EP2C15AF256C8N - 15K LEs Cyclone II FPGA, 256-FBGA | Intel / Altera
부품 번호: EP2C15AF256C8N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $14.35 | $14.35 |
| 10 | $12.95 | $129.50 |
| 100 | $11.2 | $1,120.00 |
| 500 | $9.85 | $4,925.00 |
| 1,000 | $8.75 | $8,750.00 |
EP2C15AF256C8N 개요
A Cyclone II FPGA is a SRAM-based programmable logic device that integrates configurable logic arrays (LABs), embedded memory blocks (M4K blocks), embedded 18x18 multipliers, and a programmable I/O ring into a single die. Positioned below the high-end Stratix family and above the original Cyclone series, Cyclone II is designed to deliver ASIC-like logic density at FPGA-like design flexibility, while consuming substantially less power than its Stratix siblings - typically 50-60% lower static power at comparable densities.
Key features include support for LVDS, LVCMOS, SSTL, and HSTL I/O standards through dedicated True-LVDS circuitry; up to 52 embedded 18x18 multipliers enabling DSP-style FIR/FFT pipelines; a maximum of 4 PLLs providing clock synthesis, phase shifting, and frequency multiplication; and 68 M4K RAM blocks that can be configured as RAM, ROM, or FIFO. The 'C8' speed grade corresponds to an 8 ns internal timing corner, and the 'N' suffix denotes a lead-free, RoHS-compliant package.
Architecturally, the EP2C15 uses a sea-of-LABs fabric where each LAB contains 16 logic elements (LEs), each LE comprising a 4-input LUT, a programmable register, and a carry chain. Interconnect is achieved through MultiTrack routing with row/column drivers, and configuration data is stored in SRAM, requiring an external configuration device such as the EPCS4 or EPCS16 serial flash on power-up.
Typical applications include digital video processing and display controllers, motor control and industrial automation, software-defined radio baseband, low-cost prototyping of custom logic, and communications infrastructure such as bridges between legacy parallel buses and modern serial interfaces. The 256-ball FBGA package enables compact PCB layouts and supports high-speed signal integrity for LVDS links.
When designing with this device, plan configuration loading time carefully - the EP2C15 in fast standard mode requires approximately 12 ms to configure from an EPCS16, and JTAG or Active Serial configuration must be selected via MSEL pins. Decoupling must follow Altera's Cyclone II pin connection guidelines, with 0.1 µF and 0.01 µF capacitors near every VCCINT and VCCIO bank.
This page synthesizes distributor pricing, drop-in Cyclone II alternatives, and practical board-design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EP2C15AF256C8N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2C15AF256C8N (동일 폼 팩터 및 풋프린트) — 차이점: Total RAM Bits, Family, Operating Temperature, Package, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2C20F256C8N
✅ 드롭인✓ 재고 있음
$20.85 / 개
데이터시트 보기 →EP2C15AF256C7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP2C15AF256I8N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$17.26 / 개
데이터시트 보기 →EP2C15AF484C8N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP2C15AF256C8N 최대 정격 & 전기적 특성
| Family | Cyclone II |
| Logic Elements | 14,448 |
| Total RAM Bits | 239,616 |
| Maximum User I/O | 152 |
| Number of Logic Elements / Cells | 14448 |
| 패키지 | 256-LBGA (FBGA-256) |
| Core Supply Voltage | 1.2 V |
| 동작 온도 | 0 C to 85 C |
| Speed Grade | C8 |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Lead-Free | Yes (N suffix) |
| Process Node | 90 nm |
| Configuration Memory | SRAM (external EPCS flash required) |
| I/O Standards Supported | LVDS, LVCMOS, SSTL, HSTL |
EP2C15AF256C8N 256-lbga (fbga-256) 핀 구성 가이드
EP2C15AF256C8N(256-lbga (fbga-256) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2C15AF256C8N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2C15AF256C8N 적합 용도: 7 애플리케이션s: Industrial Motor Control, Digital Video Display Controller, Software Defined Radio Baseband, Legacy Bus Bridge, Low-Cost ASIC Prototyping, Communications Infrastructure Glue Logic, Medical Imaging Front-End.
Industrial Motor Control
The EP2C15AF256C8N fits industrial motor control because its 14,448 logic elements, embedded 18x18 multipliers, and 152 user I/O pins handle field-oriented control (FOC) loops and multi-axis PWM generation in a single chip. With a 1.2 V core and dedicated PLL, the FPGA can synthesize precision PWM frequencies above 100 kHz while sampling encoder feedback at sub-microsecond rates.
추천
Digital Video Display Controller
With 239 Kbits of embedded RAM and True-LVDS I/O, the EP2C15AF256C8N acts as a low-cost LVDS display bridge for industrial LCDs, driving up to 152 LVDS pairs while buffering frame data in M4K blocks. The device's 90 nm process keeps static power below 0.5 W typical, making it ideal for fanless panel PCs and HMI displays.
