10M25DAF484C7G - MAX 10 FPGA 25K LE, 484-BGA | Intel
부품 번호: 10M25DAF484C7G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $62.02 | $62.02 |
| 10 | $56.18 | $561.80 |
| 100 | $48.95 | $4,895.00 |
| 250 | $44.2 | $11,050.00 |
| 1,000 | $38.5 | $38,500.00 |
10M25DAF484C7G 개요
A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by programmable interconnect, designed to implement arbitrary digital logic after PCB assembly. Within the broader programmable logic taxonomy, FPGAs sit above CPLDs in density and below ASICs in NRE cost, making them ideal for low-to-medium volume designs. The MAX 10 family specifically targets non-volatile integration by embedding configuration flash on-die, eliminating the external boot PROM traditionally required by SRAM-based FPGAs.
Key features of the 10M25DAF484C7G include 25K logic elements (LEs), 1,728 Kbits of embedded SRAM, 66 dedicated 18x18 hardware multipliers, four general-purpose PLLs, and integrated dual-configuration flash supporting instant-on and remote update. The 484-BGA package supports industrial temperature grades and is Pb-free / RoHS compliant per Intel's MAX 10 device family datasheet. Compared with discrete MCU + CPLD implementations, MAX 10 consolidates glue logic, custom state machines, and sensor interfacing into a single device.
The MAX 10 architecture combines a fabric of adaptive logic modules (ALMs) with embedded hard IP, including the 12-bit successive-approximation ADC, voltage and temperature monitors, and a user flash memory (UFM) block for non-volatile parameter storage. This hardware integration reduces BOM cost and PCB area for industrial motor control, video bridging, and I/O expansion designs.
Typical applications include industrial machine vision, motor and motion control, I/O expansion and protocol bridging, automotive driver-assistance subsystems, and consumer electronics requiring custom logic glue. The 484-BGA footprint provides sufficient I/O headroom for designs aggregating multiple buses such as Ethernet, USB, and parallel RGB video.
When designing with this part, verify that PCB footprint and ball map match the F484 BGA standard (23x23 mm, 1.0 mm pitch per MAX 10 datasheet package specifications). The Quartus Prime design suite supports the device from Lite Edition onwards for compilation, place-and-route, and on-chip debugging via JTAG.
This page synthesizes distributor pricing, drop-in alternatives from the same MAX 10 family, and practical Quartus Prime design notes not found in a single manufacturer table.
드롭인 대체품: 10M25DAF484C7G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M25DAF484C7G (동일 폼 팩터 및 풋프린트) — 차이점: Package, PLLs, Operating Temperature, Configuration Memory, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M25DAF484A7G
✅ 드롭인✓ 재고 있음
$52.75 / 개
데이터시트 보기 →10M25DAF484A7P
✅ 드롭인✓ 재고 있음
$54.75 / 개
데이터시트 보기 →10M25DCF484C8G
✅ 드롭인✓ 재고 있음
$42.1 / 개
데이터시트 보기 →10M16DAF484C7G
✅ 드롭인✓ 재고 있음
$55.5 / 개
데이터시트 보기 →10M16DCF484C7G
✅ 드롭인✓ 재고 있음
$31.8 / 개
데이터시트 보기 →10M08DAF484C8G
✅ 드롭인✓ 재고 있음
$27.65 / 개
데이터시트 보기 →10M08DAF484C7G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10M25DAF484C7G 최대 정격 & 전기적 특성
| Series | MAX 10 |
| Logic Elements (LE) | 25,000 |
| Embedded Memory (M9K blocks) | 1,728 Kbit |
| Embedded 18x18 Multipliers | 66 |
| User I/O Pins (max) | 360 |
| 패키지 | 484-BGA (F484) |
| 실장 유형 | Surface Mount (BGA) |
| On-chip Configuration Flash | Dual-configuration (instant-on, remote update) |
| Hard IP: ADC | 12-bit, 1 MSPS, 16-channel (MAX 10 family) |
| PLLs | 4 general-purpose |
| Global Clocks | 20 |
| On-chip Temperature Sensor | Yes |
| 동작 온도 | 0C to +85C (commercial) |
| RoHS 상태 | Compliant |
| Design Tool | Intel Quartus Prime (Lite / Standard / Pro) |
10M25DAF484C7G 484-bga (f484) 핀 구성 가이드
10M25DAF484C7G(484-bga (f484) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10M25DAF484C7G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10M25DAF484C7G 적합 용도: 7 애플리케이션s: Industrial Motor Control, Video Bridging and Display Aggregation, PLC I/O Expansion and Protocol Bridging, Machine Vision Frame Grabber, Automotive Driver-Assistance Subsystems, Industrial IoT Edge Gateway, Test and Measurement Instrumentation.
