10M16DAF256C7G - MAX 10 FPGA, 16K LE, 256-LBGA | Intel / Altera
부품 번호: 10M16DAF256C7G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $23.5 | $23.50 |
| 10 | $21.4 | $214.00 |
| 100 | $19.2 | $1,920.00 |
| 500 | $17.05 | $8,525.00 |
| 1,000 | $15.4 | $15,400.00 |
| 2,500 | $13.8 | $34,500.00 |
10M16DAF256C7G 개요
A Field-Programmable Gate Array (FPGA) is a programmable logic device that allows engineers to implement custom digital logic, glue logic, state machines, and parallel processing functions after PCB fabrication. FPGAs sit hierarchically within digital logic ICs -> programmable logic -> PLD -> programmable logic device -> integrated circuit, and are commonly used alongside microcontrollers and ASICs in modern embedded systems. The MAX 10 family is Altera/Intel's low-cost, non-volatile small-form-factor line targeting industrial, automotive, and consumer applications.
Key features of the 10M16DAF256C7G include 16K logic elements, an integrated ADC, 178 maximum user I/O pins, and dual supply operation (single 3.3V VCCIO or dual 1.2V core + 3.3V I/O). The device also embeds configuration flash, a JTAG interface, and supports the Quartus Prime design toolchain. The F256 LBGA package provides a compact 17x17 mm footprint suitable for space-constrained embedded boards.
Architecturally, the MAX 10 uses a 4-input LUT fabric with embedded RAM blocks (M9K), 18x18 hardware multipliers, and dedicated user flash memory (UFM). The dual-configuration flash enables fail-safe field updates, while the integrated analog-to-digital converter (ADC) supports up to 12-bit conversion for sensor interfacing and system health monitoring.
Typical applications include industrial I/O expansion, factory automation controllers, motor drive glue logic, communication protocol bridging (I2C/SPI/UART to Ethernet), and low-volume ASIC replacement. The integrated flash and ADC make it attractive for cost-sensitive designs where the FPGA must boot instantly without external memory.
When designing with this part, pay attention to the F256 BGA ball pattern - PCB land pattern verification and X-ray or BGA rework capability are required for prototype assembly. The Quartus Prime design suite must be used for synthesis, place-and-route, and timing closure, and designers should review the MAX 10 pin connection guidelines for unused-pin termination.
This page synthesizes distributor pricing, same-package drop-in alternatives from the MAX 10 family, and practical design notes not found in the manufacturer datasheet, helping engineers quickly evaluate the 10M16DAF256C7G against functionally equivalent parts for sourcing decisions.
드롭인 대체품: 10M16DAF256C7G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M16DAF256C7G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Logic Elements (LE), Process Technology, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M16DAF256C8G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10M16DAF256A7G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10M16DAF256I7G
✅ 드롭인✓ 재고 있음
$38.4 / 개
데이터시트 보기 →10M08DAF256C7G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$7.95 / 개
데이터시트 보기 →10M25DAF256C7G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$38.75 / 개
데이터시트 보기 →10M16DAF256C7G 최대 정격 & 전기적 특성
| Product Family | MAX 10 |
| Logic Elements (LE) | 16000 |
| Maximum User I/O | 178 |
| Embedded Memory Bits | 562176 (549 Kbit) |
| Embedded RAM Blocks | M9K, 69 blocks (per family datasheet) |
| Configuration Memory | Dual-configuration flash (non-volatile) |
| 패키지 | 256-LBGA (F256), 17x17 mm |
| Integrated ADC | Yes, 12-bit SAR (per MAX 10 family) |
| Supply Voltage - Core | 1.2 V (dual-supply variants) |
| Supply Voltage - I/O | 3.3 V (or LVCMOS 1.2-3.3 V per bank) |
| 동작 온도 | 0C to +85C (C7G suffix = commercial) |
| Speed Grade | 7 |
| RoHS 상태 | Compliant |
| 실장 유형 | Surface Mount (BGA) |
| MSL 레벨 | 3 (per JEDEC J-STD-020, BGA package) |
10M16DAF256C7G 256-lbga (f256), 17x17 mm 핀 구성 가이드
10M16DAF256C7G(256-lbga (f256), 17x17 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10M16DAF256C7G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10M16DAF256C7G 적합 용도: 7 애플리케이션s: Industrial I/O Expansion & Protocol Bridging, Factory Automation Motor Drive Glue Logic, Low-Volume ASIC Replacement, Communication Protocol Bridge (SPI/I2C to UART/Ethernet), LED Video Wall Timing & Pixel Driver, Test & Measurement Instrument Front-End, Consumer Device I/O Hub.
