10AS032H2F34I2LG - Arria 10 SX 320K LE SoC FPGA | Intel | 1152-FBGA
부품 번호: 10AS032H2F34I2LG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1500 | $750,000.00 |
| 1,000 | $1390 | $1,390,000.00 |
10AS032H2F34I2LG 개요
A SoC FPGA is a single-chip integration of a microprocessor subsystem and programmable logic. The hard ARM Cortex-A9 MPCore delivers deterministic real-time performance for control-plane tasks while the FPGA fabric accelerates parallel datapath functions such as DSP, packet processing, and custom interfaces. This heterogeneous architecture falls within the broader taxonomy of system-on-chip -> application processor + FPGA -> embedded compute platform.
Key specifications include 320K logic elements, 1.5 GHz HPS clock, 20nm TSMC process technology, 0.9 V core supply, 1152-ball flip-chip BGA with 35x35 mm body, and industrial-grade operating temperature. The Arria 10 SX family is designed for mid-range, transceiver-rich embedded applications where software/firmware partitioning between HPS and FPGA fabric yields BOM and latency advantages over discrete CPU-plus-FPGA designs.
Architecturally, the device pairs a hardened ARM dual-core A9 cluster with NEON SIMD, L1/L2 caches, and CoreSight trace, alongside 28 nm-equivalent-class FPGA fabric, dedicated DSP blocks, and up to 17.4 Gbps transceivers. The 20nm process enables higher logic density at lower static power than the prior 28nm Arria V generation while maintaining the same Quartus Prime tool flow.
Typical applications include industrial motor control, software-defined radio baseband, machine vision preprocessing, military/aerospace signal processing, and high-performance embedded computing. The integrated HPS removes external processor glue and reduces board area, while the FPGA fabric handles deterministic I/O and parallel datapath workloads.
When designing with this device, ensure the PCB supports the 1.0 mm ball-pitch FC-FBGA land pattern with proper microvia stack-up and matched-length high-speed transceiver routing. Power sequencing of the HPS core, FPGA core, and transceiver supplies must follow the Intel Power Management User Guide to avoid in-rush latch-up.
This page consolidates distributor pricing, drop-in alternatives within the Arria 10 SX family, and practical design notes synthesized from the Altera/Intel datasheet family — content not available on the manufacturer part page alone.
드롭인 대체품: 10AS032H2F34I2LG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS032H2F34I2LG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Mounting Type, Package Code, Temperature Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AS032H2F34I1HG
✅ 드롭인✓ 재고 있음
$2700.05 / 개
데이터시트 보기 →10AS032H2F34E2SG
✅ 드롭인✓ 재고 있음
$1410 / 개
데이터시트 보기 →10AS032H2F34E2LG
✅ 드롭인✓ 재고 있음
$1380 / 개
데이터시트 보기 →10AS032H1F34I1HG
✅ 드롭인✓ 재고 있음
$2077.26 / 개
데이터시트 보기 →10AS032H1F35I1HG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2265 / 개
데이터시트 보기 →10AS032E4F29I3SG
✅ 드롭인✓ 재고 있음
$2250 / 개
데이터시트 보기 →10AS032H2F34I2LG 최대 정격 & 전기적 특성
| Product Type | SoC FPGA (FPGA + ARM Cortex-A9 MPCore HPS) |
| Family | Arria 10 SX |
| Logic Elements | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Clock | 1.5 GHz |
| Process Technology | 20 nm |
| Core Voltage (Vcc) | 0.9 V |
| 패키지 | 1152-ball FC-FBGA, 35 x 35 mm |
| Package Code | F34 (Flip-Chip BGA, 1.0 mm pitch) |
| Terminal Form | Ball |
| Terminal Count | 1152 |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Design Tool | Intel Quartus Prime |
| Transceiver Data Rate | Up to 17.4 Gbps (per family) |
10AS032H2F34I2LG f34 (flip-chip bga, 1.0 mm pitch) 핀 구성 가이드
10AS032H2F34I2LG(f34 (flip-chip bga, 1.0 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AS032H2F34I2LG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AS032H2F34I2LG 적합 용도: 8 애플리케이션s: Industrial Motor Control & Servo Drives, Software-Defined Radio Baseband, Machine Vision & Video Processing, Aerospace & Defense Signal Processing, High-Performance Embedded Computing (HPEC), Medical Imaging & Diagnostic Equipment, Industrial Networking & Protocol Bridging, Test & Measurement Instrumentation.
