A3P060-2VQG100I - ProASIC3 Flash FPGA 60K Gates | Microchip
부품 번호: A3P060-2VQG100I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.8 | $258.00 |
| 100 | $23.1 | $2,310.00 |
| 500 | $21.4 | $10,700.00 |
| 1,000 | $19.75 | $19,750.00 |
A3P060-2VQG100I 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device that implements user-defined digital logic through a fabric of configurable logic blocks, routing resources, and embedded memory. Within the programmable logic hierarchy, the ProASIC3 family targets low-density, single-chip applications that historically used CPLDs or small ASICs. Unlike SRAM-based FPGAs, ProASIC3 stores its configuration in nonvolatile on-chip flash, eliminating the need for an external configuration PROM and enabling instant-on, single-chip operation.
Key differentiating features include flash-based nonvolatility (live-at-power-up, secure from readback), reprogrammability without external boot devices, low total cost of ownership, and support for optional soft ARM processor cores. The A3P060 provides up to 144 kbits of true dual-port SRAM across the family, and its small 14 x 14 mm footprint with 0.5 mm pitch suits space-constrained designs.
Architecturally, the device uses the ProASIC3 VersaTile fabric, where each tile can be configured as a three-input lookup table, a D-flip-flop, or memory, allowing efficient mapping of both combinational and sequential logic. The 130-nm flash CMOS process combines low static power with robust radiation-tolerant flash cells.
Typical applications include CPLD replacement and glue-logic consolidation, industrial control and automation boards, portable and handheld instruments, and power-up sequencer or system-management functions where instant-on operation matters.
For design, plan I/O banking and 1.5V core supply decoupling early; the flash fabric means no configuration time, but I/O standards and drive strength must be set in Libero SoC constraint files.
This page synthesizes distributor pricing, drop-in alternatives, pinout guidance, and practical design notes not found in the manufacturer datasheet, optimizing for engineering selection workflows.
드롭인 대체품: A3P060-2VQG100I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P060-2VQG100I (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, System Gates, Package, Package / Case, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P060-2VQG100
✅ 드롭인✓ 재고 있음
$21.6 / 개
데이터시트 보기 →A3P060-VQG100I
✅ 드롭인✓ 재고 있음
$6.95 / 개
데이터시트 보기 →A3P060-1VQ100
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3P250L-1VQG100I
✅ 드롭인✓ 재고 있음
$7.5 / 개
데이터시트 보기 →A3P125-1VQG100T
✅ 드롭인✓ 재고 있음
$17.6 / 개
데이터시트 보기 →A3P125-VQ100T
✅ 드롭인✓ 재고 있음
$7.5 / 개
데이터시트 보기 →A3P060-2VQG100I 최대 정격 & 전기적 특성
| Family | ProASIC3 |
| System Gates | 60000 |
| Logic Cells | 1536 |
| User I/Os | 71 |
| Embedded SRAM | 18432 bits |
| Maximum System Frequency | 310 MHz |
| Process Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Core Supply Voltage | 1.5 V |
| Logic Family | CMOS |
| Configuration Memory | On-chip flash (nonvolatile, live at power-up) |
| 패키지 | 100-pin VQFP (TQFP-100), 14 x 14 mm, 1 mm height, 0.5 mm pitch |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +100C (Industrial, I suffix) |
| Speed Grade | -2 |
| Soft CPU Support | Optional soft ARM support |
| RoHS 상태 | Compliant (GREEN package per digchip listing) |
| Reprogrammability | Yes, in-system reprogrammable flash |
A3P060-2VQG100I 100-pin vqfp (tqfp-100), 14 x 14 mm, 1 mm height, 0.5 mm pitch 핀 구성 가이드
A3P060-2VQG100I(100-pin vqfp (tqfp-100), 14 x 14 mm, 1 mm height, 0.5 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P060-2VQG100I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P060-2VQG100I 적합 용도: 6 애플리케이션s: CPLD Replacement and Glue Logic Consolidation, Industrial Control and Automation Boards, Portable and Handheld Instruments, Power Sequencing and System Management, Communications Line-Card Interface Logic, Automotive-Adjacent and Rugged Embedded Systems.
