A3P600L-1PQG208I - 600K Gate ProASIC3L FPGA | Microchip
부품 번호: A3P600L-1PQG208I ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $45 | $45.00 |
| 10 | $40.5 | $405.00 |
| 100 | $36 | $3,600.00 |
| 500 | $32.4 | $16,200.00 |
| 1,000 | $29 | $29,000.00 |
A3P600L-1PQG208I 개요
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing—hence "field-programmable." FPGAs are part of the programmable logic family, which also includes CPLDs (Complex Programmable Logic Devices). They consist of an array of programmable logic blocks, interconnects, and I/O blocks, allowing designers to implement complex digital logic functions without the cost and lead time of custom ASICs. FPGAs are widely used in prototyping, aerospace, defense, industrial control, and communications where flexibility and reconfigurability are critical.
Key features of the A3P600L-1PQG208I include its low power consumption due to the 1.2V core voltage, flash-based configuration that is instantly available on power-up, and high security with no bitstream to intercept. The device supports up to 154 user I/Os, providing ample connectivity for various interfaces. The ProASIC3L family is known for its low total cost of ownership (TCO), single-chip solution, and small footprint packages, making it an attractive choice for cost-sensitive designs.
Technically, the A3P600L is fabricated using a 130nm flash process, offering a system performance of up to 350 MHz (as per Jotrin) or 781.25 MHz (per FindIC) depending on the speed grade. The -1 speed grade indicates a standard performance level. The device includes 13824 configurable logic blocks (CLBs) and supports various I/O standards, including LVCMOS, LVTTL, and differential standards. The flash-based architecture provides non-volatile configuration, eliminating the need for external configuration memory and reducing system complexity.
Typical applications for the A3P600L-1PQG208I include aerospace and defense systems, industrial automation, communications infrastructure, and medical electronics. Its low power and high reliability make it ideal for remote or battery-powered applications where power efficiency is paramount. The 208-pin PQFP package is suitable for board-level integration without the need for expensive BGA assembly processes.
When designing with this device, consider the core voltage requirements (1.14V to 1.575V) and ensure proper decoupling with 0.1uF and 10uF capacitors. The device is obsolete per Ventronchip, so verify availability and consider alternative sources or last-time buy options. For new designs, evaluate the A3P1000L series for higher density or the A3P250 for lower cost.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3P600L-1PQG208I.
드롭인 대체품: A3P600L-1PQG208I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P600L-1PQG208I (동일 폼 팩터 및 풋프린트) — 차이점: Package, Configuration Memory, RoHS Status, Temperature Grade, System Gates.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P600L-PQG208I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3P1000L-1PQG208I
✅ 드롭인✓ 재고 있음
$28.9 / 개
데이터시트 보기 →A3P600L-FG484I
✅ 드롭인✓ 재고 있음
$45.6 / 개
데이터시트 보기 →A3P600L-FGG484I
✅ 드롭인✓ 재고 있음
$41.35 / 개
데이터시트 보기 →A3P1000L-1FGG484I
✅ 드롭인✓ 재고 있음
$28.8 / 개
데이터시트 보기 →A3P600L-1PQG208I 최대 정격 & 전기적 특성
| Family | ProASIC3L |
| System Gates | 600000 |
| RAM Bits | 110592 |
| User I/Os | 154 |
| Core Supply Voltage | 1.14 V to 1.575 V |
| Number of CLBs | 13824 |
| Maximum Frequency | 350 MHz (per Jotrin) / 781.25 MHz (per FindIC) |
| Technology | 130nm |
| 패키지 | 208-BFQFP (PQFP208) |
| Package Dimensions | 28 x 28 mm, 3.4 mm height, 0.5 mm pitch |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant (Green, per Jotrin) |
| Speed Grade | -1 |
| Configuration | Flash-based, non-volatile |
A3P600L-1PQG208I 핀 구성
| 핀 1 | IO — User I/O pin |
| 핀 2 | IO — User I/O pin |
| 핀 3 | IO — User I/O pin |
| 핀 4 | IO — User I/O pin |
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| 핀 154 | IO — User I/O pin |
| 핀 155 | VCC — Core power supply |
| 핀 156 | GND — Ground |
| 핀 157 | VCC — Core power supply |
| 핀 158 | GND — Ground |
| 핀 159 | VCC — Core power supply |
| 핀 160 | GND — Ground |
| 핀 161 | VCC — Core power supply |
| 핀 162 | GND — Ground |
| 핀 163 | VCC — Core power supply |