추천
Software Defined Radio Baseband
Cyclone II's 18x18 hardware multipliers deliver DSP-grade multiply-accumulate throughput at sample rates up to 250 MSPS in the EP2C15AF256C8N, enabling digital down-conversion (DDC), FIR filtering, and FFT blocks in SDR baseband chains. The 152 user I/O pins allow direct connection to dual ADCs/DACs and a host processor bus without an external bridge.
추천
Legacy Bus Bridge
The EP2C15AF256C8N bridges parallel legacy buses (PCI, ISA, VME) to modern serial interfaces by mapping timing-critical bus cycles into Verilog state machines. Its 152 I/O and 14,448 LEs are sufficient for 32-bit @ 66 MHz PCI master/target implementations alongside UART, SPI, and I2C peripherals - all in a single FBGA-256 device.
추천
Low-Cost ASIC Prototyping
For ASIC prototyping, the EP2C15AF256C8N provides 14,448 LEs of general-purpose logic at under $15 in unit quantities, enabling multiple prototype iterations before committing to mask costs. Quartus II design software supports the entire Cyclone II family, allowing designers to validate RTL against the same silicon that ships in early production.
추천
Communications Infrastructure Glue Logic
In telecom and datacom equipment, the EP2C15AF256C8N replaces multiple TTL/CMOS glue-logic chips by integrating SERDES-like LVDS signaling, clock-data recovery assist, and frame-buffer FIFOs into one FPGA. The C8 speed grade supports LVDS operation at up to 805 Mbps, sufficient for many backplane applications below 1 Gbps.
추천
Medical Imaging Front-End
The EP2C15AF256C8N performs real-time preprocessing of ultrasound, endoscopy, or patient-monitor front-end data, using embedded RAM as line buffers and 18x18 multipliers for pixel-level gain correction. Its 0 C to 85 C commercial temperature range suits medical cart and bedside equipment that lives in climate-controlled environments.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2C15AF256C8N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2C20F256C8N | EP2C15AF256C7N | EP2C15AF256I8N |
|---|---|---|---|---|
| Package | 256-LBGA (FBGA-256) | 256-LBGA (FBGA-256) - same | 256-LBGA (FBGA-256) - same | 256-LBGA (FBGA-256) - same |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Logic Elements | 14,448 | 18,752 (+30%) | 14,448 (same) | 14,448 (same) |
| Total RAM Bits | 239,616 | 239,616 (same) | 239,616 (same) | 239,616 (same) |
| Speed Grade | C8 | C8 (same) | C7 (slower) | I8 (industrial) |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | -40 C to 100 C (industrial) |
| Maximum User I/O | 152 | 152 (same) | 152 (same) | 152 (same) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
주요 차별점
- 30% higher logic capacity available as drop-in upgrade (vs EP2C20F256C8N)
- Industrial temperature range available without redesign (vs EP2C15AF256I8N)
- Speed grade flexibility (vs EP2C15AF256C7N)
설계 노트
Estimated: Decoupling follows the Cyclone II handbook (CII51006) recommendation of one 0.1 µF and one 0.01 µF ceramic capacitor per VCCINT pin group, plus a 4.7 µF to 22 µF bulk capacitor near the regulator. The 1.2 V core typically draws 100-300 mA depending on logic utilization - derate the regulator to handle inrush during configuration. Use a separate regulator for VCCIO banks if they need different voltages (1.5/1.8/2.5/3.3 V).
The FBGA-256 package uses 1.0 mm ball pitch on a 17 mm x 17 mm body - place all decoupling capacitors on the BOTTOM side of the board directly beneath their respective VCCINT/VCCIO balls via micro-via fanout. Maintain a continuous ground plane under the BGA with stitching vias every 2 mm around the perimeter to control return-path impedance for LVDS signals.
The MSEL[2..0] pins MUST be tied high/low correctly before power-up or the device will not configure - AS mode requires MSEL=000, JTAG uses MSEL=101. Floating MSEL pins are a top cause of 'device does not respond' failure modes. Also, nCONFIG and nSTATUS must be pulled to VCCIO through 10 kohm resistors; leaving them floating causes intermittent configuration failures.
LVDS outputs require 100 ohm differential termination at the receiver. Cyclone II True-LVDS channels support up to 805 Mbps in C8 speed grade - verify that PCB traces are impedance-controlled (100 ohm differential) and that pair-to-pair skew is below 50 ps. For memory interfaces, place the external EPCS configuration flash as close as possible to the FPGA's DCLK/ASDO/nCSO pins.
규정 준수 정보
RoHS-compliant per Intel/Altera datasheet CII51006. Lead-free indicated by N suffix. Halogen-free status not explicitly stated in available data.