A3P125-1VQG100T - 125K Gate ProASIC3 FPGA 272MHz | Microchip
부품 번호: A3P125-1VQG100T ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.8 | $258.00 |
| 100 | $22.4 | $2,240.00 |
| 500 | $19.9 | $9,950.00 |
| 1,000 | $17.6 | $17,600.00 |
A3P125-1VQG100T 개요
A flash-based FPGA is a field programmable gate array whose configuration is stored in on-chip nonvolatile flash memory cells rather than SRAM. This places the ProASIC3 family in the broader hierarchy of programmable logic devices: FPGA -> programmable logic IC -> semiconductor. Unlike SRAM FPGAs, a flash FPGA requires no external configuration PROM, boots instantly at power-up, and offers inherently higher configuration security against cloning.
Key features include reprogrammable nonvolatile flash fabric, single-chip operation with no boot-time configuration, small-footprint TQFP packaging for space-constrained designs, and low total cost of ownership. The ProASIC3 architecture provides abundant advanced features while delivering ASIC-level unit cost at low-to-mid volumes.
Technically, the device uses Microchip (formerly Actel/Microsemi) 130 nm flash switch technology, combining the reprogrammability of SRAM FPGAs with the security and instant-on behavior of antifuse devices. The fabric supports system-level performance suitable for glue logic replacement, control-plane functions, and interface bridging.
Typical applications include automotive subsystems, industrial control, portable instrumentation, and communication interface bridging where a single-chip, secure, low-density FPGA is required.
Design consideration: verify I/O bank voltage compatibility with adjacent rail standards (e.g., 3.3 V LVCMOS) and confirm availability, as ProASIC3 low-density members are aging; plan a second-source or migration path early.
This page synthesizes distributor pricing, verified drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: A3P125-1VQG100T — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P125-1VQG100T (동일 폼 팩터 및 풋프린트) — 차이점: Package, System Gates, Logic Elements, Process Technology, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P125-VQG100T
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3P125-VQG100
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3P125-1VQG100Y
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3P060-VQG100I
✅ 드롭인✓ 재고 있음
$6.95 / 개
데이터시트 보기 →A3P250-VQ100M
✅ 드롭인✓ 재고 있음
$140 / 개
데이터시트 보기 →A3P125-1VQG100T 최대 정격 & 전기적 특성
| Family | ProASIC3 |
| Equivalent Gate Count | 125000 gates |
| Logic Elements / CLBs | 3072 |
| User I/O | 71 |
| Maximum Operating Frequency | 272 MHz |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Configuration Technology | Nonvolatile Flash |
| 패키지 | 100-Pin TQFP (VQFP-100) |
| Package Body Size | 14 x 14 mm |
| Lead Pitch | 0.5 mm |
| 실장 유형 | Surface Mount |
| Packaging | Tray |
| Instant-On / Single Chip | Yes (no external configuration device required) |
A3P125-1VQG100T 14 x 14 mm 핀 구성 가이드
A3P125-1VQG100T(14 x 14 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P125-1VQG100T.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P125-1VQG100T 적합 용도: 6 애플리케이션s: Automotive Body Electronics and Gateways, Industrial Control and PLC I/O Modules, Portable and Handheld Instrumentation, Communication Interface Bridging, ASIC Prototyping and Low-Volume Emulation, Secure Embedded Systems and Anti-Cloning Designs.
Automotive Body Electronics and Gateways
The A3P125-1VQG100T fits automotive body-control and gateway bridging because its nonvolatile flash fabric is Instant-On: logic is active within microseconds of power-up, critical for CAN/LIN wake-up and diagnostic handshaking that must occur before an SRAM FPGA could finish configuration. With 3,072 logic elements and 71 user I/Os, it comfortably implements multiple UART/SPI/CAN-adjacent glue interfaces, IO expansion, and fault-monitoring state machines in a single 100-pin TQFP. Because the bitstream resides in on-chip flash with no external boot device, the design reduces BOM count and improves configuration security against cloning, a documented advantage of the Automotive ProASIC3 family (Microchip datasheet DS50003485). The 1.5 V core also limits static power, easing quiescent-current budgets in always-on automotive modules.
추천
Industrial Control and PLC I/O Modules
In industrial controllers, the A3P125-1VQG100T serves as deterministic glue logic: quadrature encoder decoding, PWM generation, safety-interlock state machines, and parallel bus bridging that a microcontroller cannot service with hard real-time latency. The 272 MHz maximum fabric frequency supports fast counter and filter implementations, while 71 user I/Os map directly onto the dense terminal blocks typical of PLC I/O cards. The flash configuration survives brownouts and power cycling without reconfiguration time, so field equipment resumes operation instantly after a fault - a common requirement in factory automation. Its single-chip design also removes the configuration PROM failure point, improving MTBF figures cited in industrial reliability analyses. Libero SoC supports the full design flow with simulation and timing closure for these deterministic functions.
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Portable and Handheld Instrumentation
Battery-powered instruments benefit from the A3P125-1VQG100T's small 14 x 14 mm TQFP-100 footprint and low static power from the 1.5 V core. Typical roles include sensor front-end sequencing, display interface logic, and power-rail control sequencing between an MCU and analog signal chain. Because the flash fabric is nonvolatile, an instrument can expose measurement hardware within milliseconds of the power switch, meeting user expectations for instant-on test tools. The 71 I/Os interface LCDs, keypads, ADC/DAC devices, and communication ports without external fanout logic. Single-chip operation also conserves board area in handheld enclosures where every square millimeter affects ergonomics. Designers should budget I/O bank voltages (typically 3.3 V LVCMOS) against the analog rail to avoid level-shifters in mixed-signal sections.
