Altera

5CSXFC2C6U23I7N - Cyclone V SX SoC FPGA 25K LE | Altera | UBGA-672

부품 번호: 5CSXFC2C6U23I7N ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
672-UBGA (23x23 mm) Package Up to 800 MHz Speed DDR3/DDR2/LPDDR2 Memory
시작가 $285 USD / 개
MOQ: 1 |
가격 업데이트: 2026-09-05
볼륨 가격
수량 단가 합계
1 $380 $380.00
10 $360 $3,600.00
100 $335 $33,500.00
500 $310 $155,000.00
1,000 $285 $285,000.00
ℹ️ 모든 가격은 USD 기준입니다

5CSXFC2C6U23I7N 개요

The Altera 5CSXFC2C6U23I7N is a Cyclone V SX System-on-Chip (SoC) FPGA integrating a dual-core ARM Cortex-A9 MPCore hard processor system with a 25K-logic-element FPGA fabric in a 672-pin UBGA (23x23 mm) package, operating at up to 800 MHz. Built on TSMC's low-power 28 nm process, the device combines an enhanced M10K memory subsystem, variable-precision DSP blocks, and integrated transceivers for embedded applications requiring both software programmability and hardware acceleration.

A SoC FPGA is a single silicon die that fuses a general-purpose processor subsystem (typically ARM Cortex-A cores with caches, MMU, and peripherals) with a programmable FPGA fabric, allowing hardware-software co-design. The Cyclone V SX family sits at the low-power end of Altera's (now Intel FPGA) mid-range portfolio, targeting cost- and power-sensitive applications such as industrial motor control, machine vision, broadcast video bridging, and wireless backhaul. Within the SoC hierarchy, this part sits between pure microcontrollers and high-end FPGAs, offering deterministic real-time response through fabric-side logic while running a full OS (Linux, VxWorks) on the HPS side.

Key differentiating features include 25K logic elements with 5.5 Mbits of embedded RAM, 66 hardware DSP blocks supporting variable-precision arithmetic (9x9, 18x18, 27x27 multipliers), dual ARM Cortex-A9 cores running up to 800 MHz with NEON media engine and single/double-precision FPU, 3.125 Gbps transceivers, and hardened memory controllers (DDR3, DDR2, LPDDR2). The 672-pin UBGA package exposes 364 user I/Os and supports -40 C to +100 C industrial operation.

Architecturally, the device uses Altera's Adaptive Logic Module (ALM) fabric with 8-input fracturable look-up tables, M10K memory blocks for moderate-density data buffering, and a coherent interconnect (ACP) bridging FPGA-to-HPS traffic with cache-coherent DMA. The hard memory controller subsystem offloads DDR3-1600 transaction handling from the fabric, enabling deterministic latency for video frame buffers and protocol stacks.

Typical applications include industrial machine vision cameras, broadcast video encoders, motor drive controllers, secure IoT gateways, software-defined radio baseband, and military/aerospace single-board computers. The combination of low static power (~0.6 W typical HPS), industrial temperature grade, and long-life Altera/Intel FPGA supply makes the 5CSXFC2C6U23I7N a strong fit for 10+ year lifecycle embedded platforms.

When designing with this SoC FPGA, plan pin assignments early: HPS-side peripherals (EMAC, USB, SD/MMC, NAND, SPI) use dedicated MIO pins that cannot be remapped, while FPGA I/O can be assigned flexibly. Reserve a JTAG header and a 100 MHz reference clock for the HPS PLL, and use the Altera SoC EDS toolchain (DS-5, ARM DS, or OpenOCD) for debug.

드롭인 대체품: 5CSXFC2C6U23I7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: 5CSXFC2C6U23I7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Series, Speed Grade, Process Technology, Operating Temperature.

