A3P600L-FGG484 - 600K Gate Flash FPGA 484-BGA | Microchip
부품 번호: A3P600L-FGG484 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $71.2 | $712.00 |
| 100 | $64.8 | $6,480.00 |
| 500 | $59.4 | $29,700.00 |
| 1,000 | $54.9 | $54,900.00 |
A3P600L-FGG484 개요
A flash-based FPGA stores its configuration in on-chip non-volatile flash memory rather than the SRAM cells used by Xilinx and Intel/Altera devices. This means the A3P600L powers up instantly with no external configuration ROM, requires no boot sequencer, and is inherently immune to configuration bitstream interception - a key advantage in secure and radiation-tolerant-adjacent industrial designs. Within the power management hierarchy, the ProASIC3L family sits as the low-power variant of ProASIC3, using 130 nm CMOS flash technology with a 1.2 V to 1.5 V core voltage option.
Key differentiating features include single-chip Live-for-Free operation with zero configuration time, low total cost of ownership (TOC) per Microchip, support for the ARM Cortex-M1 soft processor core, embedded Flash*Freeze technology for near-zero dynamic power standby, and abundant on-chip advanced features including PLLs and block RAM.
Architecturally, each of the 13,824 logic cells contains a look-up table plus registers with rich routing fabric, and the device supports single-ended and differential I/O standards across 235 available user pins in the FBGA-484 bondout. The 130 nm flash process delivers a balance of density, static power, and cost that made ProASIC3L a mainstay in long-lifecycle embedded systems.
Typical applications include industrial automation controllers, communications line cards, medical instrumentation, military/aerospace subsystems requiring instant-on or secure configuration, and test equipment glue logic where reprogrammability and long-term availability matter more than leading-edge density.
When designing with this device, budget the 1.2 V core rail separately from the 2.5 V/3.3 V I/O banks and verify the Flash*Freeze pin sequencing to achieve the low static-power benefit; the 484-ball footprint requires controlled-impedance PCB stack-up and X-ray-inspectable BGA assembly.
This page synthesizes distributor pricing context, drop-in alternatives from the same FGG484 footprint family, and practical design notes not found in the manufacturer datasheet. Pricing shown is as of 2026-08-31 and reflects quoted/order-on-request availability typical for this mature flash FPGA family.
드롭인 대체품: A3P600L-FGG484 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P600L-FGG484 (동일 폼 팩터 및 풋프린트) — 차이점: Package, RoHS Status, Configuration Memory, Technology, Core Supply Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P600L-FGG484I
✅ 드롭인✓ 재고 있음
$41.35 / 개
데이터시트 보기 →A3P600L-1FGG484
✅ 드롭인✓ 재고 있음
$30.4 / 개
데이터시트 보기 →A3P600L-1FGG484I
✅ 드롭인✓ 재고 있음
$17.1 / 개
데이터시트 보기 →A3P600-1FGG484
✅ 드롭인✓ 재고 있음
$52.4 / 개
데이터시트 보기 →A3P600-2FGG484I
✅ 드롭인✓ 재고 있음
$31.8 / 개
데이터시트 보기 →A3P1000L-1FGG484I
✅ 드롭인✓ 재고 있음
$28.8 / 개
데이터시트 보기 →A3P600L-FGG484 최대 정격 & 전기적 특성
| Family | ProASIC3L |
| Equivalent Gates | 600000 gates |
| Logic Cells / CLBs | 13824 |
| User I/O | 235 |
| Maximum System Frequency | 350 MHz |
| Core Voltage | 1.2 V (1.2 V to 1.5 V supported) |
| Technology | 130 nm CMOS flash |
| Configuration Memory | On-chip flash (non-volatile, single chip) |
| 패키지 | FBGA-484 (PBGA484) |
| Package Dimensions | 23 x 23 mm |
| Package Height | 2.23 mm |
| Ball Pitch | 1 mm |
| 실장 유형 | Surface Mount |
| Soft Processor Support | ARM Cortex-M1 |
| RoHS 상태 | Green (RoHS compliant per Jotrin listing) |
| Speed Grade Suffix | Standard (no dash number in this ordering code) |
A3P600L-FGG484 2.23 mm 핀 구성 가이드
A3P600L-FGG484(2.23 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P600L-FGG484.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P600L-FGG484 적합 용도: 6 애플리케이션s: Industrial Automation Controllers, Secure Military and Aerospace Subsystems, Medical Instrumentation, Communications Line Cards, Test and Measurement Equipment, Embedded System Bridge and Glue Logic.
Industrial Automation Controllers
The A3P600L-FGG484 fits industrial PLC I/O scanning, motor-control sequencing, and fieldbus glue logic because its 13,824 logic cells and 235 user I/Os absorb the mixed counter, encoder, and communication functions typical of a controller card, while the on-chip flash configuration survives power cycling in factory environments with no boot device to corrupt. Running at a 1.2 V core, the L variant reduces standby draw in always-on cabinets, and Flash*Freeze mode holds state during idle periods. Placed between a host CPU and isolated I/O banks, it offloads deterministic timing tasks; the trade-off versus a microcontroller is higher unit cost but far greater parallelism and pin count on one FBGA-484 footprint.
추천
Secure Military and Aerospace Subsystems
Flash-based configuration makes the A3P600L-FGG484 a natural fit for defense electronics where SRAM FPGA bitstream loading is a liability: there is no external configuration PROM to read out, and the design powers up instantly for mission-critical readiness. The 600K-gate capacity implements sensor interface, bus bridging (MIL-STD-1553-class glue, ARINC-style I/O), and cryptographic helper logic, while 235 I/Os terminate diverse legacy standards across banks. Deploy in conformal-cooled avionics trays using the FBGA-484's 23 x 23 mm footprint to conserve board area; the -1 speed grade variants (A3P600L-1FGG484I) close timing on higher-rate interfaces when the standard grade cannot.
