A3P1000-1FGG256 - ProASIC3 Flash FPGA 1M Gates | Microchip
부품 번호: A3P1000-1FGG256 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $63.2 | $632.00 |
| 100 | $57.9 | $5,790.00 |
| 500 | $53.4 | $26,700.00 |
| 1,000 | $48.75 | $48,750.00 |
A3P1000-1FGG256 개요
A flash FPGA is a type of field-programmable gate array that stores its configuration in on-chip non-volatile flash memory rather than an external configuration ROM. Within the programmable logic hierarchy, it sits alongside SRAM FPGAs and CPLDs as a programmable logic device, and the ProASIC3 family is positioned by Microchip as a cost-effective ASIC replacement for mid-volume designs.
Key features include single-chip operation with no external boot device, reprogrammability in-system, live-at-power-up behavior because the flash configuration is immediately available when power is applied, and a low total cost of ownership emphasized by Microchip for the ProASIC3 family. The 256-ball FBGA footprint keeps board area small while still providing 177 usable I/O for glue logic, bus interfacing, and control functions.
Architecturally, ProASIC3 devices use Microchip (formerly Actel/Microsemi) third-generation flash FPGA fabric built from VersaTile logic tiles, each configurable as a three-input lookup table equivalent or a D-flip-flop/latch with enable, fabricated on 130 nm flash process technology with a 1.5V core supply. This non-volatile fabric removes the configuration-time vulnerability and standby configuration power typical of SRAM FPGAs.
Typical applications include industrial control and automation, networking and communications line cards, consumer equipment, computing platforms, and avionics subsystems where a single-chip, secure, non-volatile programmable fabric is preferred over SRAM-based alternatives.
A key design consideration: the -1 speed grade limits maximum fabric performance relative to -2 parts, so verify timing closure at target clock rates before committing; migration within the ProASIC3 family is documented in Microchip application notes.
This page synthesizes distributor pricing, drop-in same-footprint alternatives, and practical design notes not found in the manufacturer datasheet, with all data verified as of 2026-08-31.
드롭인 대체품: A3P1000-1FGG256 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P1000-1FGG256 (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Configuration Memory, System Gates, Family, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P1000-1FGG256T
✅ 드롭인✓ 재고 있음
$112.06 / 개
데이터시트 보기 →A3P1000-1FGG256M
✅ 드롭인✓ 재고 있음
$1 / 개
데이터시트 보기 →A3P1000-2FGG256M
✅ 드롭인✓ 재고 있음
$25.8 / 개
데이터시트 보기 →A3P1000-FGG256M
✅ 드롭인✓ 재고 있음
$27.85 / 개
데이터시트 보기 →A3P1000L-1FGG256
✅ 드롭인✓ 재고 있음
$55.33 / 개
데이터시트 보기 →A3P1000-1FGG256 최대 정격 & 전기적 특성
| Family | ProASIC3 Flash FPGA |
| System Gates | 1M (approx.) |
| Logic Elements | 11K (per distributor listing) |
| Number of I/O | 177 |
| Configuration Memory | 147456 bit flash (on-chip) |
| Core Supply Voltage | 1.5 V |
| Speed Grade | -1 (commercial) |
| Process Technology | 130 nm flash |
| 패키지 | 256-LBGA (FBGA-256) |
| 동작 온도 | 0C to +85C |
| 실장 유형 | Surface Mount |
| Programmability | In-system reprogrammable, non-volatile flash |
| Live at Power-Up | Yes |
| RoHS 상태 | RoHS compliant (per JLCPCB listing) |
A3P1000-1FGG256 256-lbga (fbga-256) 핀 구성 가이드
A3P1000-1FGG256(256-lbga (fbga-256) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P1000-1FGG256.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P1000-1FGG256 적합 용도: 6 애플리케이션s: Industrial Control and Automation, Networking and Communications Equipment, ASIC Prototyping and Low-Volume ASIC Replacement, Avionics and Secure Systems, Consumer and Display Equipment, Computing and Storage Adapter Boards.
Industrial Control and Automation
The A3P1000-1FGG256 fits industrial control because its 177 user I/Os absorb the many sensor, actuator, and bus interfaces typical of PLC I/O cards and motor-control backplanes, while the non-volatile flash fabric means the controller is live at power-up with no boot device to fail in the field. Deployed between 24V field-translated logic banks and backplane interfaces, it consolidates glue logic, address decoding, and state machines that would otherwise need multiple CPLDs. The 0C to +85C commercial range suits enclosed cabinets, and the single-chip flash configuration removes configuration-memory BOM items, reducing total cost of ownership in long-life industrial products.
추천
Networking and Communications Equipment
In networking line cards, the A3P1000-1FGG256 handles bus bridging, PHY interfacing, and board-level control logic where its 130 nm ProASIC3 fabric provides adequate performance at the -1 speed grade for management and data-path glue functions. The 256-ball FBGA keeps routing density manageable on dense line-card PCBs, and 177 I/O supports multi-bank voltage interfaces common in telecom designs. Because the flash configuration is secure and live at power-up, link bring-up and firmware negotiation are not delayed by configuration loading, a quantified benefit over SRAM FPGAs that typically add tens to hundreds of milliseconds of configuration time at system start.
