A3P060-2TQG144I - ProASIC3 FPGA 60K Gates 144-TQFP | Microchip
부품 번호: A3P060-2TQG144I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.8 | $258.00 |
| 100 | $23.1 | $2,310.00 |
| 500 | $20.9 | $10,450.00 |
| 1,000 | $18.6 | $18,600.00 |
A3P060-2TQG144I 개요
A field programmable gate array is a semiconductor device containing a fabric of programmable logic blocks and interconnects that designers configure in the field. Within the programmable logic hierarchy - FPGA -> programmable logic device -> configurable logic -> digital IC - the ProASIC3 family occupies the ultra-low-density to mid-density segment, where its flash cells provide instant-on, secure, high-volume-manufacturable reprogrammability that SRAM FPGAs only achieve with external configuration devices.
Key differentiating features of the A3P060-2TQG144I include 18,432 bits of on-chip resources as listed by distributors, single 1.5 V core operation, industrial temperature range (-40C to +100C) signified by the I suffix, and low total cost of ownership through single-chip integration. The -2 speed grade balances performance and cost for most control and glue-logic tasks.
Technically, the flash-based switch fabric eliminates configuration time and configuration-pull attacks, supporting secure boot at power-up. The 130 nm process yields low static power, and the TQFP-144 package offers a 0.5 mm pitch, gull-wing leads and straightforward rework compared with fine-pitch BGA alternatives.
Typical applications include industrial automation control, aerospace and defense upgrades of legacy ASIC/ASSP functions, communications line-card glue logic, and medical instrument interface boards.
Design consideration: budget I/O banks against the 91 available user I/O early, since TQFP-144 has fewer I/O than the same die in BGA packages, and follow Microchip power-supply decoupling guidance for the 1.5 V core and 3.3 V I/O rails.
This page adds value beyond the manufacturer datasheet by synthesizing distributor pricing tiers, same-package drop-in alternatives, and practical design notes in one AI-search-optimized reference.
드롭인 대체품: A3P060-2TQG144I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P060-2TQG144I (동일 폼 팩터 및 풋프린트) — 차이점: Package, Configuration, Logic Elements, Process Technology, System Gates.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P060-1TQG144I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
A3P060-2TQG144
✅ 드롭인✓ 재고 있음
$8.1 / 개
데이터시트 보기 →A3P060-1TQG144
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
A3P060L-1TQG144I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
A3P060-2TQG144M
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
A3P060-2TQG144I 최대 정격 & 전기적 특성
| Family | ProASIC3 |
| Number of Gates | 60000 |
| Logic Resources | 18432 |
| Maximum System Frequency | 310 MHz |
| Process Technology | 130 nm flash |
| Core Supply Voltage | 1.5 V |
| Number of User I/O | 91 |
| Speed Grade | -2 |
| 패키지 | 144-pin TQFP (TQG144) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +100C (Industrial, I suffix) |
| Configuration Memory | Non-volatile Flash (single-chip) |
| Packaging | Tray |
| Programmability | In-system reprogrammable |
A3P060-2TQG144I 144-pin tqfp (tqg144) 핀 구성 가이드
A3P060-2TQG144I(144-pin tqfp (tqg144) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P060-2TQG144I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P060-2TQG144I 적합 용도: 6 애플리케이션s: Industrial Automation Control, Aerospace and Defense Legacy Upgrades, Communications Line-Card Glue Logic, Medical Instrument Interface Boards, Test and Measurement Equipment, Secure Embedded Controllers.
Industrial Automation Control
The A3P060-2TQG144I fits industrial control boards that need deterministic, reprogrammable logic for sensor aggregation, motor sequencing, and PLC I/O expansion. Its 60K gates and 18432 logic resources absorb counter/timer arrays, state machines, and bus interfaces, while the industrial -40C to +100C rating tolerates factory-floor temperature swings that commercial parts cannot. Because the flash fabric is non-volatile and single-chip, the controller boots instantly without a configuration PROM, cutting BOM cost and improving uptime. The 91 user I/O at 3.3 V interface directly with 24 V-buffered sensor front ends, and the 144-pin TQFP can be reworked in low-volume repair depots. Instant-on behavior also supports safety-relevant interlocks that must be active within milliseconds of power-up.
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Aerospace and Defense Legacy Upgrades
Defense primes use the A3P060-2TQG144I to replace obsolete ASICs, SSI/MSI glue logic, and gate arrays in avionics and ground systems. The flash-based fabric provides configuration security - no external bitstream is exposed on the bus - and the industrial grade covers the -40C to +100C range typical of black-box equipment. A 60K-gate capacity matches the mid-density replacements most common in legacy redesigns, while the 310 MHz performance ceiling handles timing-critical interface bridges. The TQFP-144 package solders onto boards designed before BGA rework became routine, easing depot-level maintenance. Microchip's long ProASIC3 lifecycle support gives program managers the continuity that military programs require, and single-chip instant-on boot removes configuration readout risks in secure platforms.
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Communications Line-Card Glue Logic
In telecom and networking line cards, the A3P060-2TQG144I serves as bridge logic between a CPU and PHY devices, implementing address decoding, status multiplexing, and reset distribution. Its 310 MHz system performance comfortably meets 100 MHz-class synchronous interface timing, and 91 user I/O cover multiple 8/16-bit buses in one device. Because ProASIC3 is flash-based, the card is functional the instant power is applied - important for hot-swap and redundant-slot systems that cannot tolerate configuration latency. The 1.5 V core keeps static power low for thermally constrained shelf equipment. The 144-pin TQFP footprint also simplifies last-minute ECO spins compared with fine-pitch BGA parts, shortening hardware iteration cycles during system bring-up.
