A3P600L-FG144 - ProASIC3L 600k-Gate Low-Power FPGA | Microchip
부품 번호: A3P600L-FG144 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $73.68 | $73.68 |
| 10 | $66.31 | $663.10 |
| 100 | $59.68 | $5,968.00 |
| 500 | $53.71 | $26,855.00 |
| 1,000 | $48.34 | $48,340.00 |
A3P600L-FG144 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of programmable logic blocks and interconnects that designers configure to implement custom digital circuits. Within the programmable logic hierarchy, the ProASIC3L belongs to the nonvolatile flash FPGA family: unlike SRAM FPGAs, it stores its configuration in on-chip flash, needs no external boot PROM, and reaches instant-on operation at power-up.
Key features include single-chip, single-voltage operation, Flash*Freeze technology that cuts static power to microwatt levels without losing register or SRAM state, and live reprogrammability. The flash fabric also delivers intrinsic security because configuration data cannot be read back, protecting designs against cloning and overbuilding.
Technically, the A3P600L is built on a CMOS flash process and integrates 110,592 bits of dedicated embedded flash memory alongside the configuration cells, plus embedded SRAM blocks. Logic cells support single-bit registers, look-up-table logic, and carry chains suitable for state machines and datapaths clocked up to roughly 250 MHz depending on design complexity.
Typical applications include portable and battery-powered instrumentation, industrial control, aerospace subsystems requiring instant-on and configuration security, and glue-logic consolidation replacing multiple ASSPs and CPLDs.
Design consideration: the -F (commercial 0 to 85 C) speed/temp grade means designers needing industrial temperature should evaluate the FGG/I variants. Core voltage must be selected between 1.2 V (lowest power) and 1.5 V (highest performance) at board design time.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: A3P600L-FG144 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P600L-FG144 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, System Gates, Technology, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P600L-FGG144
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3P600L-1FG144
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$25.73 / 개
데이터시트 보기 →A3P600L-1FGG144
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$29.4 / 개
데이터시트 보기 →A3P600-FG144
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$15.6 / 개
데이터시트 보기 →A3P1000L-FG144
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$72.5 / 개
데이터시트 보기 →A3P1000L-1FG144
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$119 / 개
데이터시트 보기 →A3P600L-FG144 최대 정격 & 전기적 특성
| Family | ProASIC3L (Flash FPGA) |
| System Gates | 600000 |
| Logic Cells | 13824 |
| User I/O | 97 |
| Core Voltage | 1.2 V to 1.5 V |
| Configuration Memory | Nonvolatile Flash (single-chip) |
| Embedded Flash Memory | 110592 bits |
| Max Clock Frequency | 250 MHz |
| Special Features | Flash*Freeze low-power mode, instant-on, secure nonvolatile configuration |
| 패키지 | 144-ball FBGA (FG144), 13 x 13 mm, 1.0 mm pitch, 1.45 mm height |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0C to +85C (commercial, -F grade) |
| RoHS 상태 | Compliant |
| Programming | In-system reprogrammable via JTAG / flash programming |
A3P600L-FG144 144-ball fbga (fg144), 13 x 13 mm, 1.0 mm pitch, 1.45 mm height 핀 구성 가이드
A3P600L-FG144(144-ball fbga (fg144), 13 x 13 mm, 1.0 mm pitch, 1.45 mm height 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P600L-FG144.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P600L-FG144 적합 용도: 6 애플리케이션s: Portable and Battery-Powered Instruments, Industrial Control and Automation, Aerospace and Defense Subsystems, Glue Logic Consolidation, Medical Diagnostic Devices, Secure Embedded Controllers.
Portable and Battery-Powered Instruments
The A3P600L-FG144 fits battery-powered instruments because its 1.2 V core option and Flash*Freeze mode cut static power to microwatts while retaining register and SRAM state. A handheld data logger can clock the fabric at up to roughly 250 MHz during measurement bursts, then drop into Flash*Freeze between samples, dramatically extending battery life compared with SRAM FPGAs that cannot sleep without losing configuration. Because configuration is nonvolatile flash, the device is active within microseconds of wake-up with no boot PROM read current. With 13,824 logic cells and 97 user I/Os, it consolidates glue logic, bus interfaces, and timing controllers that would otherwise consume multiple ICs and their quiescent budgets.
추천
Industrial Control and Automation
In industrial control, the A3P600L-FG144 provides instant-on deterministic logic for machine sequencing, safety interlock pre-logic, and sensor aggregation. Its nonvolatile flash configuration means the FPGA begins operating immediately at power-up - critical for PLC I/O modules that must be ready before the main CPU boots. The 97 user I/Os interface 3.3 V/2.5 V industrial signals across I/O banks, and 13,824 logic cells implement PWM generators, quadrature decoders, and communication bridges. Flash*Freeze allows idle modules on a continuously powered backplane to enter microwatt sleep, and the secure flash fabric resists design cloning on the factory floor, protecting proprietary control IP from unauthorized readback.