Altera
Package: 672-UBGA (UFBGA) 23x23 mm
Process Technology: 28 nm low-power
비교 대상: 5CSXFC2C6U23I7N →
Intel
Package: 672-UBGA (U23), 23 mm x 23 mm
Series: Cyclone V SX
Speed Grade: C6
비교 대상: 5CSXFC2C6U23I7N →
Intel
Series: Cyclone® V SX
Speed Grade: C7
Process Technology: 28 nm TSMC low-power
비교 대상: 5CSXFC2C6U23I7N →
Intel
Package: 672-pin UBG (UBGA) 23x23 mm
Series: 5CSXC2
Speed Grade: C8
비교 대상: 5CSXFC2C6U23I7N →
Intel
Package: 672-pin UBGA (23x23 mm)
Process Technology: 28 nm low-power
비교 대상: 5CSXFC2C6U23I7N →
Intel
Package: 672-pin UFBGA (UBGA), 23x23 mm
Series: Cyclone V SX SoC FPGA
Process Technology: 28 nm low-power
비교 대상: 5CSXFC2C6U23I7N →
Intel
Package: 672-UBGA (UFBGA) 23x23 mm
Series: Cyclone V SoC FPGA
Speed Grade: C6 (commercial, -6)
비교 대상: 5CSXFC2C6U23I7N →
Altera
Package: 672-ball UBGA (23x23 mm)
Speed Grade: I7
Process Technology: 28 nm low-power
비교 대상: 5CSXFC2C6U23I7N →
Intel
Process Technology: 28 nm low-power (TSMC)
Operating Temperature: -40C to +100C (Industrial)
비교 대상: 5CSXFC2C6U23I7N →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

5CSXFC2C6U23I7LN

✅ 드롭인
Intel
📦 672-UBGA (23x23 mm)
Cyclone V SX · System-on-Chip (SoC) FPGA · 25K · Dual ARM Cortex-A9 MPCore with CoreSight · 925 MHz · 672-pin UBGA (23x23 mm) · 28 nm low-power · Industrial (I7)

✓ 재고 있음

$198 / 개

데이터시트 보기 →

5CSXFC2C6U23C8N

✅ 드롭인
Intel
📦 672-UBGA (23x23 mm)
Cyclone V SX · 5CSXC2 · 25,000 · MCU + FPGA (SoC with dual ARM Cortex-A9 MPCore + FPGA fabric) · 1.1 V · 28 nm · 600 MHz · C8

✓ 재고 있음

$105 / 개

데이터시트 보기 →

5CSXFC2C6U23C7N

✅ 드롭인
Intel
📦 672-UBGA (23x23 mm)
Cyclone® V SX · SoC FPGA (FPGA + ARM Cortex-A9 HPS) · 25,000 · 188 · Dual ARM Cortex-A9 MPCore with CoreSight · 800 MHz · 28 nm TSMC low-power · 1.1 V

✓ 재고 있음

$18.9 / 개

데이터시트 보기 →

5CSXFC2C6U23C6N

✅ 드롭인
Intel
📦 672-UBGA (23x23 mm)
Cyclone V SX · SoC FPGA (HPS + FPGA fabric) · Dual-core ARM Cortex-A9 MPCore with CoreSight · 925 MHz · 25K · 66 (18x18 multipliers) · Approximately 1.4 Mbit · 224

✓ 재고 있음

$142 / 개

데이터시트 보기 →

5CSXFC2C6U23A7N

✅ 드롭인
Altera
📦 672-UBGA (23x23 mm)
Cyclone V SX SoC FPGA · 25,000 · 28 nm low-power · Dual ARM Cortex-A9 MPCore with CoreSight · 700 MHz · 1.1 V · 672-UBGA (UFBGA) 23x23 mm · 672

✓ 재고 있음

$31.75 / 개

데이터시트 보기 →

5CSXFC2C6U23I7N 최대 정격 & 전기적 특성

Family Cyclone V SX SoC FPGA
Series 5CSX
Device Variant 5CSXC2 (U23)
Logic Elements 25,000
Processor Cores Dual ARM Cortex-A9 MPCore
Processor Frequency Up to 800 MHz
Embedded RAM 5.5 Mbits (M10K blocks)
DSP Blocks 66 (variable precision)
Transceivers 3.125 Gbps
User I/Os 364 (max, package dependent)
패키지 672-UBGA (23x23 mm)
실장 유형 Surface Mount (BGA)
Process Node 28 nm low-power
동작 온도 -40 C to +100 C (Industrial)
Hard Memory Controller DDR3/DDR2/LPDDR2
RoHS 상태 Compliant

5CSXFC2C6U23I7N 672-ubga (23x23 mm) 핀 구성 가이드

5CSXFC2C6U23I7N(672-ubga (23x23 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

5CSXFC2C6U23I7N의 672-ubga (23x23 mm) 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: 5CSXFC2C6U23I7N.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

5CSXFC2C6U23I7N 적합 용도: 6 애플리케이션s: Industrial Machine Vision Camera, Motor Drive and Servo Controller, Broadcast Video Processing Bridge, Industrial IoT Gateway with Protocol Conversion, Software-Defined Radio Baseband, Avionics and Military Single-Board Computer.

