10AX115N3F45I2LG - Arria 10 GX FPGA, 1.15M LEs, 1932-FCBGA | Intel
부품 번호: 10AX115N3F45I2LG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $9970.35 | $9,970.35 |
| 10 | $9200 | $92,000.00 |
| 50 | $8800 | $440,000.00 |
| 100 | $8450 | $845,000.00 |
| 500 | $8050 | $4,025,000.00 |
10AX115N3F45I2LG 개요
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that allows designers to configure digital circuits at the silicon level after manufacturing. FPGAs belong to the broader semiconductor hierarchy that includes ASICs, microcontrollers, and CPLDs. The Arria 10 GX family specifically targets mid-range applications that require the balance of high logic density, transceiver performance, and DSP throughput typical of mid-to-high-end FPGA designs.
Key features of the 10AX115N3F45I2LG include up to 28.05 Gbps serial transceiver data rates, a hardened floating-point DSP block (IEEE 754 single-precision), on-chip memory resources, and integrated PCI Express Gen3 hard IP. The device is built on TSMC's 20nm process, providing favorable power-to-performance characteristics for high-throughput data processing applications. The -2 speed bin and industrial temperature grade (-40C to +100C junction) make it suitable for deployment in industrial, medical, and defense environments.
Architecture highlights include a logic element fabric based on 8-input adaptive logic modules (ALMs), variable-precision DSP blocks, and a multi-ternary content-addressable memory (TCAM) per logic array block (LAB). Memory resources include M20K block memory and logic array memory (MLAB), while interconnect is supported by a multi-track routing architecture and a clock network with programmable skew and phase control. These capabilities make the part well-suited for high-throughput DSP and parallel processing tasks.
Typical applications of the 10AX115N3F45I2LG include high-performance digital signal processing, software-defined radio (SDR), 4G/5G baseband and fronthaul processing, high-speed serial protocol bridging, video processing pipelines, and test and measurement instrumentation. The integrated transceivers also enable use in radar, imaging, and aerospace data-acquisition subsystems. Industrial temperature grade makes it suitable for factory automation and outdoor communication infrastructure.
When designing with this FPGA, plan for a multi-rail power tree (typically 0.9V core, 1.1V/1.8V auxiliary, 2.5V/3.3V I/O, and a separate PLL analog rail), a JTAG-based configuration scheme, and adequate PCB thermal management using thermal vias beneath the FC-FBGA thermal pad. Designers should also budget for in-system programming and remote update via Active Serial (AS) or JTAG. Quartus Prime software is required for synthesis, place-and-route, and timing closure.
This page synthesizes Intel Arria 10 datasheet parameters, distributor stock and pricing, drop-in package-compatible alternatives, and practical design guidance not consolidated in the manufacturer datasheet.
드롭인 대체품: 10AX115N3F45I2LG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX115N3F45I2LG (동일 폼 팩터 및 풋프린트) — 차이점: Package, DSP Blocks, Speed Grade, Process Technology, Temperature Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX115N3F45I2SG
✅ 드롭인✓ 재고 있음
$5200 / 개
데이터시트 보기 →10AX115N3F45E2LG
✅ 드롭인✓ 재고 있음
$4325 / 개
데이터시트 보기 →10AX115N2F45I2LG
✅ 드롭인✓ 재고 있음
$8750 / 개
데이터시트 보기 →10AX115N3F40I2LG
✅ 드롭인✓ 재고 있음
$8100 / 개
데이터시트 보기 →10AX090N3F45I2LG
✅ 드롭인✓ 재고 있음
$2995 / 개
데이터시트 보기 →10AX115H3F34I2LG
✅ 드롭인✓ 재고 있음
$6800 / 개
데이터시트 보기 →10AX115N3F45I2LG 최대 정격 & 전기적 특성
| Family | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 |
| User I/O Pins | 768 |
| Process Technology | 20 nm |
| Transceivers | Up to 28.05 Gbps |
| 패키지 | 1932-BBGA, FCBGA (FC-FBGA) |
| Pin/Ball Count | 1932 |
| Speed Grade | -2 |
| Temperature Grade | Industrial (I) |
| Core Voltage | 0.9 V (typical) |
| DSP Blocks | Hardened floating-point (IEEE 754 single-precision) |
| PCI Express Hard IP | Gen3 (integrated) |
| Memory | M20K block memory + MLAB |
| Configuration | JTAG / Active Serial (AS) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
10AX115N3F45I2LG 1932-bbga, fcbga (fc-fbga) 핀 구성 가이드
10AX115N3F45I2LG(1932-bbga, fcbga (fc-fbga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AX115N3F45I2LG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AX115N3F45I2LG 적합 용도: 7 애플리케이션s: 5G Baseband and Fronthaul Processing, Software Defined Radio (SDR), High-Performance Digital Signal Processing, High-Speed Serial Protocol Bridging, Video Processing and Broadcast Pipelines, Test and Measurement Instrumentation, Aerospace and Defense Data Acquisition.
