5CSEBA2U23C7N - Cyclone V SE SoC FPGA, 25K LE, Dual A9 | Intel
부품 번호: 5CSEBA2U23C7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $99.78 | $99.78 |
| 10 | $95.2 | $952.00 |
| 100 | $88.5 | $8,850.00 |
| 500 | $82.4 | $41,200.00 |
| 1,000 | $76.9 | $76,900.00 |
5CSEBA2U23C7N 개요
A System-on-Chip FPGA (SoC FPGA) is a class of embedded device that tightly couples a general-purpose processor subsystem with programmable logic on a single die. Within the broader taxonomy it sits between pure microcontrollers and discrete CPU-plus-FPGA solutions, and is part of the Intel/Altera FPGA family hierarchy (Cyclone V SE -> Cyclone V family -> low-power FPGAs -> FPGA -> programmable logic). The integrated HPS enables deterministic real-time control plus rich OS workloads, while the FPGA fabric accelerates parallel DSP, custom interfaces, and protocol bridging.
Key features of the 5CSEBA2U23C7N include 25K Logic Elements, embedded M10K RAM blocks, hard memory controllers, variable-precision DSP blocks, and high-speed transceivers suited for low-latency links. The dual ARM Cortex-A9 cores with CoreSight debug trace, NEON media engine, and 32 KB I-cache / 32 KB D-cache per core deliver symmetric multiprocessing. The HPS integrates DDR3/DDR3L/LPDDR2 controllers, Gigabit Ethernet MAC, USB 2.0 OTG, NAND flash controller, and SD/eMMC interfaces for direct external memory and storage connectivity without consuming FPGA fabric.
The device architecture uses TSMC's 28 nm low-power process and a coherent CPU-to-FPGA interconnect with up to 4 GB address window through the FPGA-to-HPS bridges. This enables shared peripheral sharing, scatter-gather DMA, and hardware accelerators that offload latency-critical paths from the CPUs. The combined platform supports symmetric multiprocessing operating systems such as Linux and VxWorks while preserving the FPGA's deterministic real-time response.
Typical applications include industrial motor control and factory automation, video surveillance and machine vision, automotive driver assistance, medical imaging front-ends, software-defined radio, and embedded test equipment. The SoC FPGA's processor-plus-logic blend suits systems that need rich UI/networking plus custom I/O timing. When designing with this part, plan thermal dissipation for the 672-pin UBGA carefully and follow Intel's HPS pin-out guidelines for DDR3 trace length matching. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on any single distributor product page.
드롭인 대체품: 5CSEBA2U23C7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5CSEBA2U23C7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, HPS Maximum Frequency, Logic Elements, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5CSEBA2U23C6N
✅ 드롭인✓ 재고 있음
$88.4 / 개
데이터시트 보기 →5CSEBA2U23A7N
✅ 드롭인✓ 재고 있음
$99.5 / 개
데이터시트 보기 →5CSEBA4U23C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$124.5 / 개
데이터시트 보기 →5CSEBA2U23I7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$124 / 개
데이터시트 보기 →5CSEBA2U23C7N 최대 정격 & 전기적 특성
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 25K |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 800 MHz (application grade) |
| 패키지 | 672-UBGA (23x23 mm) |
| User I/O | 188 |
| Process Technology | TSMC 28 nm low-power |
| HPS Memory Interface | DDR3 / DDR3L / LPDDR2 controller |
| HPS Peripherals | Gigabit Ethernet MAC, USB 2.0 OTG, NAND, SD/eMMC |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
5CSEBA2U23C7N 672-ubga (23x23 mm) 핀 구성 가이드
5CSEBA2U23C7N(672-ubga (23x23 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 5CSEBA2U23C7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
5CSEBA2U23C7N 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Surveillance and Machine Vision, Software Defined Radio (SDR), Medical Imaging Front-End, Industrial IoT Edge Gateway, Embedded Test and Measurement Equipment.
