10AS057H2F34E2LG - Arria 10 SX SoC FPGA 570K LE, Dual ARM Cortex-A9 | Intel
부품 번호: 10AS057H2F34E2LG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3566.3 | $3,566.30 |
| 10 | $3209.67 | $32,096.70 |
| 50 | $2924.35 | $146,217.50 |
| 100 | $2709.97 | $270,997.00 |
| 250 | $2524.1 | $631,025.00 |
10AS057H2F34E2LG 개요
A System on Chip (SoC) FPGA is a heterogeneous computing device that combines a hard general-purpose processor subsystem (typically ARM Cortex-A cores) with programmable FPGA fabric on a single die. The Arria 10 SX places the processor subsystem alongside 20 Gbps-capable transceivers, variable-precision DSP blocks, and adaptive logic modules, allowing designers to partition deterministic DSP/IO workloads to the FPGA while running Linux or RTOS workloads on the Cortex-A9 cores. This SoC architecture simplifies board design (single chip, shared memory, unified power/clock tree) and reduces BOM cost compared to a discrete FPGA-plus-processor solution.
Key features of the 10AS057H2F34E2LG include 570K logic elements, 24 transceiver channels supporting up to 17.4 Gbps backplane performance, 1.5 GHz dual-core ARM Cortex-A9 with NEON and single/double-precision FPU, integrated CoreSight debug, on-chip DDR4 memory controller, and PCI Express Gen3 hard IP. The FCBGA-1152 (F34) package is part of the Intel/Altera high-density BGA family, optimized for high-speed serial channel breakout and signal-integrity-aware PCB stack-up designs.
Architecturally, the device uses a 20 nm process with embedded HardCopy ASIC blocks for memory controllers and PCIe, freeing fabric for application logic. The SoC HPS connects to the FPGA fabric through AXI/ACP bridges, providing coherent accelerator access with up to 125 Gb/s sustained bandwidth. Configuration is supported through active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG modes, with on-chip encryption (AES) and design-security features built in.
Typical applications include high-performance digital signal processing in wireless baseband units, 4K/8K video broadcast and pro-AV processing, military radar and electronic-warfare signal chains, industrial machine-vision frame grabbers, and PCIe accelerator cards that partition control-plane (HPS) from data-plane (FPGA) workloads. Its high transceiver count and DDR4 support also make it suitable for 100G Ethernet interface cards and high-speed data-acquisition backplanes.
When designing with the 10AS057H2F34E2LG, allocate a 12+ layer PCB stack-up with matched-length impedance control for the 17 Gbps transceiver lanes and use the Intel Arria 10 Transceiver PHY User Guide pinout constraints. Decoupling must follow the Intel power-tree reference (0.9 V core, 1.8 V/2.5 V I/O rails) using the recommended via-in-pad microvia pattern on the F34 BGA escape layer. Junction-to-ambient thermal design must keep theta_JA within package limits - the FCBGA-1152 35x35 package typically requires thermal vias under the slug and a heatsink in high-utilization scenarios.
This page synthesizes Intel Arria 10 datasheet parameters, distributor pricing, drop-in same-family alternatives, and PCB design guidance that goes beyond what the manufacturer datasheet PDF alone provides.
드롭인 대체품: 10AS057H2F34E2LG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS057H2F34E2LG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Logic Elements, Mounting Type, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AS057H2F34E1HG
✅ 드롭인✓ 재고 있음
$3050 / 개
데이터시트 보기 →10AS057H1F34I1HG
✅ 드롭인✓ 재고 있음
$3500 / 개
데이터시트 보기 →10AS057H1F34E1HG
✅ 드롭인✓ 재고 있음
$3300 / 개
데이터시트 보기 →10AS057H2F34E2LG
✅ 드롭인✓ 재고 있음
$2524.1 / 개
데이터시트 보기 →10AS057H4F34E3LG
✅ 드롭인✓ 재고 있음
$1820 / 개
데이터시트 보기 →10AS057H2F34E2LG 최대 정격 & 전기적 특성
| Product Type | System-on-Chip (SoC) FPGA |
| Family | Arria 10 SX |
| Logic Elements | 570,000 |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| Hard Processor Core Clock | 1.5 GHz |
| User I/O Count | 492 |
| Transceiver Channels | 24 (up to 17.4 Gbps backplane) |
| Memory Controller | Hard DDR4 controller |
| PCIe Hard IP | PCI Express Gen3 |
| Core Voltage | 0.9 V |
| Speed Grade | -E2 |
| 패키지 | 1152-ball FCBGA (F34, 35x35 mm) |
| 실장 유형 | Surface Mount (BGA) |
| 동작 온도 | 0C to +100C TJ |
| Configuration | AS / PS / FPP / JTAG |
| RoHS 상태 | Non-compliant (per Hotenda listing) |
10AS057H2F34E2LG 1152-ball fcbga (f34, 35x35 mm) 핀 구성 가이드
10AS057H2F34E2LG(1152-ball fcbga (f34, 35x35 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AS057H2F34E2LG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AS057H2F34E2LG 적합 용도: 6 애플리케이션s: Wireless Baseband DSP, 4K/8K Video Broadcast Processing, Military Radar and EW Signal Chains, PCIe Gen3 Accelerator Cards, Industrial Machine Vision Frame Grabbers, High-Speed Data Acquisition Backplanes.
Wireless Baseband DSP
The 10AS057H2F34E2LG's 570K logic elements and 24 transceivers running up to 17.4 Gbps make it a strong fit for 4G/5G baseband processing where multiple antenna carriers must be digitized, FFT-processed, and packetized in real time. The hard dual-core 1.5 GHz ARM Cortex-A9 HPS can host the Layer 2/3 protocol stack, offloading deterministic DSP to the FPGA fabric. On-chip DDR4 controller and PCIe Gen3 hard IP eliminate external memory bridge parts.