Industrial I/O Expansion & Protocol Bridging
The 10M16DAF256C7G's 178 user I/O pins and 16K logic elements make it a cost-effective solution for industrial I/O expansion modules that bridge legacy protocols (RS-485, SPI, I2C, parallel bus) to modern Ethernet or USB interfaces. The integrated 12-bit ADC eliminates an external ADC IC for sensor monitoring of temperature, voltage, and current on the same board. Compared with discrete glue-logic ASICs, the MAX 10 instant-on flash and Quartus Prime toolchain reduce BOM cost and design risk. Recommend pairing with a TI DP83826 industrial Ethernet PHY or Microchip LAN9252 EtherCAT controller for protocol bridging applications.
추천
Factory Automation Motor Drive Glue Logic
The 10M16DAF256C7G is well-suited for motor drive glue logic in factory automation, handling PWM generation, encoder quadrature decoding, and safety interlocks between a host MCU and the power stage. Its 562 Kbit of block RAM supports lookup tables for sinusoidal commutation or sensor-fusion algorithms, while the M9K memory blocks enable efficient circular buffer management for high-speed motor control loops. The MAX 10's instant-on flash configuration supports fail-safe operation in industrial control environments. Pair with Infineon IRF7507 gate drivers and a TI C2000 host MCU for closed-loop motor control applications.
추천
Low-Volume ASIC Replacement
The 10M16DAF256C7G serves as an economical low-volume ASIC replacement for designs in the 5K-20K ASIC gate range where NRE costs of a custom ASIC are prohibitive. With 16K logic elements, integrated flash, and ADC, the MAX 10 reduces time-to-market while keeping per-unit cost competitive for production volumes below 10K units annually. The dual-configuration flash supports field firmware updates with rollback capability, enabling in-field feature additions without hardware recalls. Compared to mask-programmed ASICs, the FPGA allows design verification and bug fixes prior to volume production commitment.
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Communication Protocol Bridge (SPI/I2C to UART/Ethernet)
The 10M16DAF256C7G's 16K logic elements comfortably implement multi-master SPI to Ethernet protocol bridges with on-chip TCP/IP offload and MAC interface logic. With 178 user I/O and 562 Kbit block RAM, designers can buffer multiple simultaneous protocol channels for industrial gateway applications. The MAX 10's integrated ADC monitors system health without an external component. This makes the 10M16DAF256C7G ideal for industrial IoT edge gateways, sensor concentrators, and protocol translation modules requiring deterministic real-time processing. Pair with a Microchip ENC28J60 Ethernet controller or TI CC3220 Wi-Fi companion for connectivity.
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LED Video Wall Timing & Pixel Driver
The 10M16DAF256C7G fits LED video wall row-driver and timing controller applications where parallel pixel data must be serialized to long cable runs at high refresh rates. With 178 user I/O, the FPGA can drive 32-48 channels of high-speed LVDS pixel data simultaneously, while the integrated block RAM stores gamma correction lookup tables and frame buffers. The dual-configuration flash allows field upgrades of gamma tables and color calibration without external memory. Compared with HC595 shift register chains, the MAX 10 reduces PCB area and improves refresh rate by 5-10x in large-format video wall installations.
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Test & Measurement Instrument Front-End
The 10M16DAF256C7G's integrated 12-bit ADC and parallel logic fabric make it suitable for portable test and measurement instrument front-ends, capturing analog sensor data and processing digital protocol signals (I2C, SPI, UART) simultaneously. The 16K logic elements support FFT, FIR filtering, and custom protocol decoding in real time, while 562 Kbit of block RAM stores sample buffers for post-processing. The commercial 0C-85C operating range covers lab and field-portable use cases. Pair with a TI ADS8688A high-speed external ADC for higher-bandwidth capture or keep the integrated ADC for lower-cost applications.
