED: measurement-interface specifications].
추천
Aerospace and Defense Signal Processing
10AS048K2F35E2SG can be considered for aerospace and defense signal-processing systems requiring high programmable density and embedded control. The 480000 logic elements support multiple parallel channels, sensor fusion preprocessing, communications functions, and custom signal-analysis datapaths. Dual ARM Cortex-A9 MPCore processors can execute control, monitoring, and communications software, while CoreSight technology assists system debug. The 1152-ball FCBGA package is appropriate for high-complexity boards but creates substantial assembly, inspection, thermal, and counterfeit-screening obligations. The verified sources do not provide military temperature grade, radiation tolerance, packaging qualification, or reliability data. Those attributes remain [DATA_NEEDED: aerospace and defense qualification data]. Program teams should obtain the applicable Intel quality documents, conduct component-level screening, and validate the complete design for shock, vibration, temperature, radiation, and long-term availability requirements.
추천
High-Performance Embedded Computing
10AS048K2F35E2SG is applicable to high-performance embedded-computing platforms that partition work between software and programmable hardware. The dual ARM Cortex-A9 MPCore subsystem can run operating systems, device management, file services, and control applications, while 480000 logic elements accelerate algorithms that benefit from parallelism. This architecture is useful for data acquisition, machine-vision preprocessing, protocol conversion, and deterministic control. The 1.5 GHz stated frequency helps define system expectations, but the supplied evidence does not specify processor performance, internal-memory capacity, external-memory support, or power consumption. Those values remain [DATA_NEEDED: embedded-computing performance and power details]. Design the power tree, clock network, boot and configuration paths, and thermal solution from official documentation, while preserving signal integrity through the 1152-ball FCBGA package and high-density PCB implementation.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS048K2F35E2SG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AS048K2F35E2LG | 10AS048K2F35E1HG | 10AS048K1F35E1HG | 10AS048K1F35I1HG | 10AS048H4F34E3SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA, FC (35x35 mm) | 1152-FBGA, FC (35x35 mm) | 1152-FBGA, FC (35x35 mm) | 1152-FBGA, FC (35x35 mm) | 1152-FBGA, FC (35x35 mm) | BGA |
| Device Class | Arria 10 SX SoC FPGA | Arria 10 SX family ordering variant | Arria 10 SX family ordering variant | Arria 10 SX family ordering variant | Arria 10 SX family ordering variant | Arria 10 SoC family ordering variant |
주요 차별점
- Verified high-density SoC-FPGA identity (vs 10AS048H4F34E3SG)
- Explicit processor and debug integration (vs 10AS048K2F35E2LG)
- Large stated logic capacity for parallel functions (vs 10AS048K1F35E1HG)
- Large high-density package for complex systems (vs 10AS048K2F35E1HG)
설계 노트
Treat the 1152-ball FCBGA package as a system-level interconnect and power-design problem. Use the official Intel package drawing to create the land pattern, then verify escape routing, via fields, antipads, plane splits, and reference-plane continuity. Keep high-speed differential pairs over a continuous reference plane, control impedance, and avoid unnecessary layer transitions. Verify the complete ball map because the supplied web evidence confirms the 1152-terminal package but does not expose individual ball functions.
The verified result identifies CMOS technology and a 0.95 V nominal supply feature, but complete current consumption, rail tolerances, sequencing, and transient limits are not supplied. Do not estimate these values from the feature listing. Obtain the official Intel power-supply design guidance, identify every required rail, size the power tree for worst-case current plus margin, and place local decoupling at the package entry and logic clusters. Validate startup and shutdown sequencing with the processor system, FPGA configuration logic, clocks, and memory interfaces before layout sign-off.
A 35 mm by 35 mm FCBGA package can support high functional density but requires an explicit thermal path. The supplied data does not provide junction-to-air or junction-to-case resistance, maximum power, or operating temperature. Obtain those values from the official datasheet and thermal documentation, then create a package-aware heat-spreader, heatsink, or board-copper strategy as appropriate. Use worst-case FPGA, processor, I/O, and memory-interface activity for thermal analysis, not only the nominal 1.5 GHz figure.
High-speed SoC-FPGA designs require coordinated clock, power, and signal-integrity planning. Define clock-source accuracy and jitter budgets, provide low-noise power rails, use controlled-impedance routes for high-speed signals, and confirm differential-pair polarity and receiver constraints against the official pinout. The supplied results do not specify transceiver count, supported I/O standards, maximum data rate, or external-memory performance. Those values remain [DATA_NEEDED: high-speed interface specifications] and must be resolved before assigning pins or closing timing budgets.
Do not infer a drop-in replacement from a similar 10AS048 prefix, package description, or family name. The 10AS048K2F35E2LG, 10AS048K2F35E1HG, 10AS048K1F35E1HG, 10AS048K1F35I1HG, and 10AS048H4F34E3SG candidates require exact ordering-code and official-datasheet validation. For production, check the package ball map, processor and FPGA resource identity, power rails, configuration scheme, boot and software support, temperature grade, lifecycle, pin-compatible sourcing, and errata before treating any candidate as interchangeable.
규정 준수 정보
RoHS compliant is stated by the verified Ampheo result. REACH, lead-free, halogen-free, conflict-minerals, temperature-grade, and automotive-qualification data were not supplied. AEC-Q100 is not applicable based on the available product description, but no automotive certification claim is made.