추천
4K/8K Video Broadcast Processing
The 570K-LE fabric supports multi-stream 4K/8K HEVC/AVC pipelines with sub-frame latency budgets under 16 ms. The 1.5 GHz dual-core Cortex-A9 runs control-plane tasks such as NMOS IS-04/05 discovery, while the FPGA fabric handles pixel-rate processing, HDR conversion, and genlocking. The 1152-ball F34 FCBGA package provides the I/O density required for 12G-SDI, HDMI 2.1, and IP ST 2110 gateway cards.
추천
Military Radar and EW Signal Chains
The 10AS057H2F34E2LG is well suited for phased-array radar front-end preprocessing, with 24 transceivers capturing wide-bandwidth IF streams and variable-precision DSP blocks implementing pulse compression and CFAR detection. Its 0.9 V core and 20 nm process support extended-temperature operation in ruggedized enclosures, and the hard Cortex-A9 can run the tracker/plot extractor. Designers can extend operating temperature using the -I grade variants of the same F34 footprint.
추천
PCIe Gen3 Accelerator Cards
The hard PCIe Gen3 controller plus 24 transceivers and 570K logic elements allow the 10AS057H2F34E2LG to be deployed as a host-facing accelerator for AI inference, database acceleration, or HPC kernels. The Cortex-A9 HPS can manage PCIe enumeration, BAR mapping, and user-space DMA, while the FPGA fabric executes the data-plane workload. The FCBGA-1152 package supports x16 card-edge pinouts on standard PCIe boards.
추천
Industrial Machine Vision Frame Grabbers
The 10AS057H2F34E2LG's 492 user I/O support multi-lane Camera Link HS, CoaXPress, and GigE Vision interfaces concurrently, with on-FPGA image preprocessing (debayering, lens correction, ROI extraction) at full sensor rates. The hard Cortex-A9 runs the GenICam/GenTL host stack, and the hard DDR4 controller buffers line-scan data. Industrial customers pair this part with the -I temperature grade variants for harsh environments.
추천
High-Speed Data Acquisition Backplanes
The 24 transceiver channels at 17.4 Gbps aggregate data from multiple ADC front-ends across a backplane (e.g. multi-channel oscilloscope digitizers, software-defined radio capture cards). The hard Cortex-A9 HPS can host Linux for SCPI command parsing and USB/Ethernet host interface, while the FPGA fabric implements the deep capture-memory controller and trigger engine. The F34 FCBGA provides the package density for high-pinout backplane connectors.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS057H2F34E2LG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AS057H2F34E1HG | 10AS057H1F34I1HG | 10AS057H1F34E1HG | 10AS057H4F34E3LG |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 1152-FCBGA (F34, 35x35 mm) | 1152-FCBGA (F34, 35x35) - same | 1152-FCBGA (F34, 35x35) - same | 1152-FCBGA (F34, 35x35) - same | 1152-FCBGA (F34, 35x35) - same |
| Logic Elements | 570,000 | 570,000 | 570,000 | 570,000 | 570,000 |
| HPS Bin / Speed Grade | H2 / -E2 | H2 / -E1 | H1 / -I1 | H1 / -E1 | H4 / -E3 |
| Hard Processor | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Transceiver Channels | 24 | 24 | 24 | 24 | 24 |
| Transceiver Max Data Rate | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps |
| User I/O | 492 | 492 | 492 | 492 | 492 |
| Operating Temperature Grade | Commercial (0C to +100C TJ) | Industrial | Industrial | Industrial | Commercial |
주요 차별점
- Higher HPS clock bin (H2) at 1.5 GHz (vs 10AS057H1F34E1HG)
- Mid-tier speed grade (-E2) balance (vs 10AS057H4F34E3LG)
- Commercial temperature grade vs industrial (vs 10AS057H2F34E1HG)
설계 노트
The F34 FCBGA-1152 package with 1.0 mm ball pitch requires a 12+ layer PCB stack-up with microvia-in-pad escape patterns on the top layer. Per the Intel Arria 10 PCB Design Guidelines, place 100 nF decoupling capacitors on every power pin within the BGA field, plus bulk 47 uF to 220 uF polymer caps adjacent to the device. Matched-length impedance control (85 ohm differential for transceivers, 50 ohm single-ended for GPIO) must be verified with the Intel-provided pinout spreadsheet before tape-out.
Estimated: the FCBGA-1152 35x35 mm package has a typical theta_JA in the range of 8-12 C/W with a thermal via array and 1-2 m/s airflow, per the Intel Arria 10 Package User Guide. At full transceiver utilization (24 lanes at 17.4 Gbps) and 80% FPGA utilization, total power can exceed 35 W. A heatsink with thermal interface material and forced-air cooling is recommended; junction-to-ambient must keep junction temperature below 100C for the commercial grade and below 100C for industrial grades of this part.
Do not confuse the F34 package pinout with the F27 package - the 1152-ball F34 has different power pin assignments than the 672-ball F27 used on smaller Arria 10 SX variants. Also, configuration mode selection (AS/PS/FPP/JTAG) is set by MSEL pins which must be tied to specific rails during POR. Designers often overlook the boot source selection between HPS boot (SD/eMMC/QSPI) and FPGA configuration image, which can be sequenced by Quartus Prime's BSP generator.
규정 준수 정보
RoHS status listed as non-compliant in the Hotenda listing for 10AS057H2F34E2LG. REACH, lead-free, halogen-free, and conflict-mineral status were not available in the verified web data and are marked unknown.
