10AX115N3F45I2SG - Arria 10 GX 1.15M LE FPGA | Intel | 1932-FCBGA
부품 번호: 10AX115N3F45I2SG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $7527.11 | $7,527.11 |
| 10 | $7100 | $71,000.00 |
| 100 | $6500 | $650,000.00 |
| 500 | $5800 | $2,900,000.00 |
| 1,000 | $5200 | $5,200,000.00 |
10AX115N3F45I2SG 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O behavior are configured by the user after manufacture. Within the broader semiconductor taxonomy, an FPGA sits between general-purpose CPUs/GPUs and fixed-function ASICs, occupying the hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit. Arria 10 GX devices target mid-range, transceiver-rich applications by combining programmable logic with hardened memory controllers, variable-precision DSP blocks, and up to 24 Gbps multi-gigabit transceivers, balancing performance, power efficiency, and integration for communication, broadcast, and compute-acceleration workloads.
Key features of the 10AX115N3F45I2SG include 1,150,000 logic elements (LEs), 68,857,856 embedded memory bits, 2,738 18x19 multipliers, 24 Gbps transceivers, and hardened PCI Express Gen3 and 10 Gigabit Ethernet MAC IP blocks. The 1932-pin FCBGA package exposes 768 user I/Os and supports high-speed serial interfaces such as 10/25/40/100 Gigabit Ethernet and Interlaken, enabling single-chip connectivity for line-card and backplane designs.
The Arria 10 architecture pairs a fine-grained LE fabric with column-based variable-precision DSP blocks and 20-bit, 2,000 MSPS hardened floating-point multipliers, allowing efficient implementation of FFTs, FIR filters, and matrix-math kernels. 12.5 Gbps backplane-capable transceivers and 1,866 MHz DDR4 external memory interfaces reduce system BOM cost by removing external PHY components in many designs.
Typical applications include 100G line-card packet processing, wireless baseband aggregation, video broadcast processing, high-performance computing acceleration, and test and measurement equipment. The -I2 industrial speed grade and FC-FBGA thermal envelope make the device suitable for forced-air-cooled chassis without exotic thermal management.
When designing with the 10AX115N3F45I2SG, use Intel Quartus Prime for synthesis, place-and-route, and timing closure. Allocate at least 6 PCB layers with continuous GND planes and follow Intel's pinout-aware power-delivery network guidelines to keep transceiver jitter within mask. Industrial-grade devices with the -I2 speed grade meet 100C junction temperature for extended-temperature chassis.
This page synthesizes distributor pricing, drop-in Arria 10 alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: 10AX115N3F45I2SG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX115N3F45I2SG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Temperature Grade, DSP Blocks, Transceivers, Core Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX115N3F45I2LG
✅ 드롭인✓ 재고 있음
$8050 / 개
데이터시트 보기 →10AX115N3F45E2SG
✅ 드롭인✓ 재고 있음
$3100 / 개
데이터시트 보기 →10AX115N2F45I2SG
✅ 드롭인✓ 재고 있음
$5760 / 개
데이터시트 보기 →10AX115N3F45I1SG
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10AX115N3F45E1SG
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10AX115N2F45I2LG
✅ 드롭인✓ 재고 있음
$8750 / 개
데이터시트 보기 →10AX115N3F45I2SG 최대 정격 & 전기적 특성
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory Bits | 68,857,856 |
| User I/Os | 768 |
| Number of Logic Blocks/Cells | 1,150,000 |
| Total RAM Bits | 68,857,856 |
| Supply Voltage Core | 0.85 V to 0.95 V |
| Process Technology | 20 nm |
| 동작 온도 | -40C to +100C (industrial) |
| Speed Grade | I2 (industrial) |
| 패키지 | 1932-BBGA, FC-FBGA |
| 핀 수 | 1932 |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Transceivers | Up to 24 Gbps multi-gigabit |
| DSP Blocks | Variable-precision DSP (number per datasheet) |
10AX115N3F45I2SG 1932-bbga, fc-fbga 핀 구성 가이드
10AX115N3F45I2SG(1932-bbga, fc-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AX115N3F45I2SG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AX115N3F45I2SG 적합 용도: 6 애플리케이션s: 100G Line-Card Packet Processing, Wireless Baseband Aggregation, Video Broadcast Processing, High-Performance Computing Acceleration, Test and Measurement Equipment, Industrial Imaging and Machine Vision.
100G Line-Card Packet Processing
The 10AX115N3F45I2SG's 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 768 user I/Os make it an excellent single-chip solution for 100G Ethernet line-card processing. Its N3 transceiver tier supports up to 24 Gbps multi-gigabit links, enabling direct connection to QSFP28 optics and backplane SERDES without external PHYs. The hardened 100G Ethernet MAC IP block removes thousands of LEs from the packet pipeline, while 2,738 18x19 multipliers accelerate classification and QoS computations. Designers typically place the FPGA between the network processor and switch fabric, with DDR4 external memory interfaces absorbing bursty traffic.
추천
Wireless Baseband Aggregation
In 4G/5G baseband units, the 10AX115N3F45I2SG handles CPRI and OBSAI fronthaul aggregation across dozens of radios. The 20nm process and variable-precision DSP block deliver FFT/iFFT kernels at lower power than prior Arria generations, while the 1932-FCBGA package supports the dense SERDES I/O required for multiple CPRI links. Industrial-grade I2 screening to +100C junction allows deployment in outdoor-rated cabinets with forced-air cooling. The 768 user I/Os also interface to backhaul Ethernet and timing synchronization chips.