Industrial Motor Control
The 10M25DAF484C7G is well suited for multi-axis industrial motor control designs requiring simultaneous PWM generation, encoder feedback processing, and field-oriented control (FOC) loops. With 66 embedded 18x18 multipliers, the device implements FOC and space-vector PWM in hardware without external DSP chips, and the 360 user I/Os aggregate multiple encoder interfaces, gate-driver signals, and communication peripherals. The integrated 12-bit ADC samples current and voltage feedback at 1 MSPS directly, eliminating an external ADC and reducing BOM cost. The dual-configuration flash supports instant-on safety logic with the ability to fail-over to a backup image during in-field firmware updates.
추천
Video Bridging and Display Aggregation
The 10M25DAF484C7G bridges legacy video interfaces (parallel RGB, BT.656, LVDS display panels) to modern MIPI or HDMI outputs in industrial HMI and digital signage applications. Its 25K logic elements implement color-space conversion, chroma resampling, and frame-buffer management, while the 1,728 Kbit embedded block RAM holds 2-3 lines of video for scaling and de-interlacing. The 484-BGA package exposes 360 I/Os which easily accommodate 24-bit parallel RGB plus control signals and a high-speed LVDS display link. MAX 10's on-chip temperature sensor enables thermal throttling of the backlight driver without an external MCU.
추천
PLC I/O Expansion and Protocol Bridging
In PLC and industrial I/O subsystems, the 10M25DAF484C7G acts as a protocol bridge between fieldbus networks (Modbus, EtherCAT, Profibus) and backplane buses or Ethernet uplinks. The 360 I/Os accommodate 32+ isolated digital inputs, 16 analog channels, and multiple SPI/I2C peripherals in parallel without external muxing. Hardened IP like the on-chip ADC and temperature sensor reduce external analog components, and the dual-configuration flash enables secure remote firmware updates required by industrial cybersecurity standards such as IEC 62443. Quartus Prime supports a wide range of soft IP cores (EtherCAT slave, PROFINET, Modbus TCP) ready to instantiate.
추천
Machine Vision Frame Grabber
The 10M25DAF484C7G ingests parallel image-sensor data from MIPI CSI-2 or sub-LVDS camera links and converts it to USB3 Vision or GigE Vision for PC-based inspection. With 66 hardware multipliers, the FPGA can run Sobel, Laplacian, and threshold preprocessing directly in fabric, offloading the host CPU. The 1,728 Kbit block RAM holds full image lines at 1080p resolution, and the 360 I/Os capture 10-bit or 12-bit raw Bayer data from the sensor alongside GPIO for strobe and trigger synchronization. The device's instant-on capability boots the frame grabber within milliseconds, ideal for high-throughput automated optical inspection (AOI) lines.
추천
Automotive Driver-Assistance Subsystems
The 10M25DAF484C7G implements sensor-fusion glue logic for ADAS subsystems aggregating ultrasonic, camera, and radar pre-processed data. Its non-volatile configuration eliminates boot-PROM failure modes in vibration-prone automotive environments. The 360 I/Os handle multiple CAN-FD or LIN buses plus parallel sensor data, while the embedded ADC and temperature sensor support battery-voltage and thermal monitoring. For AEC-Q100 qualified deployments, the I-grade variant 10M25DAF484I7G (-40C to +100C) provides the necessary automotive temperature range.
추천
Industrial IoT Edge Gateway
The 10M25DAF484C7G serves as a low-power edge gateway aggregating Modbus, CAN, I2C sensor data and forwarding over Ethernet or Wi-Fi via an external transceiver. The 25K LE fabric runs lightweight TLS termination and edge-analytics state machines, while 1,728 Kbit block RAM buffers packet bursts before forwarding. Dual-configuration flash enables secure OTA updates and failsafe rollback, critical for unattended remote installations. The on-chip ADC monitors supply rails and battery state, and the temperature sensor enables predictive maintenance telemetry without extra components.
