5CSXFC2C6U23C7N - Cyclone V SX SoC FPGA 25K LE 672-UBGA | Intel
부품 번호: 5CSXFC2C6U23C7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $31.31 | $31.31 |
| 10 | $28.5 | $285.00 |
| 100 | $24.75 | $2,475.00 |
| 500 | $21.4 | $10,700.00 |
| 1,000 | $18.9 | $18,900.00 |
5CSXFC2C6U23C7N 개요
A SoC FPGA (System-on-Chip Field-Programmable Gate Array) is a hybrid device that merges a hard processor subsystem — typically ARM Cortex-A cores with caches, MMU, memory controllers, and peripherals — with a programmable FPGA fabric on the same die. The SoC FPGA category sits in the hierarchy: SoC FPGA → FPGA & programmable logic → programmable logic device → semiconductor IC. This architecture enables deterministic hardware acceleration in the FPGA fabric alongside a Linux/Android-capable application processor, eliminating the need for a separate CPU+FPGA board and reducing BOM cost, board area, and inter-chip latency for applications such as motor control, industrial Ethernet, and machine vision.
Key electrical and physical features include 188 user I/Os, integrated high-speed transceivers (Cyclone V SX), variable-precision DSP blocks, embedded M10K memory blocks, support for LPDDR2/DDR3/DDR3L memory through the HPS, and a 28nm TSMC low-power process that reduces both static and dynamic power versus the prior Cyclone IV generation. Industrial-grade temperature range (TJ from -40°C to +100°C) and on-chip PLLs support a broad range of clocking topologies. The C7 speed grade balances performance and power for cost-sensitive embedded designs.
Typical applications include industrial motor control, programmable logic controllers (PLC), industrial Ethernet gateways, machine vision front-ends, broadcast video processing, and portable medical instrumentation. The integrated HPS allows a single chip to run a real-time OS in Linux while offloading deterministic DSP and I/O processing to the FPGA fabric.
When designing with the 5CSXFC2C6U23C7N, plan the PCB power distribution network for the multi-rail HPS+FPGA supply (typically 1.1V core, 1.8V/2.5V/3.3V I/O, and DDR PHY supply) and use Intel's Quartus Prime design suite with the Cyclone V device family support installed. The 23x23 mm UBGА package requires careful BGA fanout and via-in-pad design.
This page synthesizes distributor pricing, verified drop-in alternatives from the Cyclone V SX/SE family, and practical Quartus Prime design notes not collected in any single distributor listing.
드롭인 대체품: 5CSXFC2C6U23C7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5CSXFC2C6U23C7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Series, Process Technology, Operating Temperature, DSP Blocks.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5CSXFC2C6U23C6N
✅ 드롭인✓ 재고 있음
$142 / 개
데이터시트 보기 →5CSXFC2C6U23A7N
✅ 드롭인✓ 재고 있음
$31.75 / 개
데이터시트 보기 →5CSEBA6U23C7N
✅ 드롭인✓ 재고 있음
$185 / 개
데이터시트 보기 →5CSEBA6U23C8N
✅ 드롭인✓ 재고 있음
$132 / 개
데이터시트 보기 →5CSEBA6U19C7N
✅ 드롭인✓ 재고 있음
$155.29 / 개
데이터시트 보기 →5CSXFC2C6U23C7N 최대 정격 & 전기적 특성
| Series | Cyclone® V SX |
| Device Type | SoC FPGA (FPGA + ARM Cortex-A9 HPS) |
| Logic Elements | 25,000 |
| Maximum User I/Os | 188 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Core Frequency | 800 MHz |
| Process Technology | 28 nm TSMC low-power |
| Core Voltage | 1.1 V |
| 패키지 | 672-UBGA (23x23 mm) |
| 실장 유형 | Surface Mount (BGA) |
| Speed Grade | C7 |
| MSL 레벨 | 3 (168 hours) |
| RoHS 상태 | Compliant |
| Lead Free | Yes |
| Form of Terminal | Ball |
| Package Code | FBGA |
| Packaging | Tray |
5CSXFC2C6U23C7N fbga 핀 구성 가이드
5CSXFC2C6U23C7N(fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 5CSXFC2C6U23C7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
5CSXFC2C6U23C7N 적합 용도: 6 애플리케이션s: Industrial Motor Control Drive, Programmable Logic Controller (PLC), Industrial Ethernet Gateway, Machine Vision Front-End, Broadcast Video Processing, Portable Medical Instrumentation.