🎥

Industrial Machine Vision Camera

The 5CSXFC2C6U23I7N fits industrial machine vision cameras because its 25K LE fabric can process sensor pixel streams at line rates exceeding 200 MHz, while the dual ARM Cortex-A9 cores run GigE Vision / USB3 Vision protocol stacks and image pre-processing. Its hard DDR3 controller handles multi-megapixel frame buffers with deterministic latency, and the 3.125 Gbps transceivers support Camera Link HS or CoaXPress uplinks. Industrial -40 C to +100 C operation enables factory-floor deployment without thermal management concerns.

🏭

Motor Drive and Servo Controller

The 5CSXFC2C6U23I7N excels in motor drive controllers because its FPGA fabric delivers sub-microsecond deterministic PWM and encoder decoding for FOC algorithms, while the ARM cores run EtherCAT master stacks under Linux or RTOS. The hard DDR3 controller manages motion trajectory buffers, and the industrial temperature grade tolerates drive cabinet environments. Coherent ACP interface enables low-latency FPGA-to-CPU data sharing for current-loop feedback without cache thrashing.

📺

Broadcast Video Processing Bridge

The 5CSXFC2C6U23I7N suits broadcast video bridging applications because it can simultaneously ingest SDI (HD/3G-SDI) streams via fabric-side SERDES, de-embed audio, perform format conversion (3G-SDI to HDMI or DisplayPort), and output via HPS-controlled HDMI transmitter. The 28 nm low-power process keeps fan-less chassis designs feasible, while the dual Cortex-A9 runs web-based remote management interfaces. Altera's Video and Image Processing Suite accelerates deinterlacing and scaling operations in fabric.

🧩

Industrial IoT Gateway with Protocol Conversion

The 5CSXFC2C6U23I7N enables ruggedised IoT gateways because the dual Cortex-A9 runs Linux with full TLS/DTLS stacks while the FPGA fabric terminates industrial protocols like PROFINET, EtherCAT, Modbus TCP, or CANopen in hardware for deterministic cycle times. Its 3.125 Gbps transceivers support fibre uplinks to control rooms, and the -40 C to +100 C industrial grade tolerates outdoor cabinet mounting. HPS peripherals (EMAC, USB, SD/MMC) simplify BOM by eliminating external bridge chips.

📱

Software-Defined Radio Baseband

The 5CSXFC2C6U23I7N serves SDR baseband platforms because its 66 variable-precision DSP blocks deliver tens of GMACs for FFT, channelisation, and modulation/demodulation at low MHz bandwidths, while the ARM cores handle stack management and remote configuration. Transceivers interface directly to ADCs/DACs at 3.125 Gbps JESD204B rates, eliminating external clock-data recovery chips. The HPS's EMAC enables IP-based remote management of radio parameters.

✈️

Avionics and Military Single-Board Computer

The 5CSXFC2C6U23I7N is suitable for avionics and military single-board computers because the 28 nm low-power process enables conduction-cooled VPX or VME form factors, while the dual Cortex-A9 with MMU supports secure operating systems like VxWorks 653 or INTEGRITY. The FPGA fabric implements MIL-STD-1553, ARINC 429, or SpaceWire interfaces in hardware, offloading the CPU for flight-critical tasks. Long-life Altera/Intel FPGA supply guarantees 10+ year deployment support.

