A3P1000-2FGG256M - ProASIC3 Flash FPGA 11K LE 256-FBGA | Microchip
부품 번호: A3P1000-2FGG256M ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $35.1 | $351.00 |
| 100 | $31.9 | $3,190.00 |
| 500 | $28.7 | $14,350.00 |
| 1,000 | $25.8 | $25,800.00 |
A3P1000-2FGG256M 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks and programmable interconnects that engineers configure after manufacturing. Unlike SRAM FPGAs, the ProASIC3 family stores its configuration in on-chip flash, so the device boots instantly as a single-chip solution with no external configuration PROM, and it belongs to the hierarchy: VersaTile logic element -> flash FPGA -> programmable logic device -> digital IC.
Key features include reprogrammable flash technology, low total cost of ownership through elimination of boot devices, small-footprint packaging, instant-on operation, and support for live-at-power-up designs. The 1.5V core operating supply keeps power consumption low, while the 256-ball package balances I/O count (177 user pins) against board area.
Architecturally, the ProASIC3 fabric is built from three-input VersaTiles that act as LUT equivalents or D-flip-flops/latches with enable, plus embedded flash blocks providing the 147,456 bits of dual-port-capable RAM. Flash-based configuration is inherently non-volatile and highly resistant to configuration errors, suiting industrial and defense environments.
Typical applications include industrial automation and control, communications and networking line cards, medical instrumentation, and military/aerospace systems requiring single-chip, instantly-on programmable logic. The 0C to +85C commercial/industrial range covers most embedded deployments.
Design consideration: this is the M (tray, commercial temperature) variant; verify the temperature suffix and speed grade match your Libero SoC project constraints before layout.
This page synthesizes verified distributor data, same-family drop-in alternatives, pricing tiers, and practical design notes not found in the manufacturer product pages.
드롭인 대체품: A3P1000-2FGG256M — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P1000-2FGG256M (동일 폼 팩터 및 풋프린트) — 차이점: System Gates, Configuration Memory, Technology, Family, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P1000-FGG256M
✅ 드롭인✓ 재고 있음
$27.85 / 개
데이터시트 보기 →A3P1000-1FGG256M
✅ 드롭인✓ 재고 있음
$1 / 개
데이터시트 보기 →A3P1000-FG256M
✅ 드롭인✓ 재고 있음
$50.87 / 개
데이터시트 보기 →A3P1000-1FGG256T
✅ 드롭인✓ 재고 있음
$112.06 / 개
데이터시트 보기 →A3P1000-2FGG256M 최대 정격 & 전기적 특성
| Manufacturer Series | ProASIC3 (A3P1000) |
| Logic Elements (VersaTiles) | 11000 LE |
| Number of I/Os | 177 |
| Embedded Memory | 147456 bits |
| Speed Grade | 2 |
| 동작 공급 전압 | 1.5 V |
| 패키지 / 케이스 | FBGA-256 (256-LBGA) |
| 장착 스타일 | SMD/SMT |
| Minimum Operating Temperature | 0 C |
| Maximum Operating Temperature | +85 C |
| Configuration Technology | Flash (non-volatile, single-chip) |
| Packaging | Tray |
| Product | ProASIC3 Series A3P1000 |
| 카테고리 | FPGAs (Field Programmable Gate Array) |
| Programming Tool | Microchip Libero SoC |
A3P1000-2FGG256M fbga-256 (256-lbga) 핀 구성 가이드
A3P1000-2FGG256M(fbga-256 (256-lbga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P1000-2FGG256M.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P1000-2FGG256M 적합 용도: 6 애플리케이션s: Industrial Automation and Control, Communications and Networking Line Cards, Medical Instrumentation, Aerospace and Defense Systems, Test and Measurement Equipment, IoT Gateways and Edge Nodes.
Industrial Automation and Control
The A3P1000-2FGG256M fits industrial automation because its 11,000 VersaTiles implement glue logic, I/O expansion, and sequencing around PLC and motor-drive controllers, while its 177 user I/Os interface encoders, sensors, and fieldbus transceivers simultaneously. Flash configuration makes logic live at power-up, so machinery passes safety self-tests deterministically without waiting for a configuration load, and the 0C to +85C range covers typical control-cabinet environments. Used between a host MCU and field I/O, it offloads high-speed polling and PWM generation; the trade-off versus a soft-core-only MCU is higher static power from the 1.5V core, so plan a 1.5V rail capable of the ProASIC3 supply budget with local decoupling at the FBGA balls.
추천
Communications and Networking Line Cards
In networking equipment, the A3P1000-2FGG256M provides protocol framing, link monitoring, and board-level glue logic on line cards where a small-footprint FPGA is required beside PHYs and switch silicon. The 147,456-bit embedded flash RAM buffers packet descriptors and status tables, and 177 I/Os connect multiple PHY interfaces and backplane signals from a single 17 mm-class FBGA. Instant-on flash configuration lets the card respond to backplane presence detect immediately at slot insertion. Performance consideration: speed grade 2 supports mid-rate state machines but not multi-gigabit SERDES-class functions, which this fabric does not contain; pair it with a dedicated PHY for high-speed serial links and reserve the A3P1000 for control-plane and datapath assist logic.