추천
Consumer Device I/O Hub
The 10M16DAF256C7G functions as a flexible I/O hub in consumer devices such as smart appliances, gaming peripherals, and audio interfaces where multiple I/O standards must coexist. With 178 user I/O, designers can mix USB, HDMI CEC, I2S audio, and proprietary protocols on a single chip. The MAX 10 instant-on flash enables sub-100ms boot times required for consumer UX expectations, while commercial temperature grade (0C-85C) is suitable for indoor consumer environments. Pair with an NXP i.MX RT1060 host MCU or Microchip SAMD51 for complete consumer product designs requiring rich I/O connectivity.
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추천 제품 요약
엔지니어링 참조 데이터: 10M16DAF256C7G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M16DAF256C8G | 10M16DAF256A7G | 10M16DAF256I7G | 10M08DAF256C7G | 10M25DAF256C7G |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 256-LBGA (F256), 17x17 mm | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same |
| Logic Elements | 16,000 | 16,000 | 16,000 | 16,000 | 8,000 (-50%) | 25,000 (+56%) |
| Speed Grade | 7 | 8 (faster) | 7 | 7 | 7 | 7 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Configuration Memory | Dual-configuration flash | Dual-configuration flash | Dual-configuration flash | Dual-configuration flash | Dual-configuration flash | Dual-configuration flash |
| Integrated ADC | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR |
주요 차별점
- Dual-configuration non-volatile flash eliminates external boot PROM (vs 10M08DAF256C7G)
- Highest density in 256-LBGA MAX 10 family at commercial temp grade (vs 10M25DAF256C7G)
- Integrated 12-bit ADC for sensor monitoring (vs 10M16DAF256A7G (industrial temp))
설계 노트
The 10M16DAF256C7G uses a 256-LBGA (F256) package with a 1.0 mm pitch ball grid. PCB design requires a 4-layer or higher stack-up with a continuous ground plane beneath the BGA for thermal dissipation and signal integrity. BGA escape routing must use microvias (laser-drilled) with 0.1 mm drill size on inner layers and standard 0.2 mm vias on outer layers. For prototype assembly, X-ray inspection is required to verify BGA solder joint quality, and BGA rework capability must be available for any board revisions. The MAX 10 Hardware Design Guidelines document must be reviewed before board layout to ensure proper decoupling and power plane assignments.
The 10M16DAF256C7G dual-supply variant ('DA' suffix) requires separate 1.2V VCCINT and 3.3V VCCIO rails with proper sequencing. Estimated: at 85% logic utilization and 100 MHz operation, VCCINT current consumption is approximately 200-400 mA, requiring a switching regulator with at least 600 mA capacity and adequate bulk decoupling (>= 47 uF low-ESR ceramic). Place 0.1 uF and 1 uF ceramic decoupling capacitors within 2 mm of every VCC pin pair (VCCINT/GND and VCCIO/GND). The MAX 10 datasheet specifies that VCCIO must not be applied before VCCINT to avoid latch-up; design power sequencing circuits (using TI LM3880 sequencer or discrete RC delay) accordingly.
Common pitfalls when designing with the 10M16DAF256C7G include: (1) forgetting that all MAX 10 FPGAs require the JTAG TDI/TDO/TMS/TCK pins to be properly terminated - unused JTAG pins should be tied to known state per the device handbook; (2) overlooking the dual-configuration flash default image selection - verify which image boots first in the design; (3) not enabling the internal pull-up resistors on user I/O pins during configuration to avoid current leakage through floating inputs; (4) failing to assign CONFIG_DONE, nSTATUS, and nCONFIG pins correctly in the Quartus Prime pin planner, which can cause configuration failures during field updates; (5) ignoring the CONF_DONE and nSTATUS LED indicator recommendations to add visual status feedback for production testing.
규정 준수 정보
RoHS and lead-free compliant per Altera/Intel product marking. C7G suffix denotes commercial temperature grade (0C to +85C); not AEC-Q100 qualified - select MAX 10 automotive grade parts (prefix 'A' or with -A suffix) for automotive applications.