Industrial Motor Control Drive
The 5CSXFC2C6U23C7N is well suited to industrial motor drives because the dual 800 MHz ARM Cortex-A9 HPS runs Linux and the motor-control state machine, while the 25K LE FPGA fabric implements deterministic PWM generation, encoder decoding, and field-oriented control (FOC) loops that demand sub-microsecond latency unavailable on a general-purpose CPU. The SX transceivers enable EtherCAT, PROFINET, or EtherNet/IP industrial-Ethernet connectivity, and the 188 user I/Os accommodate multi-axis current-sense ADCs, gate-driver interfaces, and resolver excitation. MSL 3, RoHS compliance, and the 28nm low-power process allow compact IP65 drives.
추천
Programmable Logic Controller (PLC)
PLC backplanes benefit from the 5CSXFC2C6U23C7N because the Cortex-A9 HPS can host the IEC 61131-3 runtime (CODESYS, Beremiz, or vendor-proprietary) while the FPGA fabric implements high-speed digital I/O, counters, and PWM outputs with deterministic cycle times as low as 1 microsecond. The 188 user I/Os support both 24V industrial digital inputs and high-speed differential signaling for inter-CPU links. The 672-UBGA 23x23 mm package enables compact card designs. Industrial temperature variants (A7 suffix) extend operation to -40°C to +85°C.
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Industrial Ethernet Gateway
The 5CSXFC2C6U23C7N is ideal for industrial Ethernet gateways because the SX-family integrated transceivers (up to 3.125 Gbps) handle EtherCAT, PROFINET IRT, EtherNet/IP, and SERCOS III PHY connectivity directly. The Cortex-A9 HPS runs the TCP/IP stack, secure shell, and a web-based configuration UI, while the FPGA fabric handles hard-real-time protocol processing at wire speed. A single 672-UBGA device replaces a discrete CPU + FPGA + external PHY pair, reducing BOM and PCB area for DIN-rail-mounted gateways.
추천
Machine Vision Front-End
Machine vision systems use the 5CSXFC2C6U23C7N as a front-end image processor: the FPGA fabric ingests raw sensor data from a MIPI CSI-2 or parallel CMOS image sensor, performs Bayer demosaic, lens distortion correction, and basic edge detection, then hands a compressed stream to the Cortex-A9 HPS for higher-level analysis. The variable-precision DSP blocks accelerate H.264 / MJPEG encoding at typical industrial resolutions (VGA to 2 MP). The HPS runs OpenCV-based classification, while the fabric keeps the sensor pipeline deterministic.
추천
Broadcast Video Processing
The 5CSXFC2C6U23C7N supports broadcast video processing applications including SDI bridging, format conversion, and overlay generation. The SX transceivers handle 3G-SDI (up to 2.97 Gbps) and HD-SDI receive/transmit paths, while the FPGA fabric implements up/down/cross conversion and color-space transforms. The ARM HPS runs a web-based management UI and SNMP agent. The 672-UBGA 23x23 mm package and 188 user I/Os provide enough margin for parallel control-plane GPIO alongside the SDI links.
추천
Portable Medical Instrumentation
Portable patient-monitoring devices use the 5CSXFC2C6U23C7N because the 28nm low-power process and the optional C6 speed grade (5CSXFC2C6U23C6N drop-in) reduce battery drain. The FPGA fabric implements low-latency ECG/EEG signal-conditioning DSP, while the Cortex-A9 HPS runs a real-time OS for waveform display, alarm management, and Bluetooth/Wi-Fi connectivity through a companion module. IEC 60601-1 compliance is supported by the device's documentation set; the 672-UBGA package allows compact handheld form factors.