추천
Medical Instrumentation
In medical diagnostic equipment - patient-monitor front ends, imaging detector interfaces, and lab analyzers - the A3P600L-FGG484 bridges analog front-end ICs to processors with deterministic timing that software alone cannot guarantee. Its 235 I/Os handle multi-channel sensor arrays, and the 350 MHz system capability covers high-rate data formatting. The flash configuration eliminates boot delays so instruments are ready the moment power is applied, a usability requirement in clinical settings, and single-chip configuration simplifies regulatory traceability of the boot path. Use the 1.2 V core L variant to reduce internal dissipation in sealed enclosures where airflow is limited, and validate I/O bank voltages against the attached sensor rails during schematic review.
추천
Communications Line Cards
The A3P600L-FGG484 serves as framing, multiplexing, and backplane-interface glue on telecom and networking line cards. With 13,824 cells and up to 350 MHz internal performance, it implements TDM framing, bit-rate adaptation, and status aggregation between PHYs and network processors, while 235 I/Os terminate multiple low-speed banks toward backplane connectors. Flash configuration allows hot discussion-free reinsertion: the card is active within microseconds of power-good, avoiding the SRAM-FPGA boot window that complicates high-availability redundant systems. Designers should budget the 1.2 V core rail separately and verify the FBGA-484 breakout impedance on thick backplane stack-ups; A3P600L-1FGG484 is the recommended grade when interface timing margins are tight.
추천
Test and Measurement Equipment
Bench instruments, ATE channels, and protocol analyzers benefit from the A3P600L-FGG484's reprogrammability: firmware-fielded instruments can gain new measurement modes by reprogramming the same 600K-gate flash fabric, with no configuration PROM swap. The 235 I/Os map directly to channel-card connector fields for pattern generation and acquisition, and deterministic internal timing up to 350 MHz supports capture state machines that a soft real-time MCU cannot sustain. Instant-on flash configuration shortens instrument boot to effectively zero - a documented selling point of ProASIC3 for test systems that cycle power frequently. Pair with precision ADCs and use Flash*Freeze during idle periods to cut instrument standby power.
추천
Embedded System Bridge and Glue Logic
For legacy-board life extension, the A3P600L-FGG484 consolidates the PLDs, bus transceivers, address decoders, and watchdog functions that were previously scattered across obsolete CPLDs. Its 600K-gate flash fabric, non-volatile configuration, and 235 I/Os let one FBGA-484 device replace multiple aging parts, cutting BOM risk on end-of-life designs - a common strategy for maintaining products whose original programmable logic is discontinued. Because configuration is on-chip, the replacement board behaves identically at power-up to the original discrete-logic assembly. Verify bank voltage compatibility with the legacy 3.3 V and 2.5 V signals during migration, and reuse the A3P600L-1FGG484 footprint-compatible speed grade if decoded access times need tightening.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P600L-FGG484 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P600L-FGG484I | A3P600L-1FGG484 | A3P600-1FGG484 | A3P1000L-1FGG484I |
|---|---|---|---|---|---|
| Package | FBGA-484 (23 x 23 mm, 1 mm pitch) | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent Gates | 600000 | 600000 | 600000 | 600000 | 1000000 |
| Speed Grade | Standard | Standard | -1 (faster) | -1 (faster) | -1 (faster) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.5 V class (standard core) | 1.2 V |
| Temperature Grade | Commercial (no I suffix) | Industrial | Commercial | Commercial | Industrial |
| Configuration Type | On-chip flash (non-volatile) | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
주요 차별점
- Low-power 1.2 V core variant (vs A3P600-1FGG484)
- Instant-on secure configuration (vs Xilinx Spartan-6 / Intel Cyclone IV equivalents)
- Pin-compatible up-migration path (vs A3P1000L-1FGG484I)
설계 노트
Estimated: budget the 1.2 V core rail independently of the I/O bank rails (2.5 V / 3.3 V as loaded). Because this is the L (low-power) variant, core static power is lower than the standard A3P600, but total dissipation scales with I/O count and toggle rate - run the Microchip Libero power estimator with your actual design before sizing the regulator. Flash*Freeze can hold state at near-zero standby power, but the FRZEN pin sequencing must be respected; treat it as a real design input, not a bonus feature.
The FBGA-484 uses a 1.0 mm ball pitch on a 23 x 23 mm body. Plan escape routing for the outer two rows with via-in-pad or dogleg fans, and reserve inner-row balls for power/ground per the manufacturer bondout. Use at least a 4-layer stack-up with a solid ground plane under the device; controlled-impedance traces are recommended for any bank used above 100 MHz. BGA assembly requires X-ray inspection capability - confirm your contract manufacturer supports 1 mm-pitch 484-ball rework before layout freeze.
Do not treat the ordering code casually: A3P600L-FGG484, A3P600L-FGG484I, and A3P600L-1FGG484 differ in temperature grade and speed grade despite sharing the identical footprint, and sourcing an I-suffixed or -1 part as a 'substitute' changes qualification assumptions. Also remember that although the device is single-chip self-configuring, design changes require Microchip Libero SoC and the correct family fabrication report for your die - verify timing with the actual speed grade before release.
규정 준수 정보
Jotrin listing describes the package as GREEN, indicating lead-free/RoHS-friendly construction. REACH, halogen-free, and conflict-minerals status not stated in provided data.
