10AS057H2F34E2LG - Arria 10 SX SoC FPGA 570K LE, Dual ARM Cortex-A9 | Intel
MPN: 10AS057H2F34E2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3566.3 | $3,566.30 |
| 10 | $3209.67 | $32,096.70 |
| 50 | $2924.35 | $146,217.50 |
| 100 | $2709.97 | $270,997.00 |
| 250 | $2524.1 | $631,025.00 |
Drop-in alternatives for 10AS057H2F34E2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS057H2F34E1HG
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$3050 / Unit
View Datasheet →10AS057H1F34I1HG
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View Datasheet →10AS057H1F34E1HG
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View Datasheet →10AS057H2F34E2LG
✅ Drop-In✓ In Stock
$2524.1 / Unit
View Datasheet →10AS057H4F34E3LG
✅ Drop-In✓ In Stock
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View Datasheet →10AS057H2F34E2LG Maximum Ratings & Electrical Characteristics
| Product Type | System-on-Chip (SoC) FPGA |
| Family | Arria 10 SX |
| Logic Elements | 570,000 |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| Hard Processor Core Clock | 1.5 GHz |
| User I/O Count | 492 |
| Transceiver Channels | 24 (up to 17.4 Gbps backplane) |
| Memory Controller | Hard DDR4 controller |
| PCIe Hard IP | PCI Express Gen3 |
| Core Voltage | 0.9 V |
| Speed Grade | -E2 |
| Package | 1152-ball FCBGA (F34, 35x35 mm) |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | 0C to +100C TJ |
| Configuration | AS / PS / FPP / JTAG |
| RoHS Status | Non-compliant (per Hotenda listing) |
10AS057H2F34E2LG 1152-ball fcbga (f34, 35x35 mm) Pin Configuration Guide
Complete pinout information for 10AS057H2F34E2LG (1152-ball fcbga (f34, 35x35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS057H2F34E2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS057H2F34E2LG is suitable for 6 applications: Wireless Baseband DSP, 4K/8K Video Broadcast Processing, Military Radar and EW Signal Chains, PCIe Gen3 Accelerator Cards, Industrial Machine Vision Frame Grabbers, High-Speed Data Acquisition Backplanes.
Wireless Baseband DSP
The 10AS057H2F34E2LG's 570K logic elements and 24 transceivers running up to 17.4 Gbps make it a strong fit for 4G/5G baseband processing where multiple antenna carriers must be digitized, FFT-processed, and packetized in real time. The hard dual-core 1.5 GHz ARM Cortex-A9 HPS can host the Layer 2/3 protocol stack, offloading deterministic DSP to the FPGA fabric. On-chip DDR4 controller and PCIe Gen3 hard IP eliminate external memory bridge parts.
Recommended
4K/8K Video Broadcast Processing
The 570K-LE fabric supports multi-stream 4K/8K HEVC/AVC pipelines with sub-frame latency budgets under 16 ms. The 1.5 GHz dual-core Cortex-A9 runs control-plane tasks such as NMOS IS-04/05 discovery, while the FPGA fabric handles pixel-rate processing, HDR conversion, and genlocking. The 1152-ball F34 FCBGA package provides the I/O density required for 12G-SDI, HDMI 2.1, and IP ST 2110 gateway cards.
Recommended
Military Radar and EW Signal Chains
The 10AS057H2F34E2LG is well suited for phased-array radar front-end preprocessing, with 24 transceivers capturing wide-bandwidth IF streams and variable-precision DSP blocks implementing pulse compression and CFAR detection. Its 0.9 V core and 20 nm process support extended-temperature operation in ruggedized enclosures, and the hard Cortex-A9 can run the tracker/plot extractor. Designers can extend operating temperature using the -I grade variants of the same F34 footprint.
Recommended
PCIe Gen3 Accelerator Cards
The hard PCIe Gen3 controller plus 24 transceivers and 570K logic elements allow the 10AS057H2F34E2LG to be deployed as a host-facing accelerator for AI inference, database acceleration, or HPC kernels. The Cortex-A9 HPS can manage PCIe enumeration, BAR mapping, and user-space DMA, while the FPGA fabric executes the data-plane workload. The FCBGA-1152 package supports x16 card-edge pinouts on standard PCIe boards.