What is the 5CSXFC2C6U23I7N and what processor does it integrate?
The 5CSXFC2C6U23I7N is a Cyclone V SX SoC FPGA from Altera (now Intel FPGA) integrating a dual-core ARM Cortex-A9 MPCore hard processor system with a 25K-logic-element FPGA fabric in a 672-pin UBGA (23x23 mm) package, operating at up to 800 MHz. The HPS includes NEON media engine, FPU, 32 KB L1 caches, 512 KB shared L2, and integrated peripherals (EMAC, USB, SD/MMC, NAND, SPI, UART, I2C, GPIO).
How much does the 5CSXFC2C6U23I7N cost and is it in stock?
As of 2026-09-06, the 5CSXFC2C6U23I7N lists at approximately $380 USD per unit in tray packaging on distributor channels like DigiKey and Mouser, with volume pricing dropping to roughly $285 USD at 1,000-unit quantities. Stock status varies - verified availability should be confirmed directly with authorized distributors as Altera/Intel FPGA lead times can extend to 12-26 weeks during allocation periods.
What is the lead time for 5CSXFC2C6U23I7N production orders?
Standard lead time for the 5CSXFC2C6U23I7N is typically 12-26 weeks from Altera/Intel authorized distributors as of 2026-09-06, depending on order volume and tray quantity requirements. For urgent small-quantity prototyping needs, check DigiKey and Mouser for in-stock inventory; otherwise plan ahead for production ramp given that Cyclone V family parts run on long-life Altera/Intel FPGA supply agreements.
Where can I download the 5CSXFC2C6U23I7N datasheet PDF?
The 5CSXFC2C6U23I7N is covered by the Cyclone V Device Datasheet and the Cyclone V SX Family Pin Connection Guidelines, both available on Intel FPGA's website at intel.com/content/www/us/en/products/programmable/fpga/cyclone-v.html. Mouser and DigiKey product pages also link directly to the official 945-page Cyclone V datasheet document covering electrical characteristics, package outline, and pinout tables for the 5CSXC2 U23 variant.
What is the difference between 5CSXFC2C6U23I7N and 5CSEBA6U23I7N?
The 5CSXFC2C6U23I7N is a Cyclone V SX device with 25K logic elements and integrated transceivers, while the 5CSEBA6U23I7N is a Cyclone V SE device with 110K logic elements and no transceivers. The SX targets applications needing 3.125 Gbps serial links (PCIe, Serial RapidIO, CPRI), whereas the SE is optimised for high-density parallel DSP and video processing without transceiver overhead.
What is the best drop-in replacement for 5CSXFC2C6U23I7N?
The closest drop-in pin-compatible alternative within the Cyclone V SX family is the 5CSXFC2C6U23I7LN, which shares the same U23 672-UBGA footprint but has a slower speed grade (I7 vs I7N - identical speed, the LN suffix indicates lead-free finish). For same-package alternatives with slightly different temperature grades, 5CSXFC2C6U23C8N and 5CSXFC2C6U23C7N offer commercial-temperature equivalents at lower cost.
When should I choose 5CSXFC2C6U23I7N over a pure FPGA or pure microprocessor?
Choose the 5CSXFC2C6U23I7N when you need both deterministic hardware-side processing (FPGA fabric for motor control, video pipelines, custom protocols) and a full operating system environment (ARM Cortex-A9 for networking stacks, GUI, file system) on a single die. Pure FPGAs lack CPU peripherals; pure microprocessors lack parallel I/O bandwidth and deterministic timing. The SoC FPGA integrates both at lower BOM cost and power than two-chip solutions.
Is the 5CSXFC2C6U23I7N suitable for industrial motor control applications?
Yes, the 5CSXFC2C6U23I7N is widely deployed in industrial motor drives and servo controllers. The FPGA fabric handles deterministic PWM generation, encoder feedback decoding (EnDat, BISS, SSI), and current-loop computation at sub-microsecond latency, while the dual ARM Cortex-A9 cores run motion control software (EtherCAT master, FOC algorithms) under Linux or RTOS. The industrial -40 C to +100 C temperature grade supports harsh factory environments.
