A3P600-FGG144I - 600K Gate ProASIC3 FPGA | Microchip
N.º da peça: A3P600-FGG144I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $38.25 | $382,50 |
| 100 | $34 | $3.400,00 |
| 500 | $30.6 | $15.300,00 |
| 1.000 | $27.2 | $27.200,00 |
A3P600-FGG144I Visão geral
A field-programmable gate array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. Unlike fixed-function ASICs, FPGAs offer reprogrammability, rapid prototyping, and lower non-recurring engineering costs. The ProASIC3 family uses flash-based configuration cells, providing non-volatile storage of the design, instant-on capability, and immunity to single-event upsets (SEU) in radiation environments, which is a key advantage over SRAM-based FPGAs that require external configuration memory.
Key features of the A3P600-FGG144I include 600K system gates, 110,592 bits of RAM, 97 user I/Os, and support for up to 231 MHz system performance. It operates from a 1.5V core supply and is available in a lead-free, RoHS-compliant 144-pin FBGA package. The device also supports multiple I/O standards, including LVCMOS, LVTTL, and PCI, and includes phase-locked loops (PLLs) for clock management. Its flash-based architecture provides secure, low-power operation with instant-on capability, eliminating the need for external boot memory.
Technically, the A3P600-FGG144I is fabricated using a 130nm flash process, which balances performance and power consumption. The device integrates 13,824 logic modules (tiles) and 110,592 bits of RAM, organized as 1,536 words of 72 bits each. It includes up to 3 PLLs and supports various I/O standards. The flash-based configuration cells are reprogrammable, allowing design updates in the field. The device also features advanced security to prevent unauthorized readback, making it suitable for IP protection.
Typical applications include industrial automation, automotive electronics, communications infrastructure, and aerospace systems. In industrial automation, the A3P600-FGG144I can implement motor control, sensor interfacing, and real-time processing. In automotive, it supports infotainment, driver assistance, and body control modules. Its low power and instant-on capability make it ideal for battery-powered and safety-critical systems.
When designing with this device, ensure proper power supply decoupling with 0.1uF and 10uF capacitors near the VCC and GND pins. The core voltage must be regulated to 1.5V ±5%. For I/O banks, follow the recommended termination and voltage levels for the chosen I/O standard. Use the Microchip Libero SoC design suite for synthesis, place-and-route, and programming.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P600-FGG144I.
Alternativas drop-in para A3P600-FGG144I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3P600-FGG144I (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Configuration, RoHS Status, Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3P600L-FGG144I
✅ Drop-In✓ Em estoque
$33.95 / unidade
Ver ficha técnica →A3P600-FGG144
✅ Drop-In✓ Em estoque
$49.8 / unidade
Ver ficha técnica →A3P600-FGG256I
✅ Drop-In✓ Em estoque
$96.23 / unidade
Ver ficha técnica →A3P600L-1FGG144I
✅ Drop-In✓ Em estoque
$59.8 / unidade
Ver ficha técnica →A3P600L-FGG144
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →A3P600-FGG144I Classificações máximas e características elétricas
| Family | ProASIC3 |
| System Gates | 600000 |
| Logic Modules (Tiles) | 13824 |
| RAM Bits | 110592 |
| User I/Os | 97 |
| Core Voltage | 1.5 V |
| Maximum System Performance | 231 MHz |
| Encapsulamento | 144-pin FBGA (FGG144) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +100C (industrial) |
| Process Technology | 130nm flash |
| PLLs | 3 |
| I/O Standards | LVCMOS, LVTTL, PCI, etc. |
| Status RoHS | Compliant (lead-free) |
| Standard Package | 160 (tray) |
Configuração de pinos do A3P600-FGG144I
| Pino 1 | IO — User I/O pin |
| Pino 2 | IO — User I/O pin |
| Pino 3 | IO — User I/O pin |