Industrial Motor Control & Servo Drives
The 10AS032H2F34I2LG is well-suited to industrial motor control because the dual ARM Cortex-A9 HPS executes field-oriented control (FOC) loops with deterministic latency at up to 1.5 GHz, while the 320K-LE FPGA fabric implements high-resolution PWM (up to 16-bit at 100 kHz switching), encoder interfaces (EnDat 2.2, BiSS-C, SSI), and fieldbus slaves (EtherCAT, PROFINET IRT). The 0.9 V core and 20 nm process reduce I2R losses across the 1152-ball BGA, and the industrial -40C to +100C temperature grade covers factory-floor enclosures. Compared with a discrete MCU-plus-FPGA partition, the integrated HPS-to-FPGA AXI bus removes external bus arbitration and shrinks PCB area in compact servo-drive form factors.
추천
Software-Defined Radio Baseband
The 10AS032H2F34I2LG supports software-defined radio (SDR) baseband processing by combining up to 17.4 Gbps transceivers (per the Arria 10 family) on the FPGA fabric with a Cortex-A9 HPS for protocol-stack control. The 320K logic elements, dedicated DSP blocks, and on-chip M20K memory implement wideband digital down-conversion (DDC), channelization, and modulation/demodulation in real time, while the HPS runs Linux for higher-layer packet processing. The 1.0 mm-pitch F34 FC-FBGA supports the matched-length differential routing that the transceiver channels require for sub-microsecond latency. This combination is well-suited to tactical radios, LTE small cells, and signal-intelligence platforms.
추천
Machine Vision & Video Processing
The 10AS032H2F34I2LG is used in machine vision preprocessing pipelines where the FPGA fabric performs pixel-level operations (debayering, gamma correction, color-space conversion, edge detection, optical-flow) at multi-megapixel frame rates, while the dual ARM Cortex-A9 HPS runs the OpenCV-based recognition stack and communicates with the host via GigE Vision or USB3 Vision. The 320K logic elements and embedded DSP blocks sustain 1080p60 or 4K30 throughput on common Sony/ON Semiconductor CMOS sensors, and the industrial -40C to +100C temperature range supports outdoor and factory deployments. The integrated HPS removes an external SoC, reducing bill of materials and inter-chip latency.
추천
Aerospace & Defense Signal Processing
The 10AS032H2F34I2LG serves aerospace and defense signal-processing applications such as radar front-end preprocessing, electronic-warfare (EW) channelization, and secure communications. Its 320K logic elements implement wideband FFTs, pulse compression, and digital beamforming in real time, while the hardened ARM Cortex-A9 HPS runs the mission-management software stack. The 20 nm TSMC process and industrial temperature grade provide the reliability headroom required for DO-254 and MIL-STD-810 environments, and the F34 FC-FBGA package supports the ruggedized PCB stacks common in avionics LRUs. Conduction-cooled variants can be specified via Intel's military screening program.
추천
High-Performance Embedded Computing (HPEC)
The 10AS032H2F34I2LG is deployed in HPEC subsystems where it acts as a sensor-fusion node: the FPGA fabric aggregates data from radar, lidar, and IMU sensors over GPIO, SPI, or LVDS interfaces, while the ARM Cortex-A9 HPS executes the sensor-fusion and target-tracking algorithms. The 320K logic elements provide headroom for multi-sensor Kalman filters and convolutional neural network (CNN) inference accelerators, and the 1.5 GHz HPS delivers the throughput required for real-time situational awareness. The F34 FC-FBGA's high ball density supports the many high-speed serializer/deserializer (SerDes) channels needed for sensor interconnect.