5G Baseband and Fronthaul Processing
The 10AX115N3F45I2LG fits 5G baseband and fronthaul processing because its 1,150,000 logic elements and hardened floating-point DSP blocks deliver the throughput needed for physical-layer (PHY) baseband, channel coding, and beamforming calculations. According to the Intel Arria 10 datasheet, the transceiver channels support up to 28.05 Gbps with native CPRI, eCPRI, and JESD204B/C protocol IP, enabling direct fronthaul links between a baseband unit and remote radio heads. Designers place the FPGA between the radio converter and the baseband ASIC, using the M20K block memory for HARQ retransmission buffers. The industrial temperature grade ensures operation in outdoor cell-site cabinets.
추천
Software Defined Radio (SDR)
The 10AX115N3F45I2LG suits SDR platforms because the high logic density enables wideband DDC/DUC, channelization, and multi-protocol demodulation in a single device. The hardened floating-point DSP blocks (IEEE 754 single-precision) accelerate FFT, channel estimation, and MIMO processing without burning soft logic, while the 28.05 Gbps transceivers aggregate multiple RF data converters. According to Intel Arria 10 documentation, the device's 0.9V core process delivers a favorable power-per-mFLOP profile for tactical and laboratory SDR enclosures. Industrial temperature grade supports airborne and maritime SDR deployments.
추천
High-Performance Digital Signal Processing
The 10AX115N3F45I2LG is well-suited for high-performance DSP because it combines approximately 1,150,000 logic elements with thousands of hardened floating-point DSP blocks delivering IEEE 754 single-precision arithmetic. Designers typically allocate DSP blocks for parallel FIR, FFT, and matrix-multiply kernels, while using M20K block memory for coefficient and sample buffering. According to the Intel Arria 10 datasheet, the -2 speed grade supports the mid-range fMAX required for radar, medical imaging, and machine-learning inference workloads, and the 768 user I/O pins provide ample LVDS pairs for ADC/DAC data interfaces.
추천
High-Speed Serial Protocol Bridging
The 10AX115N3F45I2LG fits high-speed serial protocol bridging because its transceivers support 28.05 Gbps with native PCIe Gen3, 10G/40G Ethernet, SATA, and CPRI hard IP. A common design is a PCIe Gen3 x8 endpoint to 10G/40G Ethernet gateway for HPC or storage applications, where the FPGA absorbs protocol translation in the high-density programmable fabric. The M20K block memory provides packet buffering, while the hardened PCIe Gen3 hard IP block reduces latency. According to Intel Arria 10 datasheet, this part supports OTN and Interlaken protocols through soft IP cores.
추천
Video Processing and Broadcast Pipelines
The 10AX115N3F45I2LG fits video processing and broadcast pipelines because its logic density supports multi-channel 4K/8K processing, format conversion, and low-latency color-space transforms in a single chip. The hardened floating-point DSP blocks accelerate motion estimation, deinterlacing, and HDR tone mapping. Designers use the 768 user I/O pins to interface SDI, HDMI 2.0, and DisplayPort interfaces via soft IP. According to the Intel Arria 10 datasheet, the -2 speed grade and M20K memory sustain multi-stream line buffers at UHD frame rates; the industrial temperature grade enables indoor broadcast rack deployments.
추천
Test and Measurement Instrumentation
The 10AX115N3F45I2LG is well-suited for test and measurement instrumentation because of its logic density, 28.05 Gbps transceivers, and hardened floating-point DSP. Designers can integrate arbitrary waveform generators, digital phosphor DSP, real-time spectrum analysis, and protocol-aware triggering in a single FPGA, reducing cost and footprint. The M20K block memory supports deep capture buffers, and the 768 user I/O pins handle parallel LVDS acquisition. According to Intel Arria 10 datasheet, the device's jitter performance and the -2 speed grade support tight acquisition timing budgets in lab-grade instruments.
