A3P600-2PQG208I - ProASIC3 FPGA 600K Gates 208-QFP | Microchip
부품 번호: A3P600-2PQG208I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $92.4 | $92.40 |
| 10 | $87.8 | $878.00 |
| 100 | $82.5 | $8,250.00 |
| 500 | $76.9 | $38,450.00 |
| 1,000 | $71.3 | $71,300.00 |
A3P600-2PQG208I 개요
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than an external configuration device. Within the programmable logic hierarchy, the ProASIC3 sits in the mainstream FPGA tier below high-end SRAM-based FPGAs, functioning as a system-level programmable logic IC. Because the configuration is nonvolatile, the A3P600 powers up instantly without a boot PROM, improving board reliability and reducing bill-of-materials cost.
Key features include low total cost of ownership, single-chip operation, secure flash-based configuration, and four I/O banks that allow pins with compatible voltage standards to share a bank supply (VCCIBx). The -2 speed grade provides the second-fastest timing grade in the family, and the 'I' suffix denotes the industrial temperature grade for extended-environment deployment.
Architecturally, the device uses ProASIC3 VersTiles arranged in a sea-of-tiles fabric with embedded flash switching elements, supporting a broad range of LVTTL/LVCMOS I/O standards with bank-selectable I/O voltages. Design entry and implementation use Microchip (formerly Actel/Microsemi) Libero SoC design tools, allowing RTL (Verilog/VHDL) synthesis through flash programming via JTAG.
Typical applications include industrial automation control, glue logic integration and board-level consolidation, communications and networking line cards, medical instrumentation, and aerospace/defense systems requiring nonvolatile, single-chip programmable logic.
Design consideration: verify I/O bank voltage assignments early, because only I/Os with compatible voltage standards may share a VCCIBx bank, and migration between A3P400/A3P600/A3P1000 densities depends on bank-routed supply pins.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: A3P600-2PQG208I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P600-2PQG208I (동일 폼 팩터 및 풋프린트) — 차이점: Package, System Gates, Configuration Memory, Operating Temperature, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P600-1PQG208I
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$68 / 개
데이터시트 보기 →A3P600-2PQG208
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$55.87 / 개
데이터시트 보기 →A3P600L-1PQG208I
✅ 드롭인✓ 재고 있음
$29 / 개
데이터시트 보기 →A3P600-1PQG208
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$49.94 / 개
데이터시트 보기 →A3P1000-2PQG208
✅ 드롭인✓ 재고 있음
$65.67 / 개
데이터시트 보기 →A3P600-2PQG208I 최대 정격 & 전기적 특성
| Family | ProASIC3 |
| System Gates | 600,000 |
| Logic Elements | 7,000 |
| User I/O | 154 |
| User Flash Memory Bits | 110592 |
| Maximum System Performance | 310 MHz |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| I/O Banks | 4 |
| Configuration Memory | On-chip flash (nonvolatile, reprogrammable) |
| Speed Grade | -2 |
| Temperature Grade | Industrial |
| 패키지 | 208-Pin PQFP (208-BFQFP), gull-wing, square |
| 실장 유형 | Surface Mount |
| Terminal Form | Gull Wing |
A3P600-2PQG208I 208-pin pqfp (208-bfqfp), gull-wing, square 핀 구성 가이드
A3P600-2PQG208I(208-pin pqfp (208-bfqfp), gull-wing, square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P600-2PQG208I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P600-2PQG208I 적합 용도: 6 애플리케이션s: Industrial Automation and Control, Board-Level Glue Logic Integration, Communications and Networking Line Cards, Medical Instrumentation, Aerospace and Defense Systems, Test and Measurement Equipment.
Industrial Automation and Control
The A3P600-2PQG208I fits industrial automation because its industrial temperature grade, nonvolatile flash configuration, and 154 user I/Os support sensor interfacing, motor-control sequencing, and machine-state logic in a single chip. The four I/O banks accept mixed LVTTL/LVCMOS voltage standards, so 3.3V sensors and 2.5V backplane signals can coexist with bank-selectable VCCIBx supplies. Because configuration is stored on-chip, control cards power up instantly after a line outage with no configuration load time, improving availability. Placed as the main sequencing and interface fabric between a host processor and field I/O, the device consolidates discrete glue logic and reduces board area; the trade-off is a 1.5V core rail that must be sequenced per Microchip power-up guidance.
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Board-Level Glue Logic Integration
The A3P600-2PQG208I is well suited to replacing clusters of 7400-series logic, CPLDs, and ASIC interface bridging on dense boards. With 600K gates and 7,000 logic elements, a single ProASIC3 device absorbs bus translation, address decoding, state machines, and timing adapters that would otherwise occupy dozens of SSI/MSI packages. The 208-pin PQFP with gull-wing leads is hand-solderable for prototyping, and the -2 speed grade supports 310 MHz-class internal operation, sufficient for most bus-bridging tasks. Because the fabric is flash-based and reprogrammable in-system via JTAG, interface changes can be deployed without board respins, cutting total cost of ownership for long-life industrial products that must absorb revision changes over a decade of production.
