10AS057H2F34I2SG - Arria 10 SX SoC FPGA, 570K LE, Dual A9 | Intel
부품 번호: 10AS057H2F34I2SG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $8500 | $8,500.00 |
| 10 | $8200 | $82,000.00 |
| 100 | $7800 | $780,000.00 |
| 500 | $7400 | $3,700,000.00 |
| 1,000 | $7100 | $7,100,000.00 |
10AS057H2F34I2SG 개요
An SoC FPGA is a heterogeneous computing device that combines general-purpose application processor cores with programmable fabric on a single die, enabling designers to partition workloads between hardware acceleration in the FPGA and software execution on the ARM cores for the lowest possible latency and power. The Arria 10 SX family targets mid-range applications that require both deterministic hardware processing and a rich software stack.
Key specifications for the 10AS057H2F34I2SG include 570K logic elements, dual ARM Cortex-A9 cores with CoreSight, on-chip processor subsystems with peripherals, high-speed transceivers up to 1.5 GHz effective data rate, hardened memory controllers, and the 0.9 V core voltage typical of the 20 nm Arria 10 generation. The industrial temperature grade and -2 speed bin indicate balance between performance and timing margin for non-extended use cases.
Architecturally, the device combines a hard processor system (HPS) with hardened peripherals such as Ethernet MAC, USB, SD/MMC, NAND flash controllers, and DDR memory controllers, all connected to the FPGA fabric via high-bandwidth bridges. The 20 nm process enables higher logic density and lower dynamic power than the previous 28 nm Arria V generation, while maintaining transceivers and DSP blocks suited to wireless infrastructure and video processing.
Typical applications include wireless baseband processing, software-defined radio, radar signal processing, video broadcasting equipment, industrial machine vision, and secure communications. The Arria 10 SX is also widely used in test and measurement and medical imaging systems requiring simultaneous ARM-based control and FPGA-based data plane.
When designing with this device, pay close attention to PCB layout for the FCBGA-1152 package, including microvia stack-up, signal-integrity simulation for 1.5 GHz transceivers, and proper decoupling. Quartus Prime is the primary tool chain; configuration via JTAG, AS, or fast passive parallel modes is supported.
This page synthesizes distributor pricing, same-family Altera Arria 10 SX drop-in alternatives, and design context not present in the standalone datasheet, helping engineers quickly compare and source the part.
드롭인 대체품: 10AS057H2F34I2SG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS057H2F34I2SG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Logic Elements, Mounting Type, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AS057H2F34I2LG
✅ 드롭인✓ 재고 있음
$3675 / 개
데이터시트 보기 →10AS057H2F34I1HG
✅ 드롭인✓ 재고 있음
$4980.3 / 개
데이터시트 보기 →10AS057H2F34E2SG
✅ 드롭인✓ 재고 있음
$3250 / 개
데이터시트 보기 →10AS057H2F34E2LG
✅ 드롭인✓ 재고 있음
$2524.1 / 개
데이터시트 보기 →10AS057H2F34E1HG
✅ 드롭인✓ 재고 있음
$3050 / 개
데이터시트 보기 →10AS057H1F34I1HG
✅ 드롭인✓ 재고 있음
$3500 / 개
데이터시트 보기 →10AS057H1F34E1HG
✅ 드롭인✓ 재고 있음
$3300 / 개
데이터시트 보기 →10AS057H2F34I2SG 최대 정격 & 전기적 특성
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 570000 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum User I/O | 492 |
| 패키지 | 1152-ball FCBGA (F34) |
| Package Dimensions | 35 x 35 mm |
| 실장 유형 | Surface Mount (Flip-Chip BGA) |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | -2 (mid-range) |
| Transceiver Data Rate | Up to 1.5 Gbps (effective) |
| Configuration | JTAG, AS, FPP |
| RoHS 상태 | Compliant |
| Part Number Decoder - I2 | Industrial temperature grade |
| Part Number Decoder - SG | Lead-free, RoHS compliant, Pb-free F34 package |
10AS057H2F34I2SG 35 x 35 mm 핀 구성 가이드
10AS057H2F34I2SG(35 x 35 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AS057H2F34I2SG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AS057H2F34I2SG 적합 용도: 6 애플리케이션s: Wireless Baseband Processing, Software-Defined Radio, Video Broadcasting Infrastructure, Industrial Machine Vision Systems, Radar Signal Processing, Test and Measurement Instrumentation.
Wireless Baseband Processing
The 10AS057H2F34I2SG suits wireless baseband applications thanks to its 570K logic elements for high-throughput DSP pipelines, integrated 1.5 Gbps transceivers for CPRI/OBSAI fronthaul links, and dual ARM Cortex-A9 cores that run the MAC and upper layers while the FPGA fabric accelerates PHY and FEC. The Arria 10 SX SoC architecture reduces latency by eliminating chip-to-chip HPS-to-FPGA bridge interfaces, which is critical for LTE and 5G NR sub-6 GHz radio units.
