A3P1000L-1FG144 - ProASIC3L Flash FPGA 97 I/O | Microchip
부품 번호: A3P1000L-1FG144 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $161.99 | $161.99 |
| 10 | $149.5 | $1,495.00 |
| 100 | $138 | $13,800.00 |
| 500 | $128.5 | $64,250.00 |
| 1,000 | $119 | $119,000.00 |
A3P1000L-1FG144 개요
A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash memory rather than an external configuration ROM. Within the programmable logic hierarchy (FPGA -> programmable logic device -> digital IC), flash-based FPGAs occupy the single-chip, instant-on segment, contrasting with SRAM FPGAs that require external boot devices. The ProASIC3L family is the low-power variant of ProASIC3, adding Flash*Freeze technology.
Key features include a 1.2 V to 1.5 V core voltage, non-volatile flash configuration eliminating external boot PROMs, low static power consumption, and Flash*Freeze mode that freezes I/O state while cutting dynamic power. The -1 speed grade targets cost-optimized designs, and the live-at-power-up behavior supports secure, single-chip designs.
Architecturally, ProASIC3L uses VersTiles on a sea-of-gates fabric with embedded flash-based routing switches, hardened support for DDR/SDR memory interfaces, and compatibility with Microchip (Actel) Libero SoC design software. The fabric supports levels of security uncommon in SRAM FPGAs because the configuration lives on-chip.
Typical applications include portable and battery-powered instrumentation, industrial control, secure embedded systems, communications line cards, and space- or power-constrained glue logic consolidation.
Design consideration: the -1 speed grade limits maximum fabric toggle rates versus -2 parts; verify timing closure in Libero before committing the footprint, and budget for 1.2 V core rail sequencing.
This page synthesizes distributor pricing, drop-in alternatives within the ProASIC3/ProASIC3L FG144 family, and design notes not found in the manufacturer datasheet.
드롭인 대체품: A3P1000L-1FG144 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P1000L-1FG144 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Family, System Gates, Configuration Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P1000L-1FGG144
✅ 드롭인✓ 재고 있음
$29.9 / 개
데이터시트 보기 →A3P1000L-1FGG144I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3P1000-1FGG144T
✅ 드롭인✓ 재고 있음
$75 / 개
데이터시트 보기 →A3P1000-2FGG144I
✅ 드롭인✓ 재고 있음
$27.2 / 개
데이터시트 보기 →A3P1000-FG144
✅ 드롭인✓ 재고 있음
$27.2 / 개
데이터시트 보기 →A3P600L-1FG144
✅ 드롭인✓ 재고 있음
$25.73 / 개
데이터시트 보기 →A3P600L-1FGG144
✅ 드롭인✓ 재고 있음
$29.4 / 개
데이터시트 보기 →A3P1000L-1FG144 최대 정격 & 전기적 특성
| Family | ProASIC3L (Flash FPGA) |
| Logic Elements | 11K LEs |
| Logic Cells (CLBs) | 24576 |
| System Gates | 1000000 |
| User I/O | 97 |
| Embedded Flash Memory | 147456 bits |
| Core Voltage | 1.2 V to 1.5 V |
| Speed Grade | -1 |
| Configuration Memory | On-chip flash (non-volatile, single-chip) |
| Low Power Technology | Flash*Freeze |
| 패키지 | 144-LBGA (FBGA-144), 13 x 13 mm, 1 mm pitch, 1.45 mm height |
| 실장 유형 | Surface Mount |
| Technology | CMOS flash-based FPGA |
A3P1000L-1FG144 144-lbga (fbga-144), 13 x 13 mm, 1 mm pitch, 1.45 mm height 핀 구성 가이드
A3P1000L-1FG144(144-lbga (fbga-144), 13 x 13 mm, 1 mm pitch, 1.45 mm height 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P1000L-1FG144.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P1000L-1FG144 적합 용도: 6 애플리케이션s: Portable & Battery-Powered Instruments, Industrial Control & Automation, Secure Embedded Systems, Communications Line Cards & Networking, Medical & Diagnostic Devices, Aerospace-Adjacent & Rugged Commercial Systems.