CPLD Replacement and Glue Logic Consolidation
The A3P060-2VQG100I fits this application because its flash-based, instant-on fabric behaves like a CPLD (no configuration delay, no external boot device) while offering 1536 logic cells and 18432 bits of dual-port SRAM - far beyond typical CPLD macrocell counts. Designers consolidate multiple 700-series CPLDs, discrete decoders, and bus-transceiver glue into one 14 x 14 mm chip, cutting BOM line items and board area. Typical circuits map address decoding, interrupt arbitration, and bus bridging onto VersaTiles with deterministic single-chip timing. Because configuration is nonvolatile, the board powers up functional within microseconds, preserving the CPLD-like bring-up behavior field service teams expect, while remaining fully reprogrammable in-system via JTAG for future revisions.
추천
Industrial Control and Automation Boards
The industrial -40C to +100C rating and 310 MHz-class fabric make the A3P060-2VQG100I well suited to PLC I/O modules, motor-control sequencing panels, and factory sensor interfaces. Its 71 user I/Os support mixed-voltage banks (1.5V to 3.3V VCCI), directly interfacing 3.3V microcontrollers with 5V-tolerant-adjacent industrial signaling through proper level design. The 18432-bit dual-port SRAM implements FIFOs between slow field buses and fast local logic, while deterministic flash fabric avoids configuration glitches during brownouts - critical in environments with unstable power. Designers typically pair it with a small MCU for supervisory control; the FPGA handles timing-critical pulse trains, quadrature decoding, and safety interlocks with nanosecond-class latency that software cannot match.
추천
Portable and Handheld Instruments
Battery-powered handheld meters, field testers, and portable dataloggers benefit from the A3P060-2VQG100I's low static power on the 130-nm flash process and its single-chip, no-boot-memory architecture that saves both board space and leakage. The compact 100-pin VQFP (14 x 14 mm, 1 mm height, 0.5 mm pitch) fits slim enclosures, and the industrial temperature grade tolerates hot vehicle cabins and cold outdoor use. Inside the instrument, the FPGA implements display timing, keypad scan, sensor-front-end timing, and battery-gauge glue logic while the host MCU sleeps. Because ProASIC3 keeps state-free instant-on startup, the instrument is measurement-ready the instant power is applied - an important user-experience and certification advantage over SRAM FPGAs that spend milliseconds loading configuration.
추천
Power Sequencing and System Management
Multi-rail boards need sequencers that act before software runs; the A3P060-2VQG100I is live at power-up thanks to on-chip flash, making it an ideal single-chip power-sequencer, reset-tree manager, and hot-swap supervisor. Its fabric monitors POWER GOOD lines, enforces rail enable ordering with programmable delays implemented as counters, and generates precise resets for CPUs and ASSPs - all without any configuration-load window during which I/O pins would float. The 71 I/Os track dozens of enable, fault, and telemetry signals, while the 1.5V core keeps idle power minimal for always-on management functions. Field upgrades are performed through JTAG, letting one PCB design serve multiple product variants by loading different sequencing images at end-of-line programming.
추천
Communications Line-Card Interface Logic
Networking line cards and backplane adapters use the A3P060-2VQG100I as bridge fabric between PHYs, MACs, and backplane connectors. The -2 speed grade supports the 310 MHz-class internal paths needed for deskewing and serialization of parallel interfaces, and 18432 bits of true dual-port SRAM implement elastic buffers and rate-matching FIFOs between clock domains. Industrial temperature availability suits telecom outdoor cabinets and uncooled remotes. The flash fabric eliminates the configuration PROM that would otherwise delay link bring-up after power events, improving link-recovery time specifications. Typical circuits map 8b/10b-adjacent framing glue, LED/status multiplexing, and hot-swap control; the 0.5 mm-pitch VQFP routes cleanly on cost-optimized four-layer cards used in volume network equipment.