How much power does the 5CSXFC2C6U23I7N consume in typical applications?
Typical static power consumption for the 5CSXFC2C6U23I7N is approximately 0.6 W for the HPS subsystem and 1-2 W for the FPGA fabric at moderate utilisation, with total system power typically ranging 3-6 W depending on clock rates, toggle rates, and I/O loading. Cyclone V SX uses TSMC's 28 nm low-power process with power-aware logic, making it suitable for fan-less industrial enclosures where thermal budget is constrained to 8-10 W.
What are the key specifications of 5CSXFC2C6U23I7N that engineers should know?
According to Altera's Cyclone V SX documentation, the key specifications are: 25K logic elements, 5.5 Mbits M10K embedded RAM, 66 variable-precision DSP blocks, dual ARM Cortex-A9 cores up to 800 MHz, 3.125 Gbps transceivers, 364 max user I/Os in 672-UBGA package, hard DDR3 controller, -40 C to +100 C industrial operating range, and 28 nm low-power process. Package dimensions are 23x23 mm with 1.0 mm ball pitch.
Can I use a Cyclone V SE part like 5CSEBA6U23I7N instead of 5CSXFC2C6U23I7N?
No, the 5CSEBA6U23I7N is not a drop-in substitute because it lacks transceivers. If your design uses 3.125 Gbps serial links, you cannot remove them without PCB redesign and protocol rework. The 5CSEBA6U23I7N uses the same 672-UBGA U23 package footprint, so a same-board migration is mechanically possible, but you must verify pin compatibility per datasheet and remove all transceiver assignments from the Quartus pin planner.
What Xilinx equivalent exists for the 5CSXFC2C6U23I7N?
The closest Xilinx equivalent to the 5CSXFC2C6U23I7N is the Zynq-7000 series SoC, specifically the XC7Z010 or XC7Z012 in the CLG225/CLG400 packages. Both integrate dual ARM Cortex-A9 cores with FPGA fabric; however, Xilinx and Altera pinouts differ, the Zynq transceivers run at 6.25 Gbps vs Cyclone V's 3.125 Gbps, and software debug toolchains (Xilinx SDK vs Altera SoC EDS) are incompatible - this is a porting effort, not a drop-in replacement.
What memory interfaces does the 5CSXFC2C6U23I7N support?
The 5CSXFC2C6U23I7N includes a hard memory controller subsystem supporting DDR3, DDR2, and LPDDR2 with ECC, plus SD/MMC, NAND flash, and SRAM/NOR interfaces on the HPS side. The FPGA fabric side can additionally implement soft memory controllers (RLDRAM II, QDR II+) via user I/O. DDR3 speeds up to 1600 MT/s are supported through the hard controller, eliminating the need for soft IP and saving fabric resources.
What development tools are required to program the 5CSXFC2C6U23I7N?
Programming the 5CSXFC2C6U23I7N requires Quartus Prime (version 16.0 or later for full device support) for FPGA-side development and ARM DS-5 / SoC EDS for HPS software development. A JTAG programmer (USB-Blaster II clone or genuine Altera unit) connects to the JTAG header for both FPGA configuration and HPS debug. Boot image generation requires the Altera BootGen tool to package preloader, U-Boot/UEFI, and Linux kernel into a flash image.
Is the 5CSXFC2C6U23I7N still in production in 2026?
Yes, as of 2026-09-06 the 5CSXFC2C6U23I7N is in active production under the Intel FPGA (formerly Altera) Cyclone V SX long-life program. The Cyclone V family carries a 10+ year product longevity commitment, making it suitable for industrial, military, and aerospace programs with extended deployment cycles. Confirm current lifecycle status through Intel's product longevity page for the latest notice-of-change (PCN) bulletins.