Portable & Battery-Powered Instruments
The A3P1000L-1FG144 fits portable instrumentation because the ProASIC3L 'L' die was purpose-built for low static power, and Flash*Freeze technology freezes I/O and internal register state while cutting dynamic power dramatically during idle periods - ideal for handheld meters, data loggers, and field test equipment that sleep between measurements. With a 1.2 V core option and non-volatile on-chip flash configuration, there is zero boot energy spent loading an external configuration device, which also removes one component from the battery-powered BOM. Place the device between an MCU and front-end circuitry to implement glue logic, timing, and sensor interfacing; wake latency from Flash*Freeze is near-instant, preserving responsive user experience while extending battery life compared with always-on SRAM FPGAs.
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Industrial Control & Automation
In industrial control panels and automation nodes, the A3P1000L-1FG144 consolidates PLC I/O logic, encoder interfaces, and safety interlocks into a single flash FPGA whose configuration survives power cycling instantly - critical for machinery that must be live at power-up. The 97 user I/Os at 13 x 13 mm provide dense interface integration for 24 V industrial signaling through appropriate level shifters, and the on-chip flash configuration resists configuration corruption in electrically noisy factory environments. Because the -1 speed grade targets cost-optimized designs, moderate-speed sequencing and I/O expansion tasks run comfortably while static power stays low in 24/7 operation. Designers should verify DDR and timing-critical interfaces in Libero SoC against the -1 grade before finalizing the board.
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Secure Embedded Systems
Flash-based FPGAs like the A3P1000L-1FG144 offer a security advantage over SRAM FPGAs: the bitstream is stored on-chip in non-volatile flash and never needs to be streamed from an external device at power-up, eliminating the most common bitstream-intercept attack surface. This makes the part suitable for secure embedded controllers, authentication nodes, and defense-adjacent commercial equipment where design IP must be protected. The single-chip solution also reduces the bill of materials to one programmable device, shrinking the physical attack surface of the board. Combine the FPGA with a secure MCU for key storage and attestation; the FPGA handles interface logic while configuration remains on-die, and Live-at-Power-Up behavior means security-critical logic is active before an external processor completes boot.
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Communications Line Cards & Networking
The A3P1000L-1FG144 serves as control-plane glue logic on communications line cards and networking equipment, handling board management, I2C/SPI fan-out, status aggregation, and hot-swap sequencing while the main data path uses dedicated PHYs or switch silicon. With 97 user I/Os and 147,456 bits of embedded flash, it integrates former CPLD and discrete glue functions into one 13 x 13 mm device. Live-at-power-up flash configuration lets the FPGA assert management signals before host processors boot, which is often required by backplane standards for inrush and presence signaling. The low static power of the ProASIC3L die matters in rack equipment where idle-card power budgets are audited. Verify -1 speed grade timing for any high-rate interface and consider A3P1000-2FGG144I when faster fabric is needed.
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Medical & Diagnostic Devices
Medical diagnostic equipment - patient monitors, portable analyzers, and imaging front-ends - benefits from the A3P1000L-1FG144's combination of instant-on configuration, low idle power, and 97 flexible I/Os for sensor arrays. The non-volatile flash fabric removes configuration-device failure as a single point of failure in devices where availability is safety-relevant, and Flash*Freeze lets battery-operated diagnostic units maintain sensor state between acquisition windows at minimal power. The FPGA implements deterministic timing for ADC readout and actuator control that a general MCU alone may not sustain. Designers should observe medical EMC and leakage-current budgets at the system level; the FPGA's 1.2-1.5 V core helps limit internal dissipation, and I/O banks can be run at low voltages suited to analog front-end interfaces.