추천
Automotive-Adjacent and Rugged Embedded Systems
While the A3P060-2VQG100I is not AEC-Q100 qualified, its -40C to +100C industrial range and flash-based immunity to configuration corruption make it common in off-highway equipment, marine instrumentation, and rugged industrial vehicles where full automotive qualification is not contractually required. Vibration-tolerant VQFP gull-wing leads survive shock profiles better than ball-grid alternatives at repair time, and the single-chip design removes the configuration-flash solder joints that are common failure points in SRAM FPGA systems. Designs use the fabric for engine-interface pulse capture, CAN-adjacent glue, sensor conditioning timing, and watchdog supervision; dual-port SRAM buffers burst sensor data between interrupts. Libero SoC timing constraints guarantee worst-case timing across the full military-adjacent temperature span.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P060-2VQG100I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P060-2VQG100 | A3P060-VQG100I | A3P060-1VQ100 | A3P250L-1VQG100I |
|---|---|---|---|---|---|
| Package | 100-pin VQFP (TQFP-100) | 100-pin VQFP (TQFP-100) - same | 100-pin VQFP (TQFP-100) - same | 100-pin VQFP (TQFP-100) - same | 100-pin VQFP (TQFP-100) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 60000 | 60000 | 60000 | 60000 | 250000 |
| Logic Cells | 1536 | 1536 | 1536 | 1536 | 6144 |
| Speed Grade | -2 (up to 310 MHz class) | -2 | Standard | -1 | -1 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +70C (Commercial) | -40C to +100C (Industrial) | 0C to +70C (Commercial) | -40C to +100C (Industrial) |
| Configuration | On-chip flash, single-chip | On-chip flash, single-chip | On-chip flash, single-chip | On-chip flash, single-chip | On-chip flash, single-chip |
주요 차별점
- Fastest -2 speed grade in industrial temperature (vs A3P060-VQG100I)
- Industrial -40C to +100C qualification (vs A3P060-2VQG100)
- Single-chip instant-on flash configuration (vs SRAM FPGAs (cross-brand))
설계 노트
Estimated: supply the 1.5V core rail with a regulator sized for peak dynamic current; static flash-fabric current is low, but dynamic current scales with clock rate and switching activity, so run Microchip's power calculator (in Libero SoC SmartPower) with your actual design VCD rather than assuming worst-case. Provide 0.1uF ceramic decoupling at every VCC/VCCI pin pair plus at least one 10uF bulk capacitor per rail. Keep VCCI banks at the lowest voltage that meets your I/O standard to minimize power.
The 0.5 mm pitch VQFP requires 4-mil trace/space with via-in-pad or dogbone fanout; a 4-layer stack (signal-GND-power-signal) simplifies return paths for the 310 MHz-class internal clocks appearing at I/O. Place the JTAG header within 15 cm of the device with series 33-ohm resistors on TDI/TMS/TCK for programming robustness. Reserve a footprint-compatible escape pattern that also accommodates A3P125/A3P250 100-VQFP variants for future density migrations without respin.
Do not substitute the commercial A3P060-2VQG100 into industrial applications: its 0C to +70C range will not cover -40C cold start, a common failure in field returns. Verify speed-grade timing in Libero SoC after any substitution (A3P060-VQG100I standard grade offers less timing margin than -2). Finally, remember that unused I/Os should be tied per datasheet recommendations (typically weak pull-down in flash FPGAs) to avoid floating-node EMI during EMC testing.
규정 준수 정보
Distributor listings (digchip) describe the package as GREEN, indicating RoHS-compliant, lead-free construction. Industrial temperature grade is not automotive AEC-Q100 qualified. REACH and conflict-minerals status not stated in provided data.