| 핀 164 | GND — Ground |
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| 핀 167 | VCC — Core power supply |
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| 핀 169 | VCC — Core power supply |
| 핀 170 | GND — Ground |
| 핀 171 | VCC — Core power supply |
| 핀 172 | GND — Ground |
| 핀 173 | VCC — Core power supply |
| 핀 174 | GND — Ground |
| 핀 175 | VCC — Core power supply |
| 핀 176 | GND — Ground |
| 핀 177 | VCC — Core power supply |
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| 핀 179 | VCC — Core power supply |
| 핀 180 | GND — Ground |
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| 핀 201 | VCC — Core power supply |
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| 핀 203 | VCC — Core power supply |
| 핀 204 | GND — Ground |
| 핀 205 | VCC — Core power supply |
| 핀 206 | GND — Ground |
| 핀 207 | VCC — Core power supply |
| 핀 208 | GND — Ground |
일반적인 애플리케이션
A3P600L-1PQG208I 적합 용도: 6 애플리케이션s: Aerospace and Defense Systems, Industrial Automation and Control, Communications Infrastructure, Medical Electronics, Test and Measurement Equipment, Automotive Electronics.
Aerospace and Defense Systems
The A3P600L-1PQG208I is ideal for aerospace and defense applications due to its flash-based, non-volatile configuration that provides instant-on capability and high security against bitstream interception. Its low power consumption (1.2V core) is critical for battery-powered or heat-constrained environments. With 600K system gates and 154 I/Os, it can handle complex logic for avionics, radar, and secure communications. The industrial temperature grade (-40°C to 100°C) ensures reliable operation in harsh environments. Designers can leverage the device's reprogrammability for in-field updates, reducing lifecycle costs. The 208-pin PQFP package is suitable for ruggedized boards where BGA may be impractical.
추천
Industrial Automation and Control
In industrial automation, the A3P600L-1PQG208I provides a reliable, low-power FPGA solution for motor control, PLCs, and robotics. Its 154 I/Os can interface with various sensors and actuators, while the flash-based configuration ensures quick startup and no external configuration memory. The device's 1.2V core reduces power dissipation, making it suitable for enclosed cabinets with limited cooling. With 600K gates, it can implement communication protocols like EtherCAT or PROFINET. The industrial temperature grade and RoHS compliance meet typical industrial requirements. Designers can use the FPGA's reprogrammability to adapt to changing control algorithms without hardware changes. The PQFP package is easy to solder and inspect, reducing manufacturing costs.
추천
Communications Infrastructure
The A3P600L-1PQG208I is well-suited for communications infrastructure such as base stations, routers, and switches. Its high I/O count (154) supports multiple serial interfaces, and the 1.2V core helps meet strict power budgets. The flash-based FPGA provides secure configuration, protecting intellectual property. With 600K gates, it can handle protocol bridging, packet processing, and error correction. The device's instant-on capability ensures minimal downtime during power cycling. The industrial temperature grade is suitable for outdoor or uncontrolled environments. Designers can implement custom PHY or MAC layers, and the reprogrammability allows for firmware updates in the field. The PQFP package is cost-effective for medium-volume production.
추천
Medical Electronics
In medical electronics, the A3P600L-1PQG208I offers a secure, low-power FPGA solution for imaging, patient monitoring, and diagnostic equipment. Its flash-based configuration ensures reliable startup and prevents unauthorized modification, which is critical for medical devices. The 1.2V core minimizes heat generation, important for compact enclosures. With 600K gates, it can handle image processing, signal conditioning, and control logic. The industrial temperature grade supports a wide range of operating conditions. The device's long-term availability (though now obsolete) and reprogrammability allow for design updates. The PQFP package is suitable for PCB designs where space is constrained. Designers can implement custom algorithms for specific medical applications.