Industrial Motor Control
The 5CSEBA2U23C7N is well suited for industrial motor control applications where the dual ARM Cortex-A9 HPS runs a real-time OS for supervisory control while the FPGA fabric implements high-resolution PWM generators, encoder interfaces, and field-oriented control (FOC) loops. The 25K Logic Elements provide sufficient fabric for multi-axis current/voltage control with deterministic sub-microsecond loop times. Compared with a discrete MCU plus external FPGA solution, the integrated SoC reduces BOM cost and simplifies PCB layout. The 672-UBGA package's exposed thermal pad supports continuous 1-2W dissipation typical of multi-axis motor drives in factory automation enclosures.
추천
Video Surveillance and Machine Vision
The 5CSEBA2U23C7N handles video pipeline tasks in surveillance cameras and machine vision systems, where the HPS runs Linux with image processing software while the FPGA fabric performs pixel-level preprocessing, color space conversion, and H.264/H.265 encoding at the sensor interface. The variable-precision DSP blocks accelerate image filtering and edge detection at line rates exceeding 100 MHz. The HPS's Gigabit Ethernet MAC and USB 2.0 OTG enable direct network streaming and peripheral connectivity. For dual-sensor or 4K pipeline designs, the 25K Logic Elements are tight; consider the 5CSEBA4U23C7N upgrade part with 40K Logic Elements.
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Software Defined Radio (SDR)
In SDR platforms the 5CSEBA2U23C7N's FPGA fabric executes the high-sample-rate digital down-conversion, channelization, and modulation/demodulation while the ARM Cortex-A9 HPS runs the protocol stack, network services, and user-interface software. The high-speed transceivers support low-latency links to RF front-ends and DACs/ADCs. Compared with pure FPGA SDR designs, the HPS offloads housekeeping tasks from the fabric, freeing Logic Elements for signal-processing paths. For multi-channel wideband SDR where logic density is critical, the 5CSEBA4U23C7N provides 40K Logic Elements in the same package.
추천
Medical Imaging Front-End
Medical imaging systems such as ultrasound carts and portable patient monitors leverage the 5CSEBA2U23C7N's HPS for user interface, image storage, and DICOM network protocol, while the FPGA fabric handles beamforming, filtering, and high-speed ADC interface. The 800 MHz ARM Cortex-A9 cores deliver sufficient processing for mid-range ultrasound display rendering. The 672-UBGA package supports the multi-channel ADC/DAC data buses. For high-channel-count premium ultrasound, the 5CSEBA4U23C7N with 40K Logic Elements offers more fabric for parallel beamforming paths.
추천
Industrial IoT Edge Gateway
The 5CSEBA2U23C7N serves as an industrial IoT edge gateway that aggregates sensor data over multiple protocols (Modbus, CAN, EtherCAT, RS-485), preprocesses it in the FPGA fabric, and forwards results to cloud services via the HPS's Gigabit Ethernet MAC. The dual ARM Cortex-A9 cores run containerized edge-analytics workloads while the FPGA implements deterministic protocol conversion. The device's 188 user I/O pins support multiple field-bus interfaces on a single SoC, reducing the need for separate interface cards. The 23x23 mm UBGA package fits standard industrial gateway form factors with adequate thermal headroom.
추천
Embedded Test and Measurement Equipment
Test and measurement instruments such as oscilloscopes, protocol analyzers, and data loggers benefit from the 5CSEBA2U23C7N's combination of FPGA-based high-speed signal acquisition and ARM Cortex-A9-based user interface. The variable-precision DSP blocks accelerate FFT calculations for spectrum analysis, while the HPS drives the touchscreen and USB/LAN connectivity. The 188 user I/O pins accommodate multiple instrument channels. Compared with a discrete DSP-plus-MCU solution, the SoC FPGA provides a smaller PCB footprint and tighter signal integrity for analog-front-end integration.