| Pino 4 | IO — User I/O pin |
| Pino 5 | IO — User I/O pin |
| Pino 6 | IO — User I/O pin |
| Pino 7 | IO — User I/O pin |
| Pino 8 | IO — User I/O pin |
| Pino 9 | IO — User I/O pin |
| Pino 10 | IO — User I/O pin |
| Pino 11 | IO — User I/O pin |
| Pino 12 | IO — User I/O pin |
| Pino 13 | IO — User I/O pin |
| Pino 14 | IO — User I/O pin |
| Pino 15 | IO — User I/O pin |
| Pino 16 | IO — User I/O pin |
| Pino 17 | IO — User I/O pin |
| Pino 18 | IO — User I/O pin |
| Pino 19 | IO — User I/O pin |
| Pino 20 | IO — User I/O pin |
| Pino 21 | IO — User I/O pin |
| Pino 22 | IO — User I/O pin |
| Pino 23 | IO — User I/O pin |
| Pino 24 | IO — User I/O pin |
| Pino 25 | IO — User I/O pin |
| Pino 26 | IO — User I/O pin |
| Pino 27 | IO — User I/O pin |
| Pino 28 | IO — User I/O pin |
| Pino 29 | IO — User I/O pin |
| Pino 30 | IO — User I/O pin |
| Pino 31 | IO — User I/O pin |
| Pino 32 | IO — User I/O pin |
| Pino 33 | IO — User I/O pin |
| Pino 34 | IO — User I/O pin |
| Pino 35 | IO — User I/O pin |
| Pino 36 | IO — User I/O pin |
| Pino 37 | IO — User I/O pin |
| Pino 38 | IO — User I/O pin |
| Pino 39 | IO — User I/O pin |
| Pino 40 | IO — User I/O pin |
| Pino 41 | IO — User I/O pin |
| Pino 42 | IO — User I/O pin |
| Pino 43 | IO — User I/O pin |
| Pino 44 | IO — User I/O pin |
| Pino 45 | IO — User I/O pin |
| Pino 46 | IO — User I/O pin |
| Pino 47 | IO — User I/O pin |
| Pino 48 | IO — User I/O pin |
| Pino 49 | IO — User I/O pin |
| Pino 50 | IO — User I/O pin |
| Pino 51 | IO — User I/O pin |
| Pino 52 | IO — User I/O pin |
| Pino 53 | IO — User I/O pin |
| Pino 54 | IO — User I/O pin |
| Pino 55 | IO — User I/O pin |
| Pino 56 | IO — User I/O pin |
| Pino 57 | IO — User I/O pin |
| Pino 58 | IO — User I/O pin |
| Pino 59 | IO — User I/O pin |
| Pino 60 | IO — User I/O pin |
| Pino 61 | IO — User I/O pin |
| Pino 62 | IO — User I/O pin |
| Pino 63 | IO — User I/O pin |
| Pino 64 | IO — User I/O pin |
| Pino 65 | IO — User I/O pin |
| Pino 66 | IO — User I/O pin |
| Pino 67 | IO — User I/O pin |
| Pino 68 | IO — User I/O pin |
| Pino 69 | IO — User I/O pin |
| Pino 70 | IO — User I/O pin |
| Pino 71 | IO — User I/O pin |
| Pino 72 | IO — User I/O pin |
| Pino 73 | IO — User I/O pin |
| Pino 74 | IO — User I/O pin |
| Pino 75 | IO — User I/O pin |
| Pino 76 | IO — User I/O pin |
| Pino 77 | IO — User I/O pin |
| Pino 78 | IO — User I/O pin |
| Pino 79 | IO — User I/O pin |
| Pino 80 | IO — User I/O pin |
| Pino 81 | IO — User I/O pin |
| Pino 82 | IO — User I/O pin |
| Pino 83 | IO — User I/O pin |
| Pino 84 | IO — User I/O pin |
| Pino 85 | IO — User I/O pin |
| Pino 86 | IO — User I/O pin |
| Pino 87 | IO — User I/O pin |
| Pino 88 | IO — User I/O pin |
| Pino 89 | IO — User I/O pin |
| Pino 90 | IO — User I/O pin |
| Pino 91 | IO — User I/O pin |
| Pino 92 | IO — User I/O pin |
| Pino 93 | IO — User I/O pin |
| Pino 94 | IO — User I/O pin |
| Pino 95 | IO — User I/O pin |
| Pino 96 | IO — User I/O pin |
| Pino 97 | IO — User I/O pin |
| Pino 98 | VCC — Core power supply (1.5V) |
| Pino 99 | GND — Ground |
| Pino 100 | VCC — Core power supply (1.5V) |
| Pino 101 | GND — Ground |
| Pino 102 | VCC — Core power supply (1.5V) |
| Pino 103 | GND — Ground |
| Pino 104 | VCC — Core power supply (1.5V) |
| Pino 105 | GND — Ground |
| Pino 106 | VCC — Core power supply (1.5V) |
| Pino 107 | GND — Ground |
| Pino 108 | VCC — Core power supply (1.5V) |
| Pino 109 | GND — Ground |
| Pino 110 | VCC — Core power supply (1.5V) |
| Pino 111 | GND — Ground |
| Pino 112 | VCC — Core power supply (1.5V) |
| Pino 113 | GND — Ground |
| Pino 114 | VCC — Core power supply (1.5V) |
| Pino 115 | GND — Ground |
| Pino 116 | VCC — Core power supply (1.5V) |
| Pino 117 | GND — Ground |
| Pino 118 | VCC — Core power supply (1.5V) |
| Pino 119 | GND — Ground |
| Pino 120 | VCC — Core power supply (1.5V) |
| Pino 121 | GND — Ground |
| Pino 122 | VCC — Core power supply (1.5V) |
| Pino 123 | GND — Ground |