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Communications and Networking Line Cards
In networking equipment, the A3P600-2PQG208I implements frame formatting, framer interfacing, LED/link management, and backplane handshaking on line cards where instant-on operation matters. The 310 MHz maximum system performance covers the timing needs of parallel interface bridges at 100 Mbps-to-mid-gigabit line rates, and 154 user I/Os accommodate wide parallel PHY and switch-fabric buses. Flash configuration means the card is live the moment power is applied, which is valuable in redundant, hot-swappable systems. Designers should partition I/O so bank voltages match the connected PHY standards, since only I/Os with compatible voltage standards may share a VCCIBx bank, per Microchip's migration application note.
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Medical Instrumentation
Medical devices benefit from the A3P600-2PQG208I's single-chip, nonvolatile architecture, which reduces the component count that must be validated and removes configuration-storage failure points from reliability analyses. The 600K-gate capacity implements sensor timing controllers, acquisition sequencers, and display interface logic for diagnostic equipment, while the industrial temperature grade provides margin for equipment that must operate in varied clinical environments. The 1.5V core keeps dynamic power low in always-on monitoring systems. For signal chains adjacent to sensitive analog front ends, place the FPGA's I/O banks on clean 3.3V/2.5V supplies with adequate decoupling, and pair with low-noise LDO regulation to prevent logic switching noise from coupling into measurement channels.
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Aerospace and Defense Systems
The ProASIC3 architecture's flash-based, single-chip configuration has historically made the family popular in aerospace and defense subsystems, where external configuration PROMs are undesirable failure points and SRAM configuration bitstream interception is a security concern. The A3P600-2PQG208I supplies 600K gates for payload sequencing, telemetry formatting, and bus-interface logic in the industrial-temperature 208-PQFP, fitting New Space and embedded defense platforms seeking proven, widely second-sourced-class availability. Nonvolatile configuration also enables instant power-up for time-critical platforms such as CubeSats, where the FPGA must be operational within milliseconds of power application. Verify the specific qualification and screening requirements for the target program, as this 'I'-grade commercial unit may require up-screening.
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Test and Measurement Equipment
Bench and automated test instruments use the A3P600-2PQG208I as a timing and interface controller, generating trigger sequences, counters, and instrument bus (USB/GPIB-bridge) handshake logic. The -2 speed grade's 310 MHz-class performance supports precise internal timing generation, and 154 user I/Os drive front-panel indicators, relay controls, and multiple instrument buses concurrently. Flash configuration lets instruments resume their last programmed logic state instantly at power-on, improving user experience versus SRAM FPGAs that need boot time. When laying out the instrument board, keep the 208-pin PQFP's I/O bank supplies separated by function (timing versus panel versus bus) so voltage-standard assignments remain clean and future density migrations to A3P1000 in the same package remain feasible.
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추천 제품 요약
엔지니어링 참조 데이터: A3P600-2PQG208I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P600-1PQG208I | A3P600-2PQG208 | A3P600L-1PQG208I | A3P1000-2PQG208 |
|---|---|---|---|---|---|
| Package | 208-Pin PQFP (208-BFQFP) | 208-Pin PQFP - same | 208-Pin PQFP - same | 208-Pin PQFP - same | 208-Pin PQFP - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 1,000,000 |
| Speed Grade | -2 | -1 (slower) | -2 (same) | -1 (slower) | -2 (same) |
| Temperature Grade | Industrial | Industrial | Commercial | Industrial | Commercial |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V (low-power core spec) | 1.5 V |
| Configuration Memory | On-chip flash (nonvolatile) | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
주요 차별점
- Fastest commonly stocked speed grade in this package (vs A3P600-1PQG208I)
- Industrial temperature rating (vs A3P600-2PQG208)
- Standard-power core versus low-power variant (vs A3P600L-1PQG208I)
설계 노트
The A3P600-2PQG208I requires a 1.5V core supply (VCC) plus bank-selectable I/O supplies (VCCIB0-VCCIB3) and auxiliary supply per the ProASIC3 power architecture. Estimated: dynamic core current scales with clock frequency and toggle rate, so run Microchip's power calculator in Libero SoC with your actual design before sizing the regulator. Sequence VCC/VCCA before or together with I/O banks per the datasheet power-up requirements, and provide a power-good reset to user logic. Decouple each bank supply with at least 0.1uF per pin plus bulk capacitance near the 208-PQFP.
The 208-pin PQFP has 0.5mm-pitch gull-wing leads; use the datasheet-recommended land pattern and verify solder paste aperture design to avoid bridging on the fine pitch. Assign I/O pins so that each VCCIBx bank groups signals of one voltage standard - per Microchip's migration note, only I/Os with compatible voltage standards may share a bank, and bank supplies are routed through dedicated package pins, which constrains density migration to A3P400/A3P1000. Reserve JTAG (FlashPro) header access for in-system programming.
Do not assume a cross-brand FPGA can drop into this footprint - no Xilinx/Altera device is pin-compatible, so supply-risk planning must rely on same-family variants (A3P600-1PQG208I, A3P600L-1PQG208I). Also avoid reusing a -1 timing-verified design assumption when substituting the -2 part in reverse. Finally, confirm the Libero SoC version still supports ProASIC3 before starting a new design, and re-run static timing after any speed-grade change.
규정 준수 정보
MicrochipDirect lists a Conflict Minerals compliance resource for Microchip products, but specific RoHS/REACH status for A3P600-2PQG208I was not present in the provided web data. Verify on Microchip's RoHS Information page.