추천
추천 제품 요약
엔지니어링 참조 데이터: 5CSEBA2U23C7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5CSEBA2U23C6N | 5CSEBA2U23A7N | 5CSEBA4U23C7N | 5CSEBA2U23I7N |
|---|---|---|---|---|---|
| Package | 672-UBGA (23x23 mm) | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 25K | 25K | 25K | 40K | 25K |
| HPS Configuration | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz |
| Speed Grade | C7 | C6 | A7 | C7 | I7 |
| Temperature Grade | Commercial | Commercial | Commercial | Commercial | Industrial |
| User I/O Pins | 188 | 188 | 188 | 188 | 188 |
| Unit Price (qty 1, USD) | 99.78 | 94.50 | 97.20 | 129.00 | 115.40 |
| Lifecycle Status | Active | Active | Active | Active | Active |
주요 차별점
- Only Intel/Altera Cyclone V SE SoC FPGA in the 25K LE class with 800 MHz dual A9 HPS at this price point (vs 5CSEBA4U23C7N)
- Pin-compatible upgrade path within same U23 672-UBGA footprint (vs 5CSEBA2U19C7N)
- Open-pin-compatible speed grade variants for cost optimization (vs 5CSEBA2U23C6N)
설계 노트
Estimated: The 672-UBGA (23x23 mm) package requires careful thermal management. For the 5CSEBA2U23C7N, typical active power consumption is in the 1.5-3W range depending on HPS utilization and FPGA clock rate. The exposed thermal pad (ETP) must be soldered to a ground plane with thermal vias to a copper pour on the bottom layer. Designers should follow Intel's Cyclone V SE thermal management application note for recommended PCB layout, including minimum via count and copper area to keep junction temperature below 100C in commercial operation. Forced airflow is recommended when the device operates at high utilization in enclosed industrial enclosures.
The 672-UBGA package uses a 0.8 mm ball pitch. PCB breakout routing requires 4-6 routing layers for clean signal escape; signals under the BGA use either dog-bone fanout or via-in-pad for higher-density breakout. The HPS DDR3 memory controller requires matched trace lengths (typically within 25 mil tolerance for data, address, and command signals), impedance-controlled 50 ohm single-ended traces, and a continuous ground reference plane. Consult the Cyclone V SE device datasheet pin-out tables and the Altera External Memory Interface Handbook for layout guidelines before finalizing PCB stack-up.
Power sequencing is critical for the 5CSEBA2U23C7N: VCC, VCCAUX, VCCA_FPLL, and HPS power rails must ramp in the order specified in the datasheet to avoid latch-up. Intel recommends a Power Management IC (PMIC) such as the EN63A0QI or similar that supports all required Cyclone V SE rails including the 0.95V core, 1.8V/2.5V/3.3V I/O, and 1.5V DDR3 termination. Decoupling requires 0.1uF and 0.01uF ceramic capacitors placed within 50 mils of each power pin per the Intel power distribution network (PDN) guidelines.
Common pitfalls when designing with the 5CSEBA2U23C7N include: (1) omitting the configuration mode jumpers (MSEL pins) required to set the FPGA configuration mode, (2) failing to assign clock pins per the Quartus Prime pin-planner recommendations, (3) ignoring the HPS reset sequence which requires proper nPOR and nRST signal sequencing before HPS boot, (4) mixing commercial-grade and industrial-grade SKUs without verifying temperature ranges, and (5) underestimating the HPS-to-FPGA bridge clocking requirements when using the AXI bridges for peripheral sharing. Always validate the design with Intel's Cyclone V SE Golden System Reference Design before production tape-out.
규정 준수 정보
RoHS compliant per Altera/Intel product family compliance statements. AEC-Q100 not applicable (FPGA is not automotive-qualified; check Intel automotive Cyclone V variants for AEC-Q100 needs). REACH and conflict minerals compliance assumed per Intel policy but exact certificate should be requested from manufacturer.