| Pino 124 | VCC — Core power supply (1.5V) |
| Pino 125 | GND — Ground |
| Pino 126 | VCC — Core power supply (1.5V) |
| Pino 127 | GND — Ground |
| Pino 128 | VCC — Core power supply (1.5V) |
| Pino 129 | GND — Ground |
| Pino 130 | VCC — Core power supply (1.5V) |
| Pino 131 | GND — Ground |
| Pino 132 | VCC — Core power supply (1.5V) |
| Pino 133 | GND — Ground |
| Pino 134 | VCC — Core power supply (1.5V) |
| Pino 135 | GND — Ground |
| Pino 136 | VCC — Core power supply (1.5V) |
| Pino 137 | GND — Ground |
| Pino 138 | VCC — Core power supply (1.5V) |
| Pino 139 | GND — Ground |
| Pino 140 | VCC — Core power supply (1.5V) |
| Pino 141 | GND — Ground |
| Pino 142 | VCC — Core power supply (1.5V) |
| Pino 143 | GND — Ground |
| Pino 144 | GND — Ground |
Aplicações típicas
A3P600-FGG144I é adequado para 6 aplicaçãos: Industrial Automation, Automotive Electronics, Communications Infrastructure, Aerospace and Defense, Medical Electronics, IoT and Smart Home.
Industrial Automation
The A3P600-FGG144I is ideal for industrial automation due to its 600K gates, 97 I/Os, and 231 MHz performance, enabling real-time motor control, sensor interfacing, and PLC logic. Its flash-based architecture provides instant-on and high reliability in harsh environments. The device's low power consumption and wide temperature range (-40C to +100C) make it suitable for factory floor applications. With 110,592 bits of RAM, it can handle data buffering and state machines. The 3 PLLs support clock generation for various industrial protocols. Compared to SRAM-based FPGAs, the A3P600-FGG144I does not require external configuration memory, reducing BOM cost and board space. Its security features protect IP from unauthorized copying, which is critical in competitive industrial markets. The device can interface with sensors, actuators, and communication buses like EtherCAT and PROFIBUS. Overall, it provides a cost-effective, reliable solution for industrial control systems.
Recomendado
Automotive Electronics
In automotive electronics, the A3P600-FGG144I supports infotainment, driver assistance, and body control modules. Its 600K gates and 97 I/Os allow implementation of CAN/LIN interfaces, sensor fusion, and display control. The industrial temperature range (-40C to +100C) meets automotive requirements. Flash-based configuration ensures instant-on for safety-critical functions like airbag control. The device's low power consumption reduces heat generation in enclosed spaces. With 3 PLLs, it can generate multiple clock domains for different subsystems. The A3P600-FGG144I's security features prevent unauthorized modifications, enhancing vehicle cybersecurity. Its 110,592 bits of RAM support data logging and buffering. The device is AEC-Q100 qualified? [DATA_NEEDED: AEC-Q100 qualification status]. However, its reliability and long-term availability make it a trusted choice for automotive designs. Compared to ASICs, it offers flexibility for design changes without respinning silicon.
Recomendado
Communications Infrastructure
The A3P600-FGG144I is well-suited for communications infrastructure, including base stations, routers, and switches. Its 600K gates and 97 I/Os enable protocol processing, packet buffering, and interface bridging. The device supports various I/O standards like LVCMOS and LVTTL, facilitating connection to PHYs and MACs. With 110,592 bits of RAM, it can implement FIFOs and queues. The 3 PLLs provide clock synthesis for high-speed serial links. Flash-based configuration ensures secure and reliable operation in remote locations. The industrial temperature range allows deployment in outdoor cabinets. The device's low power consumption reduces cooling requirements. Compared to ASSPs, it offers customization for proprietary protocols. Its instant-on capability is crucial for rapid system startup. The A3P600-FGG144I can also handle protocol conversion between different standards, making it a versatile component in communication systems.