추천
Medical Imaging & Diagnostic Equipment
The 10AS032H2F34I2LG fits medical imaging systems such as ultrasound front-ends, CT reconstruction accelerators, and patient-monitoring aggregation hubs. The FPGA fabric implements beamforming and matched-filter operations in ultrasound, or back-projection kernels in CT reconstruction, at speeds a general-purpose CPU cannot match. The ARM Cortex-A9 HPS runs the user interface, DICOM stack, and clinical workflow software. The 0.9 V core voltage and 20 nm process keep power dissipation low enough for fan-less or low-airflow medical enclosures, and the industrial -40C to +100C temperature grade covers operating-room environments.
추천
Industrial Networking & Protocol Bridging
The 10AS032H2F34I2LG is used in industrial gateways and protocol bridges where the FPGA fabric terminates fieldbus protocols (PROFINET, EtherCAT, EtherNet/IP, Modbus TCP) while the Cortex-A9 HPS provides firewall, routing, and OPC-UA publish/subscribe functions. The 17.4 Gbps transceivers support multi-port Gigabit Ethernet aggregation, and the 320K logic elements allow line-rate frame processing with sub-microsecond latency. The industrial -40C to +100C temperature range and 1.0 mm-pitch F34 FC-FBGA package suit DIN-rail and panel-mount industrial PCs. Compared with a discrete NIC-plus-router design, the integrated SoC reduces both BOM cost and PCB area.
추천
Test & Measurement Instrumentation
The 10AS032H2F34I2LG is used in test & measurement equipment such as oscilloscopes, protocol analyzers, and arbitrary waveform generators. The FPGA fabric implements real-time DSP (FFT, FIR/IIR filtering, modulation analysis) on multi-GS/s ADC inputs, while the ARM Cortex-A9 HPS handles the touchscreen GUI, SCPI command parser, and USB/LAN connectivity. The 320K logic elements and embedded M20K memory blocks sustain deep acquisition-memory buffering, and the 1.5 GHz HPS provides the compute headroom required for instrument calibration and self-test. The F34 FC-FBGA supports the matched-length high-speed ADC interface routing that high-bandwidth instruments require.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS032H2F34I2LG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AS032H2F34I1HG | 10AS032H2F34E2SG | 10AS032H2F34E2LG | 10AS032H1F34I1HG | 10AS032E4F29I3SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA (F34, 35x35 mm) | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 780-FBGA (F29, 29x29 mm) - different package |
| Logic Elements | 320,000 | 320,000 (same) | 320,000 (same) | 320,000 (same) | 320,000 (same) | 320,000 (same) |
| Speed Grade | H2 (I2 industrial) | H2 (I1 industrial, slower) | H2 (E2 extended) | H2 (E2 extended) | H1 (I1 industrial, slowest) | E4 (I3 industrial) |
| Temperature Grade | Industrial -40C to +100C | Industrial -40C to +100C | Extended -40C to +125C | Extended -40C to +125C | Industrial -40C to +100C | Industrial -40C to +100C |
| HPS Maximum Clock | 1.5 GHz | 1.5 GHz (same) | 1.5 GHz (same) | 1.5 GHz (same) | 1.5 GHz (same) | 1.5 GHz (same) |
| Process Technology | 20 nm | 20 nm (same) | 20 nm (same) | 20 nm (same) | 20 nm (same) | 20 nm (same) |
| Core Voltage | 0.9 V | 0.9 V (same) | 0.9 V (same) | 0.9 V (same) | 0.9 V (same) | 0.9 V (same) |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
주요 차별점
- Industrial-temperature I2 speed grade in F34 package (vs 10AS032H2F34I1HG)
- Industrial -40C to +100C vs extended -40C to +125C temperature grade (vs 10AS032H2F34E2SG)
- H2 speed grade vs H1 speed grade at same F34 footprint (vs 10AS032H1F34I1HG)
- F34 1152-ball package retains full I/O count vs F29 780-ball (vs 10AS032E4F29I3SG)
설계 노트
Estimated: The 1152-ball FC-FBGA at 1.0 mm pitch requires a high-density PCB stack-up with microvias (laser-drilled, 0.1 mm via pad), sequential lamination, and via-in-pad plating for the inner-row balls. Use a 1 oz copper outer layer and 0.5 oz inner layers with a low-loss dielectric (Df <= 0.005 at 1 GHz) such as Isola FR408HR or Rogers RO4350B for high-speed transceiver channels. Matched-length routing within +/- 0.127 mm (5 mil) is required for transceiver pairs to meet the Arria 10 GX/SX transceiver skew specification. Reference the Intel Arria 10 GX/SX/GT PCB Design Guidelines for via pattern, antipad diameter, and reference-plane recommendations.