추천
Software-Defined Radio
The dual ARM Cortex-A9 MPCore in the 10AS057H2F34I2SG runs real-time control stacks, scheduling, and waveform management while the 570K LE fabric executes parallel demodulation, channelization, and digital up/down conversion. Transceivers operating up to 1.5 Gbps aggregate support multi-band RF sampling for tactical and commercial SDR platforms. Quartus Prime DSP Builder and SoC EDS provide a complete development path.
추천
Video Broadcasting Infrastructure
The 570K logic elements of the 10AS057H2F34I2SG provide the resources needed for multi-stream HEVC/AVC encode and decode, video processing pipelines (deinterlacing, scaling, color conversion), and overlay graphics at 4K/60p and beyond. The hard ARM cores manage IP/UDP/SRT/RTP protocol stacks for contribution encoders and decoders, while FCBGA-1152 with 492 I/O supports simultaneous SDI, HDMI, and 10G Ethernet I/O.
추천
Industrial Machine Vision Systems
The 10AS057H2F34I2SG combines high-throughput FPGA logic for image preprocessing and machine-learning inference with an ARM Cortex-A9 dual-core for system control, network connectivity, and HMI rendering. Industrial temperature grading (-40C to +100C) suits factory-floor deployment. Multiple MIPI or LVDS channels aggregated over 492 I/O interfaces with CoaXPress, GigE Vision, or USB3 Vision cameras.
추천
Radar Signal Processing
The 570K LE fabric of the 10AS057H2F34I2SG handles FFT, beamforming, and pulse compression for phased-array radar, while 1.5 Gbps transceivers digitize ADC outputs and feed back digital control. The hard ARM cores run the tracker and display rendering. Industrial temperature and high pin count make it well-suited to airborne, ground-based, and maritime radar systems where deterministic latency matters.
추천
Test and Measurement Instrumentation
The 10AS057H2F34I2SG enables high-end test equipment by combining FPGA-speed data acquisition with ARM-driven display and remote control logic. The 570K LE fabric executes parallel DSP for real-time spectral analysis, protocol decoding, and arbitrary waveform generation, while 1.5 Gbps transceivers feed data from high-speed ADCs/DACs. SoC integration reduces board complexity in oscilloscopes, logic analyzers, and signal analyzers.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS057H2F34I2SG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AS057H2F34I2LG | 10AS057H2F34I1HG | 10AS057H2F34E2SG | 10AS057H2F34E2LG |
|---|---|---|---|---|---|
| Package | 1152-ball FCBGA (F34), 35x35 mm | 1152-ball FCBGA (F34), 35x35 mm - same | 1152-ball FCBGA (F34), 35x35 mm - same | 1152-ball FCBGA (F34), 35x35 mm - same | 1152-ball FCBGA (F34), 35x35 mm - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Logic Elements | 570000 | 570000 | 570000 | 570000 | 570000 |
| Speed Grade | -2 | -2 | -1 (faster) | -2 | -2 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Extended | Extended |
| Lead-free Suffix | SG | LG | HG | SG | LG |
| User I/O | 492 | 492 | 492 | 492 | 492 |
| HPS Revision | H2 | H2 | H2 | H2 | H2 |
주요 차별점
- Highest user I/O among the 570K-LE Arria 10 SX F34 family (vs 10AS057K1F35E1SG)
- Industrial temperature grade with -2 speed balance (vs 10AS057H2F34E2SG)
- Dual-core ARM Cortex-A9 hard processor system integrated (vs 10AS048H2F34I2SG)
설계 노트
The 1152-ball FCBGA at 35x35 mm has a typical theta_JA in the range of 0.4-1.0 C/W with proper thermal design (chip-scale BGA with thermal lid and adequate PCB copper). For industrial temperature operation up to +100C ambient, plan for at least 8-10 W continuous dissipation without airflow. Use the manufacturer's thermal model and follow the package lid-down mounting recommendations in the Arria 10 device datasheet.
Design a high-density PCB stack-up (typically 12-16 layers) with microvia arrays under the BGA for breakout. Pair each high-speed transceiver differential pair with continuous reference ground planes and follow the Arria 10 pin connection guidelines for length matching. Use the Intel/Altera Pin Connection Guidelines document to identify any pins that require specific termination or pull-up resistors.
Verify the HPS (hard processor system) pin multiplex mapping for SD/MMC, USB, EMAC, and NAND before PCB layout - the HPS peripheral I/O assignment differs across Arria 10 SX SKUs. Also confirm Quartus Prime version supports the silicon revision on the part. Configuring SoC FPGA via AS mode requires a compatible EPCQ flash device; consult the Arria 10 Configuration Handbook for supported densities and voltage rails.
규정 준수 정보
Lead-free F34 FCBGA package; SG suffix indicates lead-free and RoHS compliance per Altera/Intel convention. Not AEC-Q100 qualified - choose automotive-grade Arria 10 devices for that requirement.