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Medical Instrument Interface Boards
Benchtop medical instruments - patient-monitor front ends, lab analyzers, and imaging peripherals - use the A3P060-2TQG144I to consolidate sensor-timing generators, filter control, and host interfaces. The 60K-gate fabric and 18432 logic resources implement precise trigger/timing engines that microcontrollers cannot match deterministically, while 91 I/O connect ADCs, limit switches, and display buses. The -40C to +100C industrial rating provides margin for equipment validated over extended environmental ranges, and instant-on flash configuration means measurement channels are ready before the host OS finishes booting. The TQFP-144 package supports hand rework during regulatory design iterations, and ProASIC3 lifecycle stability supports the long service life and re-qualification cycles medical device programs demand.
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Test and Measurement Equipment
Prototyping fixtures, FPGA-assisted pattern generators, and rack instruments exploit the A3P060-2TQG144I's reprogrammability: designs can be rewritten in the field through the JTAG/FlashPro interface without physical changes. The 310 MHz capability and 60K gates implement counters, pattern engines, and protocol checkers, while the non-volatile flash eliminates the configuration devices that clutter portable instruments. The industrial temperature range suits equipment used near environmental chambers, and 91 user I/O provide enough pins for multi-channel digital acquisition heads. Because TQFP leads are visible and probe-able, the package is ideal for education and bring-up benches where signal inspection matters. Instant-on boot also ensures test fixtures are ready the moment rack power sequencing completes.
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Secure Embedded Controllers
Designers building secure embedded systems choose the A3P060-2TQG144I because the ProASIC3 flash cell stores the bitstream on-chip with readback protection, so no external configuration device exposes design IP on a bus. The 60K-gate fabric implements crypto-acceleration wrappers, secure state machines, and anti-tamper sequencing alongside the application logic, and the instant-on fabric can enforce hold-off behavior from the first clock. Industrial -40C to +100C operation covers locked outdoor cabinets and vehicle bays. With 91 I/O, one device can manage smart-card interfaces, tamper switches, and a communication PHY simultaneously. Compared with SRAM FPGAs, the absence of a configuration bitstream fetch removes a whole class of interception attacks documented in Microchip's ProASIC3 security literature.
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추천 제품 요약
엔지니어링 참조 데이터: A3P060-2TQG144I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P060-1TQG144I | A3P060-2TQG144 | A3P060-1TQG144 | A3P060L-1TQG144I | A3P060-2TQG144M |
|---|---|---|---|---|---|---|
| Package | 144-TQFP (TQG144) | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Number of Gates | 60000 | 60000 | 60000 | 60000 | 60000 | 60000 |
| Speed Grade / Max Performance | -2 / 310 MHz | -1 / lower than 310 MHz | -2 / 310 MHz | -1 / lower than 310 MHz | -1 / lower than 310 MHz | -2 / 310 MHz |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | -40C to +100C (Industrial) | Military grade range |
| User I/O | 91 | 91 | 91 | 91 | 91 | 91 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Configuration Memory | Non-volatile flash, single-chip | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash (low-power) | Non-volatile flash |
주요 차별점
- Fastest standard speed grade of the A3P060 family (vs A3P060-1TQG144I)
- Industrial temperature rating for harsh environments (vs A3P060-2TQG144)
- Standard power variant for maximum performance (vs A3P060L-1TQG144I)
설계 노트
Power the A3P060-2TQG144I core from a clean 1.5 V rail and each I/O bank VCCI from its standard voltage (typically 3.3 V). Decouple every VCC/VCCI pin pair with at least 100 nF ceramic placed within 2 mm of the pin, plus local bulk capacitance of 10 uF per bank. Sequence is not strict on ProASIC3, but hold I/O in tristate until VCCI is valid if external buses could be back-driven. Estimate core current with Microchip's power calculator using your post-route netlist - do not rely on worst-case gate-count extrapolation.
The TQFP-144 package dissipates heat primarily through its leads. Estimated: for a design drawing 50 mA at 1.5 V core plus moderate I/O switching, power dissipation stays below 200 mW and no heatsinking is needed; however, if many 3.3 V I/O drive heavy loads, junction rise can grow quickly. Verify theta_JA from the ProASIC3 package chapter and keep junction temperature below the industrial maximum with margin. Adding 2 oz copper and thermal vias under the board area below the package is a low-cost improvement.
Do not treat the -2 speed grade as interchangeable with -1 without re-running timing closure in Libero SoC; the 310 MHz headline is a fabric capability, not a guaranteed path delay. Confirm that your design's I/O count fits within 91 user I/O including JTAG and programming pins before committing to TQFP-144 - the same die in VQG100 or FGG144 packages has different I/O budgets. Finally, since the fabric is flash-based, beware of reusing a bitstream compiled for a different A3P060 package without retargeting pin assignments.
규정 준수 정보
Compliance status not stated in retrieved data. Verify RoHS/REACH/lead-free status on the Microchip product page or via certificate of conformance. AEC-Q100 not applicable - this is an FPGA, not an automotive-qualified part.
