A3P600L-1FG144 - 600K-Gate ProASIC3L Flash FPGA | Microchip
부품 번호: A3P600L-1FG144 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $32.16 | $32.16 |
| 10 | $30.55 | $305.50 |
| 100 | $28.94 | $2,894.00 |
| 500 | $27.34 | $13,670.00 |
| 1,000 | $25.73 | $25,730.00 |
A3P600L-1FG144 개요
A flash-based FPGA is a field programmable gate array whose configuration data is stored in on-chip flash memory rather than an external configuration device. Within the programmable logic hierarchy, the ProASIC3L belongs to the FPGA -> programmable logic IC -> semiconductor taxonomy. Because the configuration is nonvolatile, the device powers up instantly with single-chip operation, requiring no boot PROM and offering inherent resistance to configuration readback (SEU-tolerant by architecture).
Key features include the low-power 'L' variant optimized for 1.2 V to 1.5 V core operation, 130 nm flash process technology, reprogrammability without an external controller, and abundant advanced features such as embedded block RAM with a total of 110592 bits of configuration/user resources reported by distributors. ProASIC3 offers high performance in ultra-low-density FPGA applications as a single-chip solution with a small footprint.
The ProASIC3L fabric uses VersaTile logic elements supporting both combinatorial and sequential logic, combined with embedded SRAM blocks for data buffering. Flash switching elements eliminate the standby configuration power of SRAM-based FPGAs and simplify power sequencing and supply design in space- and power-constrained systems.
Typical applications include industrial automation control, portable and battery-powered instrumentation, communications bridging and glue logic, aerospace system controllers, and secure single-chip designs where bitstream volatility is undesirable.
Designers should verify speed grade (-1) timing in Microchip Libero SoC and budget I/O banks according to the 97 available user I/Os on the FG144 package.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: A3P600L-1FG144 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P600L-1FG144 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Technology, System Gates, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P600L-1FG144I
✅ 드롭인✓ 재고 있음
$32.16 / 개
데이터시트 보기 →A3P600-2FGG144I
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$44.6 / 개
데이터시트 보기 →A3P1000-2FGG144I
✅ 드롭인✓ 재고 있음
$27.2 / 개
데이터시트 보기 →A3P1000-1FGG144T
✅ 드롭인✓ 재고 있음
$75 / 개
데이터시트 보기 →A3P600-1FG144
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$44.6 / 개
데이터시트 보기 →A3P600L-1FG144 최대 정격 & 전기적 특성
| Family | ProASIC3L (ProASIC3 Low Power) |
| System Gates | 600K |
| User I/O | 97 |
| Configuration Memory | 110592 (flash-based, nonvolatile) |
| Core Voltage | 1.2 V to 1.5 V |
| Process Technology | 130 nm |
| Speed Grade | -1 |
| 패키지 | 144-LBGA (FBGA / FG144) |
| 실장 유형 | Surface Mount |
| Configuration Type | Flash (single-chip, instant-on) |
| Series | ProASIC3 |
| 동작 온도 | 0C to +85C (commercial, per distributor listing) |
| Temperature Variant (I suffix) | -40C to +100C (A3P600L-1FG144I) |
| Programming | In-system reprogrammable via JTAG |
| Packaging | Tray |
A3P600L-1FG144 144-lbga (fbga / fg144) 핀 구성 가이드
A3P600L-1FG144(144-lbga (fbga / fg144) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P600L-1FG144.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P600L-1FG144 적합 용도: 6 애플리케이션s: Industrial Automation and Control, Portable and Battery-Powered Instrumentation, Communications Bridging and Glue Logic, Secure Single-Chip and SEU-Tolerant Systems, Aerospace-Adjacent and Harsh-Environment Control, Display and Video Interface Logic.
Industrial Automation and Control
In industrial control and factory automation, the A3P600L-1FG144 provides flexible glue logic, motor-drive interfacing, and sensor aggregation on a single 600K-gate flash fabric with 97 user I/Os. Its nonvolatile configuration means the controller FPGA is functional the instant 1.2 V core and I/O rails stabilize, eliminating the configuration-controller failure points common in SRAM FPGA systems on noisy factory floors. Distributor data confirms the commercial 0C to +85C rating suits enclosed cabinet environments, while the -1FG144I variant extends to -40C to +100C for outdoor panels. With 130 nm flash switching elements, static power stays low, easing sealed-enclosure thermal budgets. Libero SoC timing analysis at the -1 speed grade should verify interface timing against PLC and fieldbus IP cores.
추천
Portable and Battery-Powered Instrumentation
The 'L' in ProASIC3L denotes the low-power core variant supporting 1.2 V to 1.5 V operation, which is the headline reason to select the A3P600L-1FG144 in battery-powered instruments such as handheld meters, portable data loggers, and field test equipment. Flash-based switching elements draw no configuration standby current, and instant-on behavior lets the instrument wake to full operation without a boot sequence, extending usable battery life in duty-cycled designs. The compact 144-ball FBGA keeps PCB area small in handheld enclosures, and 97 user I/Os interface displays, keypads, and acquisition front ends. Designers should use SmartPower in Libero SoC to model sleep and active states and confirm the 600K-gate capacity covers the instrument's datapath and control logic.