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Communication Interface Bridging
The A3P125-1VQG100T bridges legacy and modern interfaces: converting parallel buses to SPI/I2C, implementing protocol translators, or adding custom serial engines at up to 272 MHz fabric speed. Its flash-based Instant-On behavior matters in backplane systems where link partners expect valid I/O states immediately at power-up; SRAM FPGAs would need bus-hold or supervisory workarounds during configuration. With 71 user I/Os, one device can service two or three independent interface domains with banked voltages. Nonvolatile configuration also prevents bitstream interception during boot, relevant for equipment with proprietary protocol implementations. For designs needing more routing or larger packet buffers, the pin-compatible A3P250-VQ100M doubles resources on the identical TQFP-100 footprint, making the migration zero-PCB-change.
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ASIC Prototyping and Low-Volume Emulation
Microchip positions ProASIC3 as an ASIC-replacement path offering reprogrammability with ASIC-level unit cost, making the 125K-gate A3P125 ideal for prototyping modest gate-count ASIC blocks or serving low-volume production directly. A 125K-gate capacity accommodates moderate RTL blocks - controllers, small DSP datapaths, interface cores - while the flash fabric lets engineers iterate fixes without new mask sets. In low-volume runs, the same board design moves from prototype to production unchanged, eliminating resynthesis risk. Instant-On startup emulates masked ASIC behavior at system integration, and no external configuration device is required, matching ASIC single-chip expectations. Designers should validate timing at the -1 speed grade in Libero SoC, and reserve the pin-compatible A3P250-VQ100M footprint option for RTL growth beyond the 3,072 logic elements.
추천
Secure Embedded Systems and Anti-Cloning Designs
Flash FPGAs are favored where intellectual property must be protected: the configuration bitstream is stored in nonvolatile on-chip flash rather than loaded from an external SRAM-config device that can be intercepted. The A3P125-1VQG100T therefore suits secure dongles, licensed peripheral modules, and encryption-adjacent control logic where design theft is a business risk. Beyond security, Instant-On operation means protection logic is active before the host processor completes boot, closing race-condition windows exploited in supply-chain attacks. With 125K gates and 71 I/Os, typical implementations include authentication state machines, custom cipher wrappers around an MCU, and tamper-response sequencing. The single-chip construction also reduces the bill of materials, shrinking the physical attack surface relative to FPGA-plus-PROM solutions.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P125-1VQG100T — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P125-VQG100T | A3P125-VQG100 | A3P125-1VQG100Y | A3P060-VQG100I | A3P250-VQ100M |
|---|---|---|---|---|---|---|
| Package | TQFP-100 (VQFP-100), 14 x 14 mm, 0.5 mm pitch | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Speed Grade | -1 | Standard | Standard | -1 | Standard | Standard |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Configuration Technology | Nonvolatile Flash (single-chip, Instant-On) | Nonvolatile Flash | Nonvolatile Flash | Nonvolatile Flash | Nonvolatile Flash | Nonvolatile Flash |
주요 차별점
- Fastest (-1) speed grade in the same footprint (vs A3P125-VQG100)
- Lowest logic density option keeps unit cost down (vs A3P250-VQ100M)
- Full 125K resource set vs cost-down part (vs A3P060-VQG100I)
설계 노트
The A3P125 core requires 1.5 V; I/O banks are separately supplied (commonly 3.3 V LVCMOS). Estimated: with 3,072 logic elements at low toggle rates, core current typically stays in the tens of milliamps, but always run Microchip's SmartPower power estimator in Libero SoC with your actual netlist before finalizing the regulator. Provide a solid 1.5 V plane and decouple each VCC pin with 0.1 uF ceramics placed within 2 mm of the pin, plus bulk 10 uF per rail. Sequence I/O banks so inputs are not driven while the bank is unpowered.
The VQFP-100 0.5 mm pitch requires a solder-mask-defined or non-solder-mask-defined pad per IPC recommendations; use 0.25-0.27 mm stencil apertures to avoid bridging. Place the 100-pin footprint with a keep-out allowing probe access to JTAG pins (TCK, TMS, TDI, TDO) - FlashPro programming access is mandatory for both configuration and debug, so do not bury these nets under connectors. Since configuration is on-chip flash, no configuration PROM footprint is needed, simplifying the BOM versus SRAM FPGA designs.
Do not assume all same-footprint ProASIC3 parts are interchangeable in timing: the -1 speed grade of this part is faster than the standard grade of A3P125-VQG100, so re-run timing closure when substituting. Verify availability early - Octopart shows only one quoting distributor as of 2026-08-31, so design in the pin-compatible A3P250-VQ100M or A3P125-VQG100T as second-source options. Unused I/Os should be configured as grounded outputs or inputs with weak pull-down per Microchip guidance to avoid floating-node EMI.
규정 준수 정보
Verified web data describes the part as automotive-grade and green packaging per third-party listings, but explicit RoHS/REACH/AEC-Q100 certification status was not found in the provided data and must be confirmed on the Microchip product page.