The 10AS032H2F34I2LG requires multiple sequenced power rails: 0.9 V VCC (FPGA core), 1.8 V VCCIO (HPS I/O), 1.2 V VCC_HPS, 1.5 V/2.5 V/3.3 V user I/O, and dedicated transceiver supplies (1.0 V VCCH_GXB and 1.5 V/1.8 V VCCA_GXB). Per the Intel Arria 10 Power Management User Guide, the HPS core, FPGA core, and transceiver supplies must ramp in a specific order to avoid in-rush latch-up; use a multi-rail power controller such as the Intel EM11x or Texas Instruments UCD90xxx with the proper sequence file. Decoupling: place 0402 0.1 uF MLCCs within 1 mm of every power pin, plus 22 uF bulk capacitors on each rail. Total decoupling budget is on the order of 200-300 capacitors for the full BGA — reference the device pin connection guidelines.
Estimated: At maximum utilization (320K LE at ~80% utilization, HPS at 1.5 GHz, transceivers active), the 10AS032H2F34I2LG can dissipate 15-25 W depending on toggle rate. The 35x35 mm FC-FBGA exposes a thermal pad on the top side; design a heat sink or thermal-interface-material (TIM) pad with thermal resistance <= 0.1 C/W. For fan-less enclosures, use a 4-6 mm copper coin under the package and aluminum heat spreader. Use the Intel PowerPlay Early Power Estimator (EPE) worksheet at design entry to size the cooling solution before committing to a PCB stack-up. Junction temperature must stay below 100C for industrial grade.
Differential transceiver pairs on the Arria 10 SX require 100-ohm differential impedance with intra-pair length matching within 0.127 mm (5 mil). Use AC-coupled 0402 capacitors (100 nF X7R) on the transmit side near the FPGA ball, with the receiver side AC-coupling per protocol requirements. Reference the Arria 10 GXB Transceiver User Guide for pre-emphasis, equalization, and VOD settings per data rate. Memory interfaces (DDR3/DDR4 to HPS) require matched-length fly-by topology with proper write-leveling calibration in the Quartus Prime HPS preloader. SI simulation with the Intel-provided IBIS-AMI models is strongly recommended before tape-out.
Common pitfalls with the 10AS032H2F34I2LG include: (1) using the wrong speed grade in the Quartus Prime project — speed-grade selection must match the OPN suffix exactly; (2) failing to generate the HPS preloader and U-Boot for the specific boot source (QSPI flash, SD card, NAND) before Quartus Prime programming file generation; (3) confusing the F34 package (1152-ball, 35x35 mm) with the F29 (780-ball, 29x29 mm) or F35 (1152-ball, different pinout) — pin assignments in the Quartus QSF file must be regenerated when changing package; (4) omitting the JTAG header or AS mode jumper for in-system programming; (5) under-sizing the HPS DDR3 controller fly-by routing — fly-by stubs longer than 25 mm require write-leveling calibration adjustments.
규정 준수 정보
RoHS compliance confirmed by Intel product page; industrial temperature grade (-40C to +100C) is not AEC-Q100 qualified (AEC-Q100 is for automotive-grade ICs). REACH, halogen-free, and conflict-minerals status were not stated in the verified web data and are marked 'unknown'. For full REACH/SVHC disclosure request the Intel product-content declaration.