추천
추천 제품 요약
엔지니어링 참조 데이터: 5CSXFC2C6U23C7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5CSXFC2C6U23C6N | 5CSXFC2C6U23A7N | 5CSEBA6U23C7N | 5CSEBA6U23C8N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 672-UBGA (23x23 mm) | 672-UBGA (23x23 mm) — same | 672-UBGA (23x23 mm) — same | 672-UBGA (23x23 mm) — same | 672-UBGA (23x23 mm) — same |
| Sub-Family | Cyclone V SX (FPGA + HPS + transceivers) | Cyclone V SX | Cyclone V SX | Cyclone V SE (FPGA + HPS, no transceivers) | Cyclone V SE |
| Logic Elements | 25,000 | 25,000 | 25,000 | 110,000 | 110,000 |
| Speed / Temperature Grade | C7 (commercial) | C6 (commercial, slower Fmax) | A7 (industrial -40C to +85C) | C7 (commercial) | C8 (commercial, slower Fmax) |
| HPS Core Frequency (max) | 800 MHz (dual Cortex-A9) | 800 MHz | 800 MHz | 925 MHz | 925 MHz |
| Integrated Transceivers | Yes (3.125 Gbps) | Yes | Yes | No (SE: FPGA + HPS only) | No |
주요 차별점
- Higher logic density (4.4×) in same package footprint (vs 5CSEBA6U23C7N (110K LE Cyclone V SE))
- Industrial temperature range option in same package (vs 5CSXFC2C6U23A7N)
- Integrated 3.125 Gbps transceivers in SX sub-family (vs 5CSEBA6U23C7N (SE sub-family))
설계 노트
The 672-UBGA 23x23 mm package requires careful PCB stackup planning. Use a 1.0 mm BGA pitch with 0.5 mm drill microvias on a 4+ layer stackup (signal-GND-power-signal). All BGA balls are full-array except for corner relief; escape routing must use via-in-pad (VIPPO) for inner balls. Recommended: 1 oz copper on outer layers, 0.5 oz on inner, with stitched GND vias adjacent to each BGA signal via for return-path integrity. Avoid routing HPS DDR traces across plane splits — keep them over a continuous GND reference.
The 5CSXFC2C6U23C7N requires multiple supply rails: 1.1V core (HPS+FPGA), 2.5V/3.3V I/O banks, 1.8V PLL analog, and a DDR PHY termination voltage (typically 0.6V VTT for DDR3L). Estimated peak power dissipation for a fully utilized 25K LE design with both Cortex-A9 cores at 800 MHz is approximately 5–7W. Use a multi-rail PMIC such as the Intel EN5339QI or Texas Instruments TPS650250 to sequence the rails per the Cyclone V POR (Power-On Reset) requirements; VCC must ramp before VCCAUX and VCCIO.
Match the HPS DDR3/DDR3L memory interface trace lengths within ±25 mils (address/command) and ±10 mils (byte-lane to DQS) per Intel's External Memory Interface Handbook. Place the DDR chip as close as possible to the HPS MIO/VP group (BGA side closest to the HPS pins). Use fly-by VTT termination for address/command, and enable write-leveling + read calibration in Quartus Prime to absorb any residual skew. Differential clock lines (CK/CK#) must be 100Ω differential and length-matched to within 5 mils.
Estimated: at 7W dissipation and a JEDEC JESD51-9 still-air test environment, the 672-UBGA package with theta_JA ≈ 14 C/W (4-layer JEDEC board) would see a junction temperature rise of approximately 98°C — i.e., the die would exceed the 100°C commercial limit. Provide either forced-air cooling (>1 m/s airflow) or a heat-spreader lid. For sealed industrial enclosures, de-rate the design to <4W total power or use the C6 speed-grade drop-in 5CSXFC2C6U23C6N (lower Vcc leakage) to stay within thermal envelope.
MSL 3 (168 hours floor life) — bake the device at 125°C for 24 hours before assembly if exposure exceeds the floor life or if the humidity indicator card reads >10%. Do not confuse SX (with transceivers) with SE (without) — the SE drop-in 5CSEBA6U23C7N looks pin-compatible in the same U672 package but lacks the transceivers, so an SX design using the transceiver balls will see those pins as no-connect. Confirm the Cyclone V device ordering code (SX vs SE) matches your schematic before PCB fab.
규정 준수 정보
RoHS compliant and lead-free per Intel/Altera Cyclone V product environmental compliance. Not AEC-Q100 qualified — use industrial A7 speed/temperature grade (5CSXFC2C6U23A7N) for -40°C to +85°C operation. Halogen-free status not explicitly confirmed in the provided data; set to 'unknown'. MSL 3 with 168 hours floor life.