Recommended
Industrial Machine Vision Frame Grabbers
The 10AS057H2F34E2LG's 492 user I/O support multi-lane Camera Link HS, CoaXPress, and GigE Vision interfaces concurrently, with on-FPGA image preprocessing (debayering, lens correction, ROI extraction) at full sensor rates. The hard Cortex-A9 runs the GenICam/GenTL host stack, and the hard DDR4 controller buffers line-scan data. Industrial customers pair this part with the -I temperature grade variants for harsh environments.
Recommended
High-Speed Data Acquisition Backplanes
The 24 transceiver channels at 17.4 Gbps aggregate data from multiple ADC front-ends across a backplane (e.g. multi-channel oscilloscope digitizers, software-defined radio capture cards). The hard Cortex-A9 HPS can host Linux for SCPI command parsing and USB/Ethernet host interface, while the FPGA fabric implements the deep capture-memory controller and trigger engine. The F34 FCBGA provides the package density for high-pinout backplane connectors.
Recommended
Recommended Products Summary
Engineering reference data for 10AS057H2F34E2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS057H2F34E1HG | 10AS057H1F34I1HG | 10AS057H1F34E1HG | 10AS057H4F34E3LG |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 1152-FCBGA (F34, 35x35 mm) | 1152-FCBGA (F34, 35x35) - same | 1152-FCBGA (F34, 35x35) - same | 1152-FCBGA (F34, 35x35) - same | 1152-FCBGA (F34, 35x35) - same |
| Logic Elements | 570,000 | 570,000 | 570,000 | 570,000 | 570,000 |
| HPS Bin / Speed Grade | H2 / -E2 | H2 / -E1 | H1 / -I1 | H1 / -E1 | H4 / -E3 |
| Hard Processor | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Transceiver Channels | 24 | 24 | 24 | 24 | 24 |
| Transceiver Max Data Rate | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps |
| User I/O | 492 | 492 | 492 | 492 | 492 |
| Operating Temperature Grade | Commercial (0C to +100C TJ) | Industrial | Industrial | Industrial | Commercial |
Key Differentiators
- Higher HPS clock bin (H2) at 1.5 GHz (vs 10AS057H1F34E1HG)
- Mid-tier speed grade (-E2) balance (vs 10AS057H4F34E3LG)
- Commercial temperature grade vs industrial (vs 10AS057H2F34E1HG)
Design Notes
The F34 FCBGA-1152 package with 1.0 mm ball pitch requires a 12+ layer PCB stack-up with microvia-in-pad escape patterns on the top layer. Per the Intel Arria 10 PCB Design Guidelines, place 100 nF decoupling capacitors on every power pin within the BGA field, plus bulk 47 uF to 220 uF polymer caps adjacent to the device. Matched-length impedance control (85 ohm differential for transceivers, 50 ohm single-ended for GPIO) must be verified with the Intel-provided pinout spreadsheet before tape-out.
Estimated: the FCBGA-1152 35x35 mm package has a typical theta_JA in the range of 8-12 C/W with a thermal via array and 1-2 m/s airflow, per the Intel Arria 10 Package User Guide. At full transceiver utilization (24 lanes at 17.4 Gbps) and 80% FPGA utilization, total power can exceed 35 W. A heatsink with thermal interface material and forced-air cooling is recommended; junction-to-ambient must keep junction temperature below 100C for the commercial grade and below 100C for industrial grades of this part.
Do not confuse the F34 package pinout with the F27 package - the 1152-ball F34 has different power pin assignments than the 672-ball F27 used on smaller Arria 10 SX variants. Also, configuration mode selection (AS/PS/FPP/JTAG) is set by MSEL pins which must be tied to specific rails during POR. Designers often overlook the boot source selection between HPS boot (SD/eMMC/QSPI) and FPGA configuration image, which can be sequenced by Quartus Prime's BSP generator.
Compliance Information
RoHS status listed as non-compliant in the Hotenda listing for 10AS057H2F34E2LG. REACH, lead-free, halogen-free, and conflict-mineral status were not available in the verified web data and are marked unknown.
