A3P1000L-1FGG256 - ProASIC3L Flash FPGA 1M Gates | Microchip
부품 번호: A3P1000L-1FGG256 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $61.48 | $61.48 |
| 10 | $58.9 | $589.00 |
| 100 | $57.2 | $5,720.00 |
| 500 | $56.1 | $28,050.00 |
| 1,000 | $55.33 | $55,330.00 |
A3P1000L-1FGG256 개요
A flash-based FPGA is a field-programmable gate array whose configuration data is stored in on-chip nonvolatile flash cells rather than an external configuration ROM. Within the programmable logic hierarchy (FPGA -> programmable logic device -> semiconductor), flash FPGAs occupy a unique position: they are single-chip, Instant-On solutions that do not require a boot device, and their fabric is inherently more secure against bitstream interception than SRAM-based FPGAs.
Key features of the A3P1000L include nonvolatile flash programming (no external configuration flash needed), reprogrammability with live-at-power-up operation, 1.2 V to 1.5 V core voltage options across the family, and abundant advanced features such as embedded flash blocks. The 130 nm flash process gives ASIC-like unit cost at low volume and eliminates configuration-time security exposure.
Architecturally, ProASIC3L builds on the ProASIC3 fabric with VersaTiles - fine-grained logic tiles that implement both combinational and sequential functions - plus dedicated embedded memory and I/O structures. The -1 speed grade balances performance with power in battery-sensitive and thermally constrained systems.
Typical applications include industrial control, portable and battery-powered instrumentation, secure communications equipment, and aerospace/defense systems requiring instant-on, single-chip programmable logic.
A key design consideration: the L variant requires a 1.2 V core supply rail - verify your power tree before substituting a standard A3P1000, which may default to a different core voltage configuration.
This page synthesizes distributor pricing, same-footprint drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: A3P1000L-1FGG256 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P1000L-1FGG256 (동일 폼 팩터 및 풋프린트) — 차이점: System Gates, Configuration Memory, Family, Technology, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P1000L-FGG256
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3P1000-FGG256M
✅ 드롭인✓ 재고 있음
$27.85 / 개
데이터시트 보기 →A3P1000-1FGG256T
✅ 드롭인✓ 재고 있음
$112.06 / 개
데이터시트 보기 →A3P1000-FG256M
✅ 드롭인✓ 재고 있음
$50.87 / 개
데이터시트 보기 →A3P1000-2FGG256M
✅ 드롭인✓ 재고 있음
$25.8 / 개
데이터시트 보기 →A3P1000L-1FGG256 최대 정격 & 전기적 특성
| Family | ProASIC3L |
| Logic Elements / LEs | 11K LEs |
| System Gates | 1M gates (approx.) |
| Number of I/O | 177 |
| Embedded Memory | 147456 bit |
| Core Voltage | 1.2 V (low-power L variant) |
| Technology | 130 nm flash process |
| Configuration Memory | Nonvolatile flash, single-chip, Instant-On |
| Speed Grade | -1 |
| 패키지 | 256-LBGA (FBGA-256) |
| 실장 유형 | Surface Mount |
| Reprogrammability | Yes, in-system reprogrammable flash fabric |
| Security | Flash-based, secure nonvolatile bitstream storage |
A3P1000L-1FGG256 256-lbga (fbga-256) 핀 구성 가이드
A3P1000L-1FGG256(256-lbga (fbga-256) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P1000L-1FGG256.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P1000L-1FGG256 적합 용도: 6 애플리케이션s: Industrial Control and Automation, Battery-Powered Portable Instrumentation, Secure Communications Equipment, Aerospace and Defense Systems, Medical and Diagnostic Devices, Test and Measurement Systems.
Industrial Control and Automation
The A3P1000L-1FGG256 fits industrial control nodes that need reprogrammable glue logic, sequencing, and I/O expansion without a boot device. Its flash fabric powers up instantly with logic active, eliminating configuration delays that PLC backplanes cannot tolerate, and the nonvolatile bitstream resists tampering on the factory floor. With 177 user I/Os in a 256-ball FBGA, it consolidates communication bridges, encoders, and sensor interfaces that would otherwise need several CPLDs. The 1.2 V low-power core reduces cabinet heat dissipation in sealed enclosures, improving fanless MTBF. Designers typically pair it with a microcontroller for supervisory control, using the FPGA for deterministic parallel I/O and state machines, achieving ASIC-like integration at low-to-medium volumes.
추천
Battery-Powered Portable Instrumentation
Portable test and measurement instruments benefit directly from the A3P1000L-1FGG256's 1.2 V low-power core, which cuts dynamic power relative to the standard A3P1000 and extends battery runtime in handheld analyzers and field loggers. Because configuration is stored on-chip in flash, the instrument is Instant-On at power-up - important for meters that must be ready within milliseconds of a switch press - and no external configuration flash current or boot logic is required. The 256-ball FBGA keeps board area small for handheld enclosures, while 177 I/Os handle displays, touch interfaces, and front-end acquisition logic. Sleep-mode I/O controls further reduce quiescent drain between measurements in duty-cycled designs.
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Secure Communications Equipment
The A3P1000L-1FGG256 addresses secure communications designs where bitstream protection is mandatory. SRAM FPGAs expose configuration data on an external flash device at every boot; the ProASIC3L stores configuration in on-chip nonvolatile flash, removing the primary interception vector and enabling single-chip boards with fewer attack surfaces. The approximately 1M-gate fabric implements protocol bridging, encryption wrappers, and bus formatting for radios and secure gateways, while the Instant-On property guarantees link availability the moment power is applied - a requirement in always-on defense and infrastructure equipment. The 130 nm flash process also supports design-lock features described in Microchip's ProASIC3 security documentation for IP protection.