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Aerospace and Defense Subsystems
Aerospace subsystems favor ProASIC3L flash FPGAs because single-chip nonvolatile configuration removes SEU-prone external configuration PROMs and provides instant-on behavior for payload power sequencing. The secure flash fabric cannot be read back, satisfying anti-tamper and design-protection requirements common in defense programs. The A3P600L-FG144's 600k gates and 97 I/Os implement telemetry formatting, bus bridges, and sensor preprocessing in spacecraft avionics boxes where board area is premium (13 x 13 mm footprint). Designers should select industrial or military temperature grades (FGG/I variants) and follow Microchip radiation and reliability documentation for mission profiles requiring qualification data.
추천
Glue Logic Consolidation
The A3P600L-FG144 replaces multiple ASSPs, CPLDs, and discrete logic in bus-bridging and board-level glue applications. Its 13,824 logic cells absorb address decoders, bus width converters, interrupt controllers, and reset trees, while 110,592 bits of embedded flash store serial numbers, calibration constants, or boot parameters on-chip - eliminating a separate EEPROM. Instant-on flash operation means glue logic is functional before the host processor completes boot, avoiding the startup-latency problems of SRAM FPGAs. At roughly $73.68 (as of 2026-08-31), consolidating five or more small logic ICs frequently yields net BOM savings while adding in-field reprogrammability through JTAG for future revisions.
추천
Medical Diagnostic Devices
Medical diagnostics benefit from the A3P600L-FG144's low power, instant-on, and secure configuration. Point-of-care analyzers and portable ultrasound front ends use the 600k-gate fabric for ADC interfacing, filtering, and protocol translation, with Flash*Freeze enabling the device to sleep between measurements while retaining state - important for handheld devices with duty-cycled operation. The nonvolatile flash fabric protects proprietary DSP algorithms and calibration IP from extraction, supporting regulatory design confidentiality. The 13 x 13 mm, 144-ball FBGA fits compact probe electronics, and its 0 to 85 C commercial grade suits clinical environments, with FGG industrial variants available for harsher transport/storage requirements.
추천
Secure Embedded Controllers
For secure embedded control, the A3P600L-FG144's flash-based fabric delivers intrinsic configuration security: unlike SRAM FPGAs whose bitstreams travel off-chip at every boot, the ProASIC3L stores the design internally and permits no readback, defending against cloning and overbuilding. The 110,592-bit embedded flash acts as on-chip secure NVM for keys and device identity, and 13,824 logic cells implement encryption wrappers, authentication state machines, and tamper-response logic. Single-chip operation removes the configuration interface - a common attack surface. The 1.2 V core option suits always-on security modules needing minimal standby draw while remaining instantly active on wake events.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P600L-FG144 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P600L-FGG144 | A3P600L-1FG144 | A3P600-FG144 | A3P1000L-FG144 |
|---|---|---|---|---|---|
| Package | 144-ball FBGA (FG144), 13 x 13 mm | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 1,000,000 |
| Logic Cells | 13,824 | 13,824 | 13,824 | 13,824 | 23,040 |
| User I/O | 97 | 97 | 97 | 97 | 135 |
| Core Voltage | 1.2 V - 1.5 V | 1.2 V - 1.5 V | 1.2 V - 1.5 V | 1.5 V fixed | 1.2 V - 1.5 V |
| Flash*Freeze Low-Power Mode | Yes | Yes | Yes | No | Yes |
주요 차별점
- Flash*Freeze microwatt sleep with state retention (vs A3P600-FG144)
- Configurable 1.2 V to 1.5 V core (vs A3P600-FG144)
- Lower cost per gate at matched footprint (vs A3P1000L-FG144)
설계 노트
Select the core voltage at board design time: 1.5 V maximizes performance while 1.2 V minimizes dynamic power. Estimate power with Microchip's Libero SmartPower tool before fixing the rail; the difference between 1.2 V and 1.5 V core operation can approach 35% dynamic power reduction at the same clock. For Flash*Freeze operation, ensure the Flash*Freeze pin and I/O hold conditions in your design meet the datasheet setup/hold so register and SRAM state are retained during sleep.
The 144-ball FBGA (1.0 mm pitch, 13 x 13 mm) typically requires 4-layer minimum stackup for escape routing of the 97 user I/Os plus power balls; dog-bone via-in-pad escapes on 0.5 mm via drills are standard practice. Place 100 nF ceramic decoupling capacitors within 3 mm of the power balls and one bulk 10 uF per rail. Follow Microchip's ProASIC3L PCB layout guidelines in the device handbook for ball-mapping recommendations.
The -FG suffix is the commercial 0 to 85 C grade; industrial applications must order FGG/I variants instead - do not assume the FG part covers -40C. Also note the FG versus FGG distinction is a package material variant (standard versus green/lead-free), not a speed grade; speed grade is encoded in the leading digit (e.g., -1). Verify both suffixes against the Microchip ordering code before release, and remember no external configuration PROM is needed - do not add one.
규정 준수 정보
RoHS compliance indicated for the ProASIC3L family; the FGG suffix denotes the green/lead-free package variant. REACH, halogen-free, and conflict-minerals status should be confirmed from Microchip's current product compliance documentation.