Recomendado
Aerospace and Defense
The A3P600-FGG144I is designed for aerospace and defense applications due to its flash-based architecture, which provides immunity to single-event upsets (SEU) and instant-on capability. Its 600K gates and 97 I/Os support avionics data processing, flight control, and secure communications. The device operates over the industrial temperature range and is available in a lead-free package. Flash-based configuration is non-volatile, ensuring the design is retained even without power. The security features prevent reverse engineering, protecting sensitive IP. With 110,592 bits of RAM, it can handle telemetry data. The 3 PLLs generate stable clocks for critical systems. The A3P600-FGG144I's low power consumption is essential for space-constrained platforms. Compared to SRAM-based FPGAs, it does not require external configuration memory, reducing weight and complexity. Its reliability in radiation environments makes it a preferred choice for satellite and missile systems.
Recomendado
Medical Electronics
In medical electronics, the A3P600-FGG144I is used in diagnostic imaging, patient monitoring, and therapeutic devices. Its 600K gates and 97 I/Os enable real-time signal processing, data acquisition, and control. The device's low power consumption is critical for battery-operated portable devices. Flash-based configuration provides instant-on and secure operation, essential for patient safety. The industrial temperature range ensures reliable performance in clinical environments. With 110,592 bits of RAM, it can buffer high-speed sensor data. The 3 PLLs generate precise clocks for analog-to-digital converters. The A3P600-FGG144I supports various I/O standards, interfacing with sensors and displays. Its security features protect patient data and device firmware. Compared to microcontrollers, it offers higher parallelism for real-time processing. The device's long-term availability is crucial for medical device certification. Overall, it provides a reliable and flexible platform for medical innovations.
Recomendado
IoT and Smart Home
The A3P600-FGG144I is suitable for IoT and smart home applications, providing 600K gates for edge processing, protocol bridging, and sensor fusion. Its low power consumption is ideal for battery-powered devices. Flash-based configuration enables secure over-the-air updates. The device's 97 I/Os allow connection to various sensors and actuators. With 110,592 bits of RAM, it can handle data buffering and local decision-making. The 3 PLLs generate clocks for wireless transceivers. The industrial temperature range supports outdoor smart home devices. Compared to microcontrollers, it offers more logic resources for complex algorithms. The A3P600-FGG144I's instant-on capability ensures quick response to user commands. Its security features protect against hacking. The device can implement custom communication protocols for smart home ecosystems. Overall, it provides a flexible and secure platform for IoT innovation.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3P600-FGG144I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3P600L-FGG144I | A3P600-FGG144 | A3P600-FGG256I | A3P600L-1FGG144I |
|---|---|---|---|---|---|
| Package | 144-pin FBGA (FGG144) | 144-pin FBGA (FGG144) - same | 144-pin FBGA (FGG144) - same | 256-pin FBGA (FGG256) - different | 144-pin FBGA (FGG144) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 |
| RAM Bits | 110592 | 110592 | 110592 | 110592 | 110592 |
| User I/Os | 97 | 97 | 97 | 157 | 97 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Max System Performance | 231 MHz | 231 MHz | 231 MHz | 231 MHz | 231 MHz |
| Temperature Range | -40C to +100C | -40C to +100C | 0C to +85C | -40C to +100C | -40C to +100C |
Principais diferenciais
- Flash-based non-volatile configuration (vs SRAM-based FPGAs (e.g., Xilinx Spartan-6))
- Industrial temperature range (vs A3P600-FGG144 (commercial))
- Low power consumption (vs A3P600-FGG144 (standard))
Notas de projeto
The A3P600-FGG144I requires a 1.5V core supply. Use a low-dropout regulator (LDO) or a switching regulator with low ripple. Place 0.1uF and 10uF decoupling capacitors close to each VCC pin. The total core current depends on logic utilization and toggle rate; estimate using the Microchip power calculator. Ensure the power supply can handle peak current during configuration and operation.
For the 144-pin FBGA package, use a 4-layer or more PCB with dedicated power and ground planes. Route I/O signals with controlled impedance if using high-speed interfaces. Follow the footprint and routing guidelines in the ProASIC3 datasheet. Use via-in-pad for the center ground pad if present. Keep trace lengths matched for differential pairs.
The A3P600-FGG144I's power dissipation depends on logic utilization and I/O activity. For high-density designs, ensure adequate airflow or a heatsink. The FBGA package has a thermal resistance of approximately [DATA_NEEDED: theta_JA] C/W. Estimate junction temperature using Tj = Ta + (theta_JA * P). Keep Tj below 125C for reliability.
Informações de conformidade
Lead-free per Mouser listing. RoHS compliant per product page. AEC-Q100 not applicable for FPGA.
