A3P1000L-1FGG484I - 1M Gate ProASIC3L FPGA | Microchip
부품 번호: A3P1000L-1FGG484I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $45 | $45.00 |
| 10 | $40.5 | $405.00 |
| 100 | $36 | $3,600.00 |
| 500 | $32.4 | $16,200.00 |
| 1,000 | $28.8 | $28,800.00 |
A3P1000L-1FGG484I 개요
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic. FPGAs belong to the programmable logic device (PLD) hierarchy, which includes CPLDs and complex programmable logic devices, and are used in a wide range of applications from prototyping to production. The ProASIC3L family is notable for its flash-based configuration, which is non-volatile, meaning the device retains its configuration without external memory and is 'Instant On' at power-up.
Key features of the A3P1000L-1FGG484I include 1 million system gates, 300 user I/Os, 147,456 bits of RAM, and a maximum operating frequency of 892.86 MHz. The flash-based architecture provides inherent security against reverse engineering and supports reprogrammability. The device also features low power consumption, making it suitable for battery-powered and thermally constrained applications.
Technically, the A3P1000L-1FGG484I is fabricated using 130nm flash technology, which enables a single-chip solution without the need for external configuration memory. The device supports multiple I/O standards and includes phase-locked loops (PLLs) for clock management. The industrial temperature grade (-40°C to 100°C junction) ensures reliable operation in harsh environments.
Typical applications include industrial control systems, automotive electronics, communications infrastructure, and aerospace systems where low power, security, and instant-on operation are critical. The 300 user I/Os allow for flexible interfacing with sensors, actuators, and communication interfaces.
When designing with this FPGA, consider the 1.2V core supply and the need for proper decoupling capacitors on all power pins. The flash-based configuration eliminates the need for external boot memory, simplifying the design and reducing BOM cost.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P1000L-1FGG484I.
드롭인 대체품: A3P1000L-1FGG484I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P1000L-1FGG484I (동일 폼 팩터 및 풋프린트) — 차이점: Package, System Gates, Core Voltage, Configuration Memory, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P1000L-FGG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3P1000L-1FGG484
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3P1000L-1FG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3P1000L-1FGG484
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3P1000L-FGG484
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3PE3000L-FGG484
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3P1000L-1FGG484I 최대 정격 & 전기적 특성
| Family | ProASIC3L |
| Number of Logic Elements/Cells | 1M gates |
| Total RAM Bits | 147456 bits |
| Number of I/O | 300 |
| Voltage - Supply | 1.14V ~ 1.575V |
| 동작 온도 | -40°C ~ 100°C (TJ) |
| 패키지 / 케이스 | 484-BGA |
| Supplier Device Package | 484-FPBGA (23x23) |
| 실장 유형 | Surface Mount |
| Maximum Operating Frequency | 892.86 MHz |
| Technology | 130nm |
| Core Voltage | 1.2V |
| RoHS 상태 | Compliant |
A3P1000L-1FGG484I 484-fpbga (23x23) 핀 구성 가이드
A3P1000L-1FGG484I(484-fpbga (23x23) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P1000L-1FGG484I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P1000L-1FGG484I 적합 용도: 6 애플리케이션s: Industrial Control Systems, Automotive Electronics, Communications Infrastructure, Aerospace and Defense, Medical Devices, IoT and Smart Devices.
Industrial Control Systems
The A3P1000L-1FGG484I is ideal for industrial control systems due to its low power consumption, instant-on capability, and wide operating temperature range (-40°C to 100°C). Its 300 user I/Os allow flexible interfacing with sensors, actuators, and communication interfaces. The flash-based configuration ensures secure and reliable operation in harsh environments, and the 1M gates provide ample logic for implementing control algorithms, motor control, and data acquisition. The device's 892.86 MHz maximum frequency supports high-speed processing, while its 147,456 bits of RAM enable local data buffering. Compared to SRAM-based FPGAs, the flash-based architecture eliminates the need for external configuration memory, reducing BOM cost and improving system reliability.
추천
Automotive Electronics
The A3P1000L-1FGG484I is suitable for automotive electronics such as engine control units, infotainment systems, and advanced driver-assistance systems (ADAS). Its industrial temperature range (-40°C to 100°C) meets automotive environmental requirements, and its low power consumption is critical for battery-powered vehicles. The flash-based configuration provides instant-on operation, essential for safety-critical systems that must start immediately. With 1M gates and 300 I/Os, it can handle complex logic for sensor fusion, communication protocols, and motor control. The device's security features protect against unauthorized copying, which is important for automotive IP. While not AEC-Q100 qualified, the industrial grade is often used in automotive designs with additional validation.
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Communications Infrastructure
In communications infrastructure, the A3P1000L-1FGG484I excels in applications such as base stations, routers, and switches. Its 892.86 MHz maximum frequency and 300 I/Os support high-speed data interfaces like Ethernet, PCIe, and SERDES. The 147,456 bits of RAM are useful for packet buffering and FIFO implementation. The low power consumption is advantageous for remote and edge devices where cooling is limited. The flash-based architecture ensures secure boot and prevents configuration tampering, which is critical for network security. The device's instant-on capability reduces system startup time, improving overall network availability. With 1M gates, it can implement complex protocol stacks and data processing logic.