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Aerospace and Defense Systems
The ProASIC3L architecture descends from Microsemi's radiation-tolerant heritage, making the A3P1000L-1FGG256 a natural fit for New Space avionics, payload controllers, and defense subsystems that demand flash-based, configuration-error-immune logic. Single-event configuration upsets that corrupt SRAM FPGAs are structurally mitigated by the nonvolatile flash cell; the device powers up configured with no external configuration store that could fail in vibration or thermal-cycling environments. The 256-ball FBGA's ball array withstands mechanical stress better than fine-pitch peripheral-lead packages, and the 1.2 V core reduces power budgets on solar-constrained platforms. Engineers should evaluate Microchip's RT-provisioned ProASIC3 family members for formal mission programs.
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Medical and Diagnostic Devices
Medical diagnostic equipment - portable ultrasound front ends, patient monitors, and lab analyzers - uses the A3P1000L-1FGG256 to interface mixed-signal acquisition chains with processing subsystems. The low 1.2 V core helps meet stringent power and thermal limits in patient-worn or bedside equipment, while Instant-On flash configuration ensures the device is operational the moment mains or battery power appears, with no configuration boot delay during safety-critical startup sequences. The 147456-bit embedded flash and 177 I/Os support sensor multiplexing, filter control, and display interfaces in one chip. Its deterministic fabric also suits IRB-audited designs where fixed, non-secret-configurable behavior must be documented and locked.
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Test and Measurement Systems
Bench and automated test equipment exploits the A3P1000L-1FGG256 as reconfigurable timing, trigger, and bus-interface logic. The 11K-logic-element fabric handles pattern generators, protocol analyzers, and time-stamping engines, while the -1 speed grade provides adequate system performance for these control-plane tasks at lower power than faster-graded siblings. Because the design file can be updated in the field via the flash fabric's reprogrammability, instrument vendors ship one PCB across product tiers and unlock features in firmware - a proven BOM-consolidation strategy. The 256-ball FBGA simplifies rework relative to finer-pitch packages, supporting long-service-life test platforms that need board-level repairability.
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추천 제품 요약
엔지니어링 참조 데이터: A3P1000L-1FGG256 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P1000L-FGG256 | A3P1000-FGG256M | A3P1000-1FGG256T | A3P1000-FG256M |
|---|---|---|---|---|---|
| Package | 256-FBGA (FGG256) | 256-FBGA (FGG256) - same | 256-FBGA (FGG256) - same | 256-FBGA (FGG256) - same | 256-FBGA (FG256) - same footprint |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1M (approx.) | 1M | 1M | 1M | 1M |
| User I/O | 177 | 177 | 177 | 177 | 177 |
| Embedded Flash | 147456 bit | 147456 bit | 147456 bit | 147456 bit | 147456 bit |
| Core Voltage | 1.2 V (L low-power) | 1.2 V (L) | Standard A3P1000 core | Standard A3P1000 core | Standard A3P1000 core |
| Configuration | Nonvolatile flash, Instant-On | Nonvolatile flash, Instant-On | Nonvolatile flash, Instant-On | Nonvolatile flash, Instant-On | Nonvolatile flash, Instant-On |
주요 차별점
- Low-power 1.2 V core (vs A3P1000-FGG256M)
- Verified -1 speed grade availability (vs A3P1000L-FGG256)
- Instant-on single-chip flash fabric (vs SRAM-based FPGAs (e.g. Xilinx/Intel equivalents))
설계 노트
The L variant requires a 1.2 V core rail. Power the 1.2 V core from a dedicated low-noise buck or LDO and sequence it per the ProASIC3 DS50003269 power-up requirements - do not share the rail with other 1.2 V loads that could sag during FPGA configuration. Verify I/O bank VCCI levels independently; the 177 user I/Os are grouped into banks that may each require different supply voltages. Estimated: dynamic power scales roughly with V^2, so the 1.2 V core dissipates about 36% less dynamic power than a 1.5 V core for identical activity - a major reason to choose the L over the standard A3P1000 in battery designs.
The 256-ball FBGA (1.0 mm pitch class) requires a controlled fanout - use via-in-pad or dog-bone fanout on the perimeter rows and verify ball map against the DS50003269 mechanical drawing before layout freeze. Place 100 nF ceramic decoupling capacitors on each VCCI bank plus bulk capacitance at the core rail entry. If you may later substitute A3P1000 non-L variants (same footprint), reserve copper and regulator thermal margin for the higher core voltage/current case so the footprint stays drop-in across the family.
Two frequent substitution errors: (1) swapping in an A3P1000 (non-L) part without confirming the board can supply its standard core grading - the L low-power rail assumption may not hold; (2) confusing FG256 and FGG256 ordering codes - Microchip's suffix system encodes grading and Pb-free flow, so always confirm the full MPN against your BOM. Also, because this is a flash FPGA with no external configuration device, do not add a boot flash footprint expecting SRAM-FPGA behavior; instead plan reprogramming through the JTAG/prog interface described in Microchip's programming documentation.
규정 준수 정보
Compliance status not stated in the retrieved web data; consult Microchip's product page and environmental datasheet for the A3P1000L-1FGG256. The FGG package suffix in Microchip nomenclature generally denotes Pb-free flow, but this must be confirmed from official documentation.
