ATSAM4S16BA-UUR - 120MHz Cortex-M4 MCU 1MB Flash | Microchip
부품 번호: ATSAM4S16BA-UUR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.84 | $6.84 |
| 10 | $6.5 | $65.00 |
| 100 | $6.15 | $615.00 |
| 500 | $5.9 | $2,950.00 |
| 1,000 | $5.6 | $5,600.00 |
ATSAM4S16BA-UUR 개요
A microcontroller (MCU) integrates a processor core, memory, and peripherals on a single chip, forming the compute backbone of embedded systems within the wider hierarchy of semiconductor devices (MCU -> processor -> integrated circuit -> semiconductor). The SAM4S family, based on the ARM Cortex-M4 RISC core, adds a Memory Protection Unit (MPU), DSP instructions, and the Thumb-2 instruction set, making it a mid-range workhorse between simpler Cortex-M0+ parts and higher-end Cortex-M7 devices.
Key features include the 120 MHz Cortex-M4 core with hardware DSP support, 1024 KB dual-bank Flash with ECC, Security Bit and lock functionality, and a multi-layer bus matrix with multi-channel DMA for high data-rate communication. Atmel's Flash read accelerator with optional cache memory boosts effective execution speed, while power consumption is approximately 200 uA/MHz, and supply operation spans 1.62 V to 3.6 V for battery-friendly designs.
Technically, the dual-bank Flash architecture enables safe in-application firmware updates (bank swap without an external bootloader), while ECC protects against single-bit Flash errors. The MPU supports functional-safety and RTOS memory partitioning. The SAM4S series is pin-to-pin and software compatible with SAM3N, SAM3S, SAM4N, and SAM7S legacy series in matching pin counts, providing a smooth migration path from Cortex-M3 designs.
Typical applications include industrial control and automation nodes, portable and wearable devices where the 4.42 x 3.42 mm WLCSP footprint saves board space, and IoT sensor endpoints requiring DSP capability for signal processing. The industrial temperature rating supports harsh environments.
Design consideration: WLCSP packages require precise PCB land-pattern design and reflow control; a via-in-pad or fanout strategy is needed to route 64 balls on two or more signal layers. Verify Flash wait-state settings at 120 MHz per the SAM4S family datasheet (document 60001419).
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, combining verified web data from Mouser, DigiKey, LCSC, and Octopart as of 2026-09-20.
드롭인 대체품: ATSAM4S16BA-UUR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAM4S16BA-UUR (동일 폼 팩터 및 풋프린트) — 차이점: Package, Flash Memory, Mounting Type, Core Size, Packaging.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAM4S16BA-UURR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATSAM4LC8BA-UUR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.95 / 개
데이터시트 보기 →ATSAM4S16BA-UUR 최대 정격 & 전기적 특성
| Core Processor | ARM Cortex-M4 |
| Core Size | 32-bit single-core |
| Maximum Clock Speed | 120 MHz |
| Flash Memory | 1 MB (1M x 8), dual-bank |
| SRAM | 128 KB |
| Supply Voltage Range | 1.62 V to 3.6 V |
| Power Consumption | 200 uA/MHz |
| DSP Instructions | Yes |
| Memory Protection Unit | Yes (MPU) |
| Instruction Set | Thumb-2 |
| Flash Features | ECC, Security Bit, Lock |
| 패키지 | 64-WLCSP (4.42 x 3.42 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +85C (industrial) |
| Packaging | Tape & Reel (T&R) |
| RoHS / Green | Green, WLCSP, MRL A |
| Series | SAM4S |
ATSAM4S16BA-UUR 64-wlcsp (4.42 x 3.42 mm) 핀 구성 가이드
ATSAM4S16BA-UUR(64-wlcsp (4.42 x 3.42 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAM4S16BA-UUR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAM4S16BA-UUR 적합 용도: 6 애플리케이션s: Industrial Control and Automation, Portable and Wearable Devices, IoT Sensor Endpoints, Consumer Audio and Signal Processing, Legacy Design Migration (SAM7S / SAM3S Upgrade), Medical and Health Monitoring.