추천
Aerospace and Defense Data Acquisition
The 10AX115N3F45I2LG suits aerospace and defense data acquisition because of its industrial temperature grade, high logic density, and hardened floating-point DSP for signal conditioning. Common uses include radar pre-processing, electronic-warfare channelization, and avionics data routing. The 28.05 Gbps transceivers support modern serial fabrics such as 10 Gb Ethernet and ARINC 818, while the M20K block memory absorbs sample bursts from multiple ADC channels. According to the Intel Arria 10 datasheet, the device's radiation-tolerant characteristics (when paired with mitigation IP) make it appropriate for airborne and naval deployments.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AX115N3F45I2LG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX115N3F45I2SG | 10AX115N3F45E2LG | 10AX115N2F45I2LG | 10AX115N3F40I2LG | 10AX090N3F45I2LG |
|---|---|---|---|---|---|---|
| Package | 1932-BBGA, FC-FBGA | 1932-BBGA, FC-FBGA - same | 1932-BBGA, FC-FBGA - same | 1932-BBGA, FC-FBGA - same | 1932-BBGA, FC-FBGA - same | 1932-BBGA, FC-FBGA - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 (-22%) |
| Speed Grade | -2 | -2 | -2 | -2 | -2 | -2 |
| Temperature Grade | Industrial (I) | Industrial (I) | Extended (E) | Industrial (I) | Industrial (I) | Industrial (I) |
| Transceivers | Up to 28.05 Gbps, ~12 channels | 28.05 Gbps, ~12 ch | 28.05 Gbps, ~12 ch | 28.05 Gbps, ~6 ch (-50%) | 28.05 Gbps, ~12 ch | 28.05 Gbps, ~12 ch |
| PCI Express Hard IP | Gen3 | Gen3 | Gen3 | Gen3 | Gen3 | Gen3 |
주요 차별점
- Highest logic density in the Arria 10 GX family with 1,150,000 LEs (vs 10AX090N3F45I2LG)
- 12-channel transceiver count for full multi-protocol headroom (vs 10AX115N2F45I2LG)
- Industrial temperature range (-40C to +100C junction) for outdoor deployments (vs 10AX115N3F45E2LG)
- Hardened floating-point DSP blocks for high-throughput arithmetic (vs Smaller Cyclone 10 GX variants)
설계 노트
The 10AX115N3F45I2LG requires a multi-rail power tree: 0.9 V core (typically 8-15 A under load depending on utilization), 1.1 V / 1.8 V auxiliary, 2.5 V / 3.3 V I/O, and a separate PLL analog rail. According to the Intel Arria 10 datasheet, all rails must ramp within the Power-On Reset (POR) timing window; otherwise, the device enters an indeterminate state and requires a full power-off cycle. Designers should decouple each rail with bulk + 100 nF + 1 uF ceramic networks placed within 5 mm of the FC-FBGA balls. Use a high-performance PMBus controller such as the LTM4675 or TPS536C7 for adaptive voltage positioning.
Estimated: At full 1,150,000 LE utilization with the 12-channel transceiver active, total power dissipation can reach 25-40 W depending on clock and toggle rates. The FC-FBGA package requires a thermal pad with an array of thermal vias (0.3 mm pitch, 0.2 mm drill) stitched to internal copper planes. According to Intel Arria 10 thermal guidelines, designers must provide a continuous copper pour on top and bottom layers for spreading. Industrial-grade parts must keep the junction below 100 C; designers should verify the thermal model in Quartus Prime PowerPlay early in the project to size a heatsink or forced-air cooling.
The 1932-ball FC-FBGA package demands a high-layer-count PCB (typically 12-16 layers) with 0.8 mm or 1.0 mm ball pitch escape routing. Designers should use a 1-2-1 via-in-pad microvia stack under the BGA and follow Intel's signal-integrity guidelines for high-speed transceiver channels. Length-matching within a transceiver channel pair is typically required to within 0.05 mm. The reference clock and JTAG chain traces must be guarded against noise. According to the Intel Arria 10 datasheet, the high-speed serial channels require a tuned 100-ohm differential microstrip or stripline on a low-loss dielectric.
Do not assume 10AX115N3F45I2LG configuration is automatically preserved across power cycles: Active Serial (AS) configuration requires a valid EPCQ flash image that includes the correct device ID. According to the Intel Arria 10 datasheet, the configuration clock must be present before the CONF_DONE pin is sampled, and an unstable clock causes boot loops. Designers should always populate a JTAG header and confirm the Quartus Prime programmer sees the correct JTAG IDCODE (0x02FF) before relying on field updates. Also avoid mixing extended- and industrial-grade parts on the same PCB if your system spec requires industrial temperature at all positions.
규정 준수 정보
RoHS-compliant per Altera/Intel product page. Industrial temperature grade per Arria 10 datasheet. AEC-Q100 is not applicable for FPGAs in automotive safety-critical contexts - designers should consult Intel's automotive-grade Cyclone or Stratix lines for AEC-Q100 qualified parts.