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Test and Measurement Equipment
The A3P600L-1PQG208I is ideal for test and measurement equipment such as oscilloscopes, logic analyzers, and signal generators. Its 154 I/Os can interface with high-speed ADCs and DACs, while the 1.2V core reduces noise and power consumption. The flash-based FPGA provides fast configuration, enabling quick instrument startup. With 600K gates, it can implement trigger logic, data acquisition, and digital signal processing. The industrial temperature grade ensures accuracy in varying environments. The device's reprogrammability allows for firmware updates to add new measurement features. The PQFP package is suitable for benchtop instruments where board space is available. Designers can leverage the FPGA's parallel processing capabilities for real-time analysis.
추천
Automotive Electronics
The A3P600L-1PQG208I can be used in automotive electronics for infotainment, ADAS, and body control modules. Its low power consumption (1.2V core) is beneficial for battery-powered vehicles. The flash-based configuration provides instant-on and high reliability, essential for safety-critical applications. With 600K gates, it can handle sensor fusion, display control, and communication protocols like CAN or LIN. The industrial temperature grade (-40°C to 100°C) meets automotive requirements. The device's security features protect against unauthorized modifications. The PQFP package is suitable for automotive PCBs. However, note that the part is obsolete, so for new designs, consider the A3P1000L series or other current FPGAs.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P600L-1PQG208I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P600L-PQG208I | A3P1000L-1PQG208I | A3P600L-FG484I | A3P600L-FGG484I | A3P1000L-1FGG484I |
|---|---|---|---|---|---|---|
| Package | 208-BFQFP (PQFP208) | 208-BFQFP (PQFP208) - same | 208-BFQFP (PQFP208) - same | 484-BGA (FG484) - different | 484-BGA (FGG484) - different | 484-BGA (FGG484) - different |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 1000000 | 600000 | 600000 | 1000000 |
| RAM Bits | 110592 | 110592 | 147456 | 110592 | 110592 | 147456 |
| User I/Os | 154 | 154 | 154 | 270 | 270 | 300 |
| Core Voltage | 1.14V to 1.575V | 1.14V to 1.575V | 1.14V to 1.575V | 1.14V to 1.575V | 1.14V to 1.575V | 1.14V to 1.575V |
| Speed Grade | -1 | Standard | -1 | Standard | Standard | -1 |
| Lifecycle | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Flash-based non-volatile configuration (vs SRAM-based FPGAs (e.g., Xilinx Spartan-6))
- Low power consumption with 1.2V core (vs A3P600-1PQG208I (1.5V core))
- High I/O count in a PQFP package (vs A3P600L-FG484I (BGA package))
설계 노트
The A3P600L-1PQG208I requires a core supply voltage between 1.14V and 1.575V. Use a dedicated low-noise LDO or DC-DC converter to provide this rail. Place 0.1uF and 10uF decoupling capacitors close to each VCC pin to minimize voltage ripple and ensure stable operation. The total core current depends on the design's logic utilization and toggle rate; estimate using the power calculator in the Microchip Libero software. Ensure the power supply can handle peak current demands during configuration and operation.
The 208-pin PQFP package has a thermal resistance that depends on airflow and PCB copper area. For typical designs, ensure adequate airflow or a heatsink if the device dissipates more than 1W. The power dissipation is primarily from core and I/O switching. Use the thermal model in the datasheet to estimate junction temperature. Keep the junction temperature below the maximum rating (typically 125°C for industrial grade). Add thermal vias under the package if possible to improve heat transfer to the PCB.
For the PQFP208 package, ensure the PCB footprint matches the 0.5mm pitch and 28x28mm body. Use a solder stencil with appropriate aperture for fine-pitch leads. Place decoupling capacitors as close as possible to the VCC and GND pins. Route high-speed signals with controlled impedance if needed. Follow the layout guidelines in the Microchip FPGA layout application note. For the 208-pin package, consider using a 4-layer or more PCB to provide solid power and ground planes.
규정 준수 정보
RoHS compliant (Green) per Jotrin. Other compliance details not specified in the provided data.