추천
Aerospace and Defense
The A3P1000L-1FGG484I is well-suited for aerospace and defense applications such as avionics, satellite systems, and radar processing. Its flash-based configuration provides radiation tolerance and security against reverse engineering, which are critical for military systems. The industrial temperature range and low power consumption make it suitable for space-constrained and power-limited environments. With 1M gates and 300 I/Os, it can handle complex signal processing, telemetry, and control functions. The instant-on capability is essential for systems that must be ready immediately upon power-up. The device's 892.86 MHz frequency supports high-speed data processing, while its 147,456 bits of RAM enable on-chip data storage.
추천
Medical Devices
The A3P1000L-1FGG484I is used in medical devices such as patient monitors, imaging systems, and diagnostic equipment. Its low power consumption is essential for battery-operated portable devices, and its instant-on capability ensures immediate operation when needed. The flash-based configuration provides high reliability and security, which is important for medical data integrity. With 1M gates and 300 I/Os, it can implement complex signal processing algorithms, user interfaces, and communication protocols. The industrial temperature range (-40°C to 100°C) covers most medical environments. The device's 892.86 MHz frequency supports real-time processing, while its 147,456 bits of RAM enable data buffering and temporary storage.
추천
IoT and Smart Devices
The A3P1000L-1FGG484I is ideal for IoT and smart devices due to its low power consumption, instant-on capability, and security features. Its flash-based configuration allows secure over-the-air updates and prevents unauthorized access. With 1M gates and 300 I/Os, it can handle sensor interfacing, data processing, and wireless communication protocols. The industrial temperature range makes it suitable for outdoor and industrial IoT applications. The device's 892.86 MHz frequency supports real-time processing, while its 147,456 bits of RAM enable local data storage. The low power consumption extends battery life in portable devices, and the instant-on capability ensures quick response to wake-up events.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P1000L-1FGG484I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P1000L-FGG484I | A3P1000L-1FGG484 | A3P1000L-1FG484I | A3P1000L-1FGG484 | A3P1000L-FGG484 | A3PE3000L-FGG484 |
|---|---|---|---|---|---|---|---|
| Package | 484-FBGA (23x23) | 484-FBGA (23x23) | 484-FBGA (23x23) | 484-FBGA (23x23) | 484-FBGA (23x23) | 484-FBGA (23x23) | 484-FBGA (23x23) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1M | 1M | 1M | 1M | 1M | 1M | 3M |
| User I/Os | 300 | 300 | 300 | 300 | 300 | 300 | 300 |
| RAM Bits | 147456 | 147456 | 147456 | 147456 | 147456 | 147456 | 147456 |
| Speed Grade | -1 | Standard | -1 | -1 | -1 | Standard | Standard |
| Temperature Range | Industrial (-40°C to 100°C) | Industrial (-40°C to 100°C) | Commercial (0°C to 85°C) | Industrial (-40°C to 100°C) | Commercial (0°C to 85°C) | Commercial (0°C to 85°C) | Commercial (0°C to 85°C) |
| Lead-Free Finish | Yes (G) | Yes (G) | Yes (G) | No | Yes (G) | Yes (G) | Yes (G) |
주요 차별점
- Flash-based instant-on configuration (vs SRAM-based FPGAs)
- Low power consumption (vs A3PE3000L-FGG484)
- Industrial temperature range (vs A3P1000L-1FGG484)
설계 노트
The A3P1000L-1FGG484I requires a 1.2V core supply (1.14V to 1.575V). Use a low-dropout regulator (LDO) or a switching regulator with low ripple to supply this rail. Decouple each VCC pin with a 0.1uF ceramic capacitor and add a 10uF bulk capacitor near the FPGA. Estimated: For a typical design with 300 I/Os toggling at 100 MHz, core power consumption can be estimated using the formula P = C * V^2 * f, where C is the total load capacitance. This is an estimate; refer to the Microchip power calculator for accurate numbers.
For the 484-FBGA package, ensure proper PCB layout with adequate via stitching for ground and power planes. Use a 4-layer or more PCB with dedicated power and ground planes. Place decoupling capacitors as close to the FPGA power pins as possible, ideally on the same side of the board. Follow the manufacturer's layout guidelines for BGA packages to ensure reliable solder joints and signal integrity.
One common pitfall is neglecting the I/O supply voltages. The A3P1000L-1FGG484I supports multiple I/O standards, each requiring specific VCCIO voltages. Ensure all VCCIO pins are connected to the correct voltage levels for your design. Also, do not leave unused I/O pins floating; configure them as inputs with pull-ups or as outputs to avoid undefined states. Additionally, the flash-based FPGA does not require external configuration, but ensure the JTAG pins are properly terminated for programming.
규정 준수 정보
RoHS compliant per distributor listings. Not AEC-Q100 qualified; industrial temperature grade only.