엔지니어링 참조 데이터: 5CSXFC2C6U23I7N — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose 5CSXFC2C6U23I7N when you need the highest-speed (speed grade 7) industrial-temperature Cyclone V SX variant for time-sensitive designs where Fmax margins matter. For cost-sensitive commercial-temperature deployments, the 5CSXFC2C6U23C7N offers identical silicon and pinout at lower price but limited to 0-85 C. The 5CSXFC2C6U23I7LN is electrically identical with a lead-free finish suffix - select it only when explicitly required by procurement specifications. Choose 5CSXFC2C6U23C8N for slower-speed designs where the 8-grade timing margin is acceptable and you want a price break. For automotive under-hood applications exceeding +100 C, upgrade to the A7 suffix variant. All five parts share the same 672-UBGA (23x23 mm) footprint, enabling PCB layout reuse across product tiers.

대체품과의 비교

파라미터 이 제품 5CSXFC2C6U23I7LN 5CSXFC2C6U23C8N 5CSXFC2C6U23C7N 5CSXFC2C6U23C6N 5CSXFC2C6U23A7N
Brand Altera Altera Altera Altera Altera Altera
Package 672-UBGA (23x23 mm) 672-UBGA (23x23 mm) - same 672-UBGA (23x23 mm) - same 672-UBGA (23x23 mm) - same 672-UBGA (23x23 mm) - same 672-UBGA (23x23 mm) - same
Logic Elements 25,000 25,000 25,000 25,000 25,000 25,000
Processor Cores Dual ARM Cortex-A9 Dual ARM Cortex-A9 Dual ARM Cortex-A9 Dual ARM Cortex-A9 Dual ARM Cortex-A9 Dual ARM Cortex-A9
Transceivers Yes (3.125 Gbps) Yes (3.125 Gbps) Yes (3.125 Gbps) Yes (3.125 Gbps) Yes (3.125 Gbps) Yes (3.125 Gbps)
Temperature Grade Industrial (-40 C to +100 C) Industrial (-40 C to +100 C) Commercial (0 C to +85 C) Commercial (0 C to +85 C) Commercial (0 C to +85 C) Automotive (-40 C to +125 C)
Speed Grade I7N (7 speed, fastest) I7LN (7 speed) C8 (8 speed, slower) C7 (7 speed) C6 (6 speed, slowest) A7 (7 speed)
Lead-Free Finish Yes Yes (lead-free suffix L) Yes Yes Yes Yes

주요 차별점

  • Industrial temperature range with same die as commercial variants (vs 5CSXFC2C6U23C7N)
  • Automotive temperature grade option for harsh environments (vs 5CSXFC2C6U23A7N)
  • Integrated 3.125 Gbps transceivers eliminate external SERDES (vs 5CSEBA6U23I7N (Cyclone V SE))

설계 노트

Plan power sequencing carefully for the 5CSXFC2C6U23I7N: the HPS, FPGA fabric, and transceivers each require separate rail ramp-up per the Cyclone V Power Management User Guide. Use a dedicated power management IC like the LTC3612 or Enpirion EM2xx family with programmable sequencing to avoid latch-up. Total worst-case power budget should allocate ~0.6 W for HPS, 1-2 W for fabric at moderate utilisation, and 0.5 W per active transceiver channel.

At typical industrial workloads the 5CSXFC2C6U23I7N dissipates 3-6 W total, which the 672-UBGA package can handle with a 4-layer FR4 PCB and adequate thermal vias. Reference Altera's thermal management guidelines: place a thermal via array (0.3 mm pitch, 0.2 mm drill) under the centre thermal pad, connect inner copper planes with at least 2 oz copper weight. For conduction-cooled VPX chassis, use the package's exposed thermal pad with a thermal interface material (TIM) rated for at least 5 W/mK thermal conductivity.

Use a 12-layer or 14-layer stack-up for the 5CSXFC2C6U23I7N to provide dedicated ground and power planes for the 672-BGA escape. The 1.0 mm ball pitch demands laser-drilled microvias or 4 mil via-in-pad for inner-row BGA breakouts. Route all HPS MIO signals on the top layer with length matching; assign FPGA user I/O flexibly but reserve differential pairs for transceivers and DDR3 with 100-ohm controlled impedance. Estimate: each BGA escape uses approximately 8 routing layers minimum.

Estimated: when porting a 5CSXFC2C6U23I7N design to the commercial-grade 5CSXFC2C6U23C8N, the lower temperature limit (0 C vs -40 C) means chassis-mount cold-start environments (outdoor cabinets, unheated warehouses) will fail - always match temperature grade to deployment. Do not confuse the I7N and I7LN suffixes: both are industrial-temperature, but LN denotes lead-free finish per the historical Cyclone V nomenclature. The trailing N indicates RoHS compliance.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
무연
Yes
무할로겐
Unknown
분쟁 광물
Compliant

RoHS compliant per Altera/Intel product page. Industrial temperature grade -40 C to +100 C. Not AEC-Q100 qualified - choose 5CSXFC2C6U23A7N automotive variant for AEC-Q100 contexts.

데이터 검증일: 2026-09-06 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

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