추천
ASIC Prototyping and Low-Volume ASIC Replacement
Microchip positions ProASIC3 explicitly as a cost-effective ASIC replacement, and the A3P1000-1FGG256 with its ~1M system gates is the natural bridging device between an ASIC tape-out decision and volume production. Engineers map RTL directly onto the VersaTile fabric in Libero SoC, using the same design for prototyping and low-volume shipment. The on-chip 147456-bit flash avoids the external configuration chain of SRAM prototypes, and the 256-ball FBGA footprint mirrors typical ASIC package styles. When volumes grow, the documented ProASIC3 migration methodology allows conversion toward higher-density devices or a hard ASIC with minimal rework.
추천
Avionics and Secure Systems
The ProASIC3 family is cited by Microchip for avionics markets, and the A3P1000-1FGG256 contributes the properties avionics subsystem designers value: flash-based configuration immune to configuration readback attacks common on SRAM FPGAs, live-at-power-up behavior for deterministic startup, and single-chip integration that removes external boot flash from the reliability calculation. Note that this commercial 0C to +85C part suits benign avionics zones only; extended-temperature or automotive-qualified ProASIC3 variants (documented in Microchip DS50003485) are required for harsher environments. The 256-ball FBGA supports the moderately pin-count-heavy I/O needs of sensor aggregation and discrete-signal conditioning modules.
추천
Consumer and Display Equipment
Consumer platforms use the A3P1000-1FGG256 where a single programmable device must absorb board-revision churn: display timing generation, keypad scanning, LED control, and interface bridging between main SoCs and peripherals. The ~1M-gate capacity covers these functions with headroom, and in-system reprogrammability lets a single PCB support multiple product SKUs by changing only the flash bitstream, a tangible cost saving in shared-platform designs. The commercial 0C to +85C range and RoHS-compliant 256-ball FBGA packaging align with consumer environmental and assembly requirements, and the 1.5V core keeps standby power within consumer energy budgets.
추천
Computing and Storage Adapter Boards
Server and storage adapter boards deploy the A3P1000-1FGG256 as flexible fabric for host-interface bridging, backplane signal steering, and health-monitoring glue logic. Its 177 I/Os span the multiple voltage banks typical of server designs, and the flash fabric is live at power-up, which lets the board respond to host enumeration without configuration delay, an important behavior during rapid server reboot cycles. Compared with an SRAM FPGA plus configuration flash, the single-chip solution shortens BOM and improves supply-chain resilience. Designers should verify timing at the -1 speed grade or step up to A3P1000-2FGG256M for demanding clock domains.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P1000-1FGG256 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P1000-1FGG256T | A3P1000-1FGG256M | A3P1000-2FGG256M | A3P1000L-1FGG256 |
|---|---|---|---|---|---|
| Package | 256-LBGA (FBGA) | 256-LBGA (FBGA) - same | 256-LBGA (FBGA) - same | 256-LBGA (FBGA) - same | 256-LBGA (FBGA) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1M (approx.) | 1M (approx.) | 1M (approx.) | 1M (approx.) | 1M (approx.) |
| User I/O | 177 | 177 | 177 | 177 | 177 |
| Speed Grade | -1 | -1 | -1 | -2 (faster) | -1 (low power) |
| Configuration Memory | 147456 bit on-chip flash | 147456 bit on-chip flash | 147456 bit on-chip flash | 147456 bit on-chip flash | 147456 bit on-chip flash |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
주요 차별점
- Single-chip flash configuration, live at power-up (vs A3P1000-2FGG256M (SRAM-free family advantage))
- Lowest-cost speed grade in the same footprint (vs A3P1000-2FGG256M)
- Reduced power option without redesign (vs A3P1000L-1FGG256)
설계 노트
The A3P1000-1FGG256 uses a 1.5V core with separate I/O bank supplies. Provide independent, well-decoupled rails per I/O bank and respect ProASIC3 power-up requirements: apply I/O power before or with core power to avoid latch-up risk during startup. Estimated: static current dominates in flash FPGAs versus SRAM parts, but dynamic current scales with clock frequency and toggle rate - run Microchip's SmartPower power estimator with your actual Libero SoC design before finalizing the regulator budget, rather than assuming typical-family values.
The 256-ball FBGA with 177 used I/O requires careful escape routing. On standard 1.0 mm ball pitch, plan for via-in-pad or dog-bone escapes and at least one inner signal layer for full I/O breakout. Keep the 1.5V core rail on a dedicated plane or wide pour with localized 0.1 uF ceramic decoupling at each supply ball plus bulk capacitance near the device. Group I/O assignments by bank voltage in Libero SoC before layout so bank rails are defined early and land-pattern ballout tables from the ProASIC3 datasheet are followed exactly.
Three common mistakes with this part: (1) ignoring the speed grade - the -1 grade is the slowest commercial option, so run static timing in Libero SoC at -1 corners before choosing it over A3P1000-2FGG256M; (2) assuming industrial temperature - 0C to +85C excludes cold environments, where an I-suffix variant is needed; (3) treating FGG256 and FG256 packages as interchangeable - FGG denotes a lead-free/ball-composition variant with its own ordering code, so order the exact MPN. Always reprogram through JTAG with Libero SoC matched to your device family version.
규정 준수 정보
JLCPCB listing marks the A3P1000-1FGG256 as ROHS. This commercial part is not AEC-Q100 qualified; Microchip offers a separate Automotive ProASIC 3 family (datasheet DS50003485) for automotive use.