추천
Communications Bridging and Glue Logic
Backplane and board-level communications designs use the A3P600L-1FG144 as protocol bridging fabric, level-shifting I/O aggregation, and PCIe/CPU companion glue logic. With 600K gates and 97 I/Os in the FG144 package, it absorbs asynchronous bus translation, FIFO buffering, and handshaking that would otherwise consume many discrete devices. The flash fabric's SEU-tolerant, nonvolatile configuration improves link availability in always-on networking hardware, and single-chip instant-on removes the config flash boot delay from link-up time. Designers must validate -1 speed grade timing for the target protocol in Libero SoC and bank the 97 I/Os by voltage domain per the datasheet. Higher-capacity A3P1000 in the same FG144 footprint offers a pin-compatible growth path if bridging logic expands.
추천
Secure Single-Chip and SEU-Tolerant Systems
Flash-based FPGAs such as the A3P600L-1FG144 are selected where configuration security and single-event-upset robustness matter: there is no external configuration bitstream on a bus to intercept, and the flash switching architecture is inherently less susceptible to configuration upsets than SRAM cells. This makes the device attractive for secure industrial controllers, encrypted storage subsystem logic, and system controllers in avionics-adjacent commercial equipment. The 600K-gate capacity hosts cryptographic wrapper logic, state machines, and watchdog functions alongside application fabric, with 97 I/Os sufficient for multi-domain interfacing. Design teams should combine the fabric's resilience with Microchip's design security features in Libero SoC and follow the family datasheet guidelines for supply sequencing on the 1.2 V to 1.5 V core rail.
추천
Aerospace-Adjacent and Harsh-Environment Control
Although ProASIC3 is not a radiation-hardened family, its flash configuration and instant-on architecture make commercial ProASIC3L devices a common choice in ground-support equipment, test benches, and non-critical avionics-adjacent control systems. The A3P600L-1FG144I extends temperature rating to -40C to +100C for outdoor and unheated enclosures. The 600K-gate fabric implements telemetry formatting, actuator sequencing, and redundant-sensor voting logic, while flash immunity to configuration loss during power transients reduces reset logic complexity versus SRAM FPGAs. Designers should derate the -1 speed grade timing across the full industrial temperature range using Libero SoC corner analysis, and verify I/O bank voltage schemes against the datasheet before releasing the 144-ball FBGA layout for flight-line hardware.
추천
Display and Video Interface Logic
The A3P600L-1FG144 serves as scan-conversion, panel-timing, and video-bridge logic in industrial displays, kiosks, and embedded vision systems. Its 97 user I/Os accommodate parallel RGB/LVDS-translator interfaces, and 600K gates hold line buffers alongside the timing generator in the embedded SRAM of the ProASIC3L fabric. Flash-based instant-on means panel timing is active as soon as supplies stabilize, avoiding blank-screen boot gaps that SRAM FPGAs exhibit while loading configuration. At the -1 speed grade, designers should confirm pixel-clock and shift-register timing closure in Libero SoC for the target resolution before layout. For higher pixel throughput, the pin-compatible A3P1000 in the same FG144 footprint provides additional fabric and RAM with no PCB change.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P600L-1FG144 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P600L-1FG144I | A3P600-2FGG144I | A3P1000-2FGG144I | A3P600-1FG144 |
|---|---|---|---|---|---|
| Package | 144-FBGA (FG144) | 144-FBGA (FG144) - same | 144-FBGA (FG144) - same | 144-FBGA (FG144) - same | 144-FBGA (FG144) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600K | 600K | 600K | 1000K (approx.) | 600K |
| Speed Grade | -1 (low-power L core) | -1 | -2 (faster) | -2 (faster) | -1 |
| Core Voltage | 1.2 V to 1.5 V (L variant) | 1.2 V to 1.5 V | 1.5 V (standard core) | 1.5 V (standard core) | 1.5 V (standard core) |
주요 차별점
- Low-power 1.2 V core operation (vs A3P600-2FGG144I)
- Industrial temperature margin via drop-in (vs A3P600L-1FG144I)
- Cost-optimized 600K capacity vs same-footprint 1M (vs A3P1000-2FGG144I)
설계 노트
The 'L' variant supports a 1.2 V to 1.5 V core supply. Verify your power tree: standard ProASIC3 (non-L) parts in the same footprint typically expect a 1.5 V core, so substituting between A3P600L and A3P600 requires checking the core rail. Use Microchip's SmartPower analyzer in Libero SoC to estimate static and dynamic power across your clock tree; flash fabric eliminates SRAM configuration standby current, but I/O bank loads dominate in high-toggle designs. Confirm power-up sequencing and ramp rates per the family datasheet before release.
The 144-ball FBGA (0.8 mm-class ball pitch fine-pitch BGA) requires a controlled PCB stackup. Follow the datasheet land-pattern recommendation and place decoupling capacitors on the ball-out side of the package, one capacitor per core/PLL supply pin, as close as routing allows. Fan out with via-in-pad or dog-bone escapes and verify all 97 user I/O bank voltage domains against your schematic before fabrication - bank assignments on FG144 parts are fixed by the ball map and cannot be redefined in layout.
Common pitfalls: (1) treating the -1 speed grade as interchangeable with -2 parts - timing closure must be re-run in Libero SoC when changing speed grades; (2) assuming the A3P600L and A3P600 are electrically identical - core voltage differs; (3) forgetting JTAG programming access - reserve the FlashPro JTAG connector footprint even in production, since in-system updates are the main advantage of the flash fabric; (4) sourcing commercial grade (0C to +85C) for outdoor designs - specify the I suffix variant instead.
규정 준수 정보
Distributor pages reviewed as of 2026-08-31 do not explicitly state RoHS/lead-free status; verify against Microchip product page or certificate of conformance.