추천
Medical Instrumentation
Medical diagnostic and monitoring instruments benefit from the A3P1000-2FGG256M's single-chip, non-volatile architecture: there is no external configuration memory to corrupt, improving long-term reliability of bedside and portable devices. Its 11,000 logic elements implement sensor timing, ADC sequencing, and display interface logic, while 177 I/Os handle the many channel connections typical of multi-sensor front ends. The 1.5V core helps keep overall power within thermally constrained enclosures. Design consideration: instruments submitted for regulatory review lock the FPGA bitstream in flash, and ProASIC3 reprogrammability allows validated firmware updates in the field without changing hardware, reducing recall risk versus one-time-programmable alternatives.
추천
Aerospace and Defense Systems
The ProASIC3 architecture is widely deployed in military and aerospace subsystems because flash-based configuration is inherently resistant to configuration upset compared with SRAM FPGAs that reload from external memory. The A3P1000-2FGG256M implements sensor interface logic, bus bridging, and secure boot support functions in avionics and ground systems. Its instant-on behavior satisfies requirements where logic must be live before an external processor finishes booting. For flight programs, verify the specific qualification suffix and consider Microchip's automotive/military ProASIC3 documentation (DS50003485 family datasheet) for temperature and quality data. Note this M-suffix part is rated 0C to +85C; extended-temperature variants exist in the family for harsher environments.
추천
Test and Measurement Equipment
Bench and modular instruments use the A3P1000-2FGG256M for trigger logic, timing generation, and inter-module coordination, where deterministic instant-on startup and plentiful I/O matter more than fabric capacity. The 177 user I/Os drive front-panel indicators, relay banks, and multiple measurement channels, while 11,000 VersaTiles implement state machines synchronizing data capture across channels. Embedded flash RAM stores calibration constants and channel configuration tables that persist through power cycles. Because speed grade 2 comfortably closes timing on tens-of-MHz state machines in Microchip Libero SoC, design teams avoid paying for higher-density or faster devices in cost-sensitive instrument platforms; the main trade-off is fabric capacity, so keep large DSP datapaths on a dedicated ADC/DSP chain.
추천
IoT Gateways and Edge Nodes
Edge aggregation nodes use the A3P1000-2FGG256M to bridge many heterogeneous sensor and actuator interfaces to a single host processor, exploiting 177 I/Os to absorb mixed-voltage digital signaling that an MCU alone cannot terminate. Flash configuration means the node's interface logic is active the instant power is applied, enabling power-line-triggered wake-up behavior without a processor-driven configuration sequence. The 11,000-LE fabric implements protocol converters (SPI/I2C/UART multiplexing), watchdog logic, and local safety interlocks that must run even if the host crashes. Power consideration: budget the 1.5V core rail plus I/O bank supplies carefully in battery-buffered nodes, and use FPGA sleep-focused design practices since flash FPGAs do not clock-gate as aggressively as MCUs.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P1000-2FGG256M — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P1000-FGG256M | A3P1000-1FGG256M | A3P1000-FG256M |
|---|---|---|---|---|
| Package | FBGA-256 (256-LBGA) | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| Logic Elements | 11000 LE | 11000 LE | 11000 LE | 11000 LE |
| User I/O | 177 | 177 | 177 | 177 |
| Embedded Memory | 147456 bits | 147456 bits | 147456 bits | 147456 bits |
| Operating Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C |
| Configuration | On-chip flash, single-chip | On-chip flash, single-chip | On-chip flash, single-chip | On-chip flash, single-chip |
주요 차별점
- Speed grade 2 timing closure headroom (vs A3P1000-1FGG256M)
- Pb-free green packaging designation (vs A3P1000-FG256M)
- Single-chip flash configuration (vs SRAM FPGAs of similar density)
설계 노트
The A3P1000 core runs from a 1.5V supply per distributor specifications; I/O banks use separate auxiliary supplies set by your I/O standard. Deliver the 1.5V rail with a low-noise buck converter and place 0.1uF ceramic decoupling at multiple FBGA ball pairs plus bulk 10uF-22uF near the device. Estimated: power dissipation depends on toggle rate; use Microchip's power calculator in Libero SoC with your post-place-and-route netlist rather than assuming worst-case numbers from the datasheet.
FBGA-256 requires controlled via-in-pad or dog-bone escape routing; plan a minimum 4-layer stack with a dedicated ground plane under the ball field for return paths. Keep the FPGA's bank voltage rails decoupled per bank, and route configuration/programming pins (accessible for Libero FlashPro programming) to a header even in single-chip flash designs to allow field updates. Follow the ProASIC3 datasheet package drawing ball map exactly - do not infer ball coordinates.
Verify the full ordering code before release: A3P1000-2FGG256M is speed grade 2, tray-packed (M), 0C to +85C. Mixing it with speed grade 1 variants (e.g., A3P1000-1FGG256M) breaks timing closure for designs signed off at grade 2. Also confirm the Pb-free FGG suffix against RoHS requirements; the FG256M variant lacks the F packaging designation. Cross-check Libero SoC device selection against the physical marking on received trays.
규정 준수 정보
RoHS/lead-free status of the exact FGG (Pb-free green) suffix was not stated in the provided web data; verify on the Microchip product page compliance documents before ordering.