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Aerospace-Adjacent & Rugged Commercial Systems
While the commercial A3P1000L-1FG144 is not radiation-hardened, its flash-based configuration fabric is inherently immune to configuration upset from single-event effects in a way SRAM FPGAs are not, making the architecture attractive for rugged commercial drones, avionics-adjacent test rigs, and high-altitude platforms where configuration corruption is a system risk. The single-chip flash design also tolerates vibration and thermal cycling better than solutions relying on a separate configuration PROM soldered connection. With 1M gates of usable fabric, designers implement sensor fusion, motor control sequencing, and telemetry formatting on one 13 x 13 mm, 1 mm-pitch device. For programs requiring guaranteed temperature grades, specify the A3P1000L-1FGG144I industrial variant with the identical footprint for drop-in thermal-range upgrade.
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추천 제품 요약
엔지니어링 참조 데이터: A3P1000L-1FG144 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P1000L-1FGG144 | A3P1000-1FGG144T | A3P600L-1FG144 |
|---|---|---|---|---|
| Package | 144-FBGA (13 x 13 mm, 1 mm pitch) | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same |
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology |
| Logic Elements | ~11K LEs | ~11K LEs | ~11K LEs | ~6K LEs |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.5 V (standard ProASIC3) | 1.2 V to 1.5 V |
| Flash*Freeze Low-Power Mode | Yes (ProASIC3L) | Yes | No (standard ProASIC3) | Yes |
| Speed Grade | -1 | -1 | -1 | -1 |
| Configuration | On-chip flash, single chip | On-chip flash - same | On-chip flash - same | On-chip flash - same |
주요 차별점
- Flash*Freeze low-power mode (vs A3P1000-1FGG144T)
- Green lead-free package availability (vs A3P1000L-1FG144 (base))
- Larger fabric than same-footprint smaller sibling (vs A3P600L-1FG144)
- Trade-off: slowest speed grade (vs A3P1000-2FGG144I)
설계 노트
The A3P1000L-1FG144 core accepts 1.2 V to 1.5 V; choose 1.2 V when minimum static power matters (battery devices) and up to 1.5 V when timing margin at the -1 speed grade is tight - core voltage directly affects fabric speed. Decouple each supply with bulk capacitance near the ball array plus 0.1 uF ceramics at corner balls. Because configuration is non-volatile, there is no inrush from a configuration PROM, simplifying hot-swap and brown-out behavior. Verify I/O bank voltages against your level plan before routing.
The 144-FBGA has 1 mm pitch and a 13 x 13 mm body - routing is feasible on 4 layers with 0.15 mm via-in-pad or dog-bone escapes on the perimeter rows. Place the FPGA so power balls face the regulator section and high-speed I/O face connectors to minimize crossing traces. Ball escape on inner rows is limited; plan signal assignments in Libero SoC pin constraints early to avoid respins, since most I/O balls are user-assignable within fixed VDD/VSS/JTAG positions.
The -1 speed grade is the slowest ProASIC3L grade - do not assume -2 fabric timing when evaluating DDR interfaces or fast state machines; run static timing in Libero before committing. Another common pitfall: the base 'FG' part may not be the green/lead-free variant; if RoHS compliance is mandated, order A3P1000L-1FGG144 instead. Finally, do not rely on the plain FG part for industrial temperature ranges - specify the 'I' suffix variant (A3P1000L-1FGG144I), which is footprint-identical.
Use Flash*Freeze mode intentionally: entry requires all monitored I/O held static, so add pull resistors or switch isolation on asynchronous inputs entering the FPGA to prevent spurious state corruption during freeze. Exit latency is short but not zero - design wake-up sequencing in the host MCU accordingly. Estimated: for typical low-power portable duty cycles (active 10%, frozen 90%), most system energy savings come from the freeze mode rather than the static supply current difference versus standard ProASIC3.
규정 준수 정보
The 'GG' suffix variant (A3P1000L-1FGG144) is the green/lead-free package per Microchip ordering conventions; compliance documents for the exact ordering code should be pulled from the Microchip product page. No explicit RoHS/REACH statement appeared in the retrieved data for the base FG part.