추천
Video Broadcast Processing
The 10AX115N3F45I2SG powers broadcast routers and video processing engines requiring real-time 4K/UHD frame manipulation, HDR tone mapping, and multi-stream transcoding. Its 1,150,000 LEs handle multi-channel SDI de/embedding and audio shuffling in parallel, while the embedded memory bandwidth sustains multi-gigapixel frame buffers. The 768 I/Os accommodate HDMI 2.0, 12G-SDI, and DisplayPort interfaces simultaneously. Quartus Prime IP libraries provide SMPTE ST 2059, ST 2022, and ST 2110 support, accelerating broadcast system integration.
추천
High-Performance Computing Acceleration
The 10AX115N3F45I2SG accelerates compute kernels in HPC and financial workloads by mapping matrix multiplication, compression, and encryption algorithms onto its variable-precision DSP fabric. 2,738 18x19 multipliers deliver high TFLOPS-per-watt efficiency, while 1,866 MHz DDR4 controllers feed the engines with line-rate data. Hardened PCI Express Gen3 IP provides a low-latency host interface for CPU offload cards. The FC-FBGA thermal envelope supports passive and forced-air cooling in standard 1U/2U chassis.
추천
Test and Measurement Equipment
Instruments such as oscilloscopes, signal analyzers, and protocol testers leverage the 10AX115N3F45I2SG's combination of high logic density, generous embedded memory, and 24 Gbps transceivers to capture and process multi-channel waveforms in real time. The 768 I/Os interface to high-speed ADCs and DACs, while hardened PCI Express Gen3 streams data to host processors. Industrial-grade screening and the FC-FBGA thermal envelope allow operation in laboratory and field-deployed instruments. Quartus Prime DSP Builder accelerates development of FFT, modulation, and demodulation kernels.
추천
Industrial Imaging and Machine Vision
The 10AX115N3F45I2SG powers multi-camera industrial inspection lines, where its 1,150,000 LEs and 68,857,856 memory bits process gigapixel-per-second image streams from CoaXPress, Camera Link, and 10 GigE Vision interfaces. The hardened 10G Ethernet MAC and 24 Gbps transceivers connect directly to industrial cameras without external PHYs, while variable-precision DSP blocks accelerate defect detection, OCR, and convolutional filter pipelines. The industrial -40C to +100C junction rating and 1932-FCBGA package support deployment on factory floors.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AX115N3F45I2SG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX115N3F45I2LG | 10AX115N3F45E2SG | 10AX115N2F45I2SG | 10AX115N3F45I1SG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-BBGA, FC-FBGA | 1932-BBGA, FC-FBGA | 1932-BBGA, FC-FBGA | 1932-BBGA, FC-FBGA | 1932-BBGA, FC-FBGA |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Embedded Memory Bits | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 |
| Speed Grade | I2 (industrial) | I2 (industrial) | E2 (extended) | I2 (industrial) | I1 (industrial) |
| Transceiver Tier | N3 (up to 24 Gbps) | N3 (up to 24 Gbps) | N3 (up to 24 Gbps) | N2 (lower transceiver count/speed) | N3 (up to 24 Gbps) |
| User I/Os | 768 | 768 | 768 | 768 | 768 |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Operating Temperature | -40C to +100C | -40C to +100C | 0C to +100C (extended) | -40C to +100C | -40C to +100C |
주요 차별점
- Highest-density Arria 10 GX member with 1.15M LEs (vs 10AX115N2F45I2SG)
- Industrial -40C to +100C junction rating (vs 10AX115N3F45E2SG)
- Tape-and-reel packaging optimized for SMT (vs 10AX115N3F45I2LG)
설계 노트
Estimated: at 0.9V core and ~25A core current, the 10AX115N3F45I2SG dissipates roughly 22.5W in the core. With the FC-FBGA package, follow Intel's thermal model and provide at least 1 oz copper on inner layers plus a heat sink or thermal interface material for chassis above 5W total dissipation. Industrial I2 grade supports up to +100C junction with adequate airflow.
Use a minimum 6-layer PCB with continuous GND planes and a dedicated transceiver power island. Place decoupling capacitors as close as possible to each ball row, following Intel's pinout-aware PDN guidelines. Reference the Arria 10 device pin connection guidelines for unused-pin tie-off and bank VCCIO configuration to avoid contention during configuration.
Maintain 100-ohm differential impedance on all transceiver pairs and route lengths within the tolerances in the Arria 10 datasheet. Use HyperLynx or SiSoft QCD for channel simulation, and ensure connector break-out regions keep stubs below 200 mils. For 10/25G and CPRI links, place AC-coupling capacitors within 1 cm of the receiver pins to meet eye-mask requirements.
Common pitfalls include omitting the CFGBVS or MSEL[3:0] strap resistors, which causes configuration failure; using the wrong Quartus Prime device variant, which produces bitstream CRC errors; and relying on default pull-ups for JTAG TCK/TMS in noisy environments. Always regenerate the .sof with the correct device pinout file and verify using JTAG chain-scan before live configuration.
규정 준수 정보
RoHS and lead-free compliance confirmed on the official Intel (Altera) product page. Halogen-free status not explicitly stated in the verified web data.