추천
Test and Measurement Instrumentation
In bench-top T&M equipment such as protocol analyzers and logic analyzers, the 10M25DAF484C7G provides pattern generation, capture, and protocol decoding. The 25K LEs handle USB, I2C, SPI, UART, and parallel bus decoding simultaneously, while the 360 I/Os connect to high-pin-count probe heads. The 1,728 Kbit block RAM buffers deep acquisition traces at hundreds of MHz, and the 66 hardware multipliers accelerate FFT-based signal analysis on captured waveforms. Quartus Prime's SignalTap embedded logic analyzer provides real-time visibility into internal nodes without external test equipment.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10M25DAF484C7G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M25DAF484A7G | 10M25DCF484C8G | 10M16DAF484C7G | 10M08DAF484C7G |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel |
| Package | 484-BGA (F484) | 484-BGA (F484) | 484-BGA (F484) | 484-BGA (F484) | 484-BGA (F484) |
| Logic Elements | 25,000 | 25,000 | 25,000 | 16,000 | 8,000 |
| User I/O (max) | 360 | 360 | 360 | 320 | 250 |
| Configuration Flash | Dual (instant-on, remote update) | Dual (instant-on, remote update) | Dual (instant-on, remote update) | Dual (instant-on, remote update) | Dual (instant-on, remote update) |
| Speed Grade | C7 | A7 | C8 | C7 | C7 |
주요 차별점
- Highest-density MAX 10 in F484 BGA at C7 speed grade (vs 10M25DCF484C8G)
- Maximum I/O count in the MAX 10 family at 484-BGA (vs 10M16DAF484C7G)
- Non-volatile instant-on vs SRAM-based Cyclone FPGAs (vs Cyclone IV EP4CE30F484 (similar density, SRAM-based))
설계 노트
The 484-ball F484 BGA has a 1.0 mm ball pitch and 23x23 mm body per the MAX 10 device datasheet package specifications. PCB design requires laser-drilled microvias or via-in-pad technology for signal breakouts; ensure the PCB stack-up supports at least 4-6 routing layers with buried capacitance for power integrity. Decoupling: place 100 nF X7R 0402 capacitors within 2 mm of every power pin, with 4.7 uF bulk capacitors at each supply rail (VCCINT, VCCA, VCCIO banks) as recommended in the MAX 10 hardware design guide.
Estimated: at full logic utilization (~85%) with all 66 multipliers active at 200 MHz, typical core power consumption is approximately 1.5 W. The F484 BGA with bottom-side thermal balls requires a thermal pad soldered to a copper pour on the top layer; with proper thermal vias to inner ground planes, junction-to-ambient thermal resistance (theta_JA) is approximately 15-20 C/W, giving 25-30 C rise above ambient. For enclosed industrial designs without airflow, verify thermal performance with the Quartus Prime PowerPlay early power estimator before committing to layout.
Do not assume pinout compatibility between different MAX 10 packages - the 256-BGA, 324-BGA, and 484-BGA packages have different ball maps despite sharing the same family. When migrating between densities (e.g., 10M25 to 10M16 or 10M08) within F484 BGA, verify that I/O bank assignments match in Quartus Prime pin planner; unused pins in lower-density variants are documented as 'Do Not Connect' or 'Reserved' and may differ electrically. Always regenerate the .sof/.pof programming file after a density migration even if logic content is identical.
Differential pair routing (LVDS) on the MAX 10 requires matched-length traces within 20 mils per the MAX 10 handbook. Place external clock reference crystals within 5 mm of CLK pins with guard traces on either side to minimize jitter. JTAG chain order must follow the Quartus Prime device programmer settings; multi-device JTAG chains require TMS and TCK buffering to maintain signal integrity beyond 4 devices.
규정 준수 정보
RoHS compliant per Intel MAX 10 product page. The C7 suffix denotes commercial temperature grade (0-85C); for AEC-Q100 automotive deployments use I-grade variant 10M25DAF484I7G.