Industrial Control and Automation
The ATSAM4S16BA-UUR fits industrial control nodes that need both processing headroom and deterministic peripherals. Its 120 MHz Cortex-M4 with DSP instructions handles PID loops, digital filtering, and basic condition monitoring, while the 1 MB dual-bank Flash with ECC stores substantial firmware plus logging data and survives noisy electrical environments without single-bit corruption. The multi-layer bus matrix and multi-channel DMA offload data movement between ADCs and communication ports, keeping CPU cycles free for control algorithms. In a PLC expansion module or motor-control board, the MCU typically runs the fieldbus stack while hardware peripherals handle timing-critical PWM generation. The industrial temperature rating of the -UUR ordering code supports cabinet-mounted electronics.
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Portable and Wearable Devices
The defining advantage of the ATSAM4S16BA-UUR for wearables is its 64-ball WLCSP measuring just 4.42 x 3.42 mm, which consumes only a few tens of square millimeters of board area. Combined with 200 uA/MHz active consumption and a 1.62 V to 3.6 V supply range, it runs directly from Li-ion cells through a small LDO or buck converter. The 1 MB Flash accommodates BLE or sensor-fusion firmware stacks, and the DSP instruction set accelerates pedometer, heart-rate, or gesture algorithms without a secondary DSP. Careful power-domain design using the MCU's low-power modes allows duty-cycled sampling that stretches battery life from days to weeks in fitness bands and medical patches.
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IoT Sensor Endpoints
IoT endpoints benefit from the ATSAM4S16BA-UUR's balance of memory and efficiency. The 1 MB Flash holds a full TCP/TLS or LoRaWAN stack alongside application logic, while 128 KB SRAM buffers sensor time series before uplink. DSP instructions support local FFT-based vibration or acoustic analysis, transmitting features instead of raw data to cut radio energy. The dual-bank Flash enables secure over-the-air firmware updates: new images download to the inactive bank, pass integrity checks, and the bank swap happens atomically on reboot. Multi-channel DMA moves ADC samples and UART traffic without CPU intervention, keeping the core in sleep modes between events to minimize average current.
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Consumer Audio and Signal Processing
The Cortex-M4 core in the ATSAM4S16BA-UUR includes single-cycle MAC and SIMD DSP instructions, letting it execute audio codecs, active-noise-cancellation filters, or equalization directly in software at 120 MHz. The SAM4S peripheral set includes I2S-class serial ports and high-speed DMA capable of sustaining continuous audio streams to a DAC or codec without gaps. The 1 MB Flash stores voice-prompt assets and multiple tuning profiles, and 128 KB SRAM provides double-buffered audio frames. In Bluetooth-speaker accessory boards or hearing-assist products where a dedicated audio DSP is cost-prohibitive, the SAM4S16 consolidates control and signal processing in one compact WLCSP device.
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Legacy Design Migration (SAM7S / SAM3S Upgrade)
The SAM4S series is pin-to-pin and software compatible with the SAM3N, SAM3S (48-, 64- and 100-pin versions), SAM4N, and SAM7S legacy series, per the SAM4S family datasheet. A product built on an aging SAM7S ARM7 or SAM3S Cortex-M3 can therefore move to the ATSAM4S16BA-UUR for 120 MHz performance and 1 MB Flash with minimal PCB change at matching pin counts. The Flash accelerator and optional cache preserve near-zero-wait-state execution, so code written for slower predecessors often meets new timing budgets simply by raising the clock. This makes the -UUR an attractive refresh vehicle for long-lived industrial products whose WLCSP-scale boards cannot be redesigned.
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Medical and Health Monitoring
Health monitoring devices exploit the ATSAM4S16BA-UUR's combination of DSP capability, memory, and small footprint. Biopotential front-ends feeding the ADC stream into the Cortex-M4's DSP instructions for digital filtering, QRS detection, or motion artifact removal at 120 MHz, well within real-time budgets. The Memory Protection Unit isolates safety-relevant firmware tasks, and dual-bank Flash with ECC protects stored patient configuration data against bit errors over product lifetime. The 4.42 x 3.42 mm WLCSP fits into patch-style monitors and handheld diagnostic instruments alike. Always verify the ordering code temperature grade and obtain Microchip's medical-grade documentation package where regulatory files are required.
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추천 제품 요약
엔지니어링 참조 데이터: ATSAM4S16BA-UUR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAM4S16BA-UURR | ATSAM4LC8BA-UUR |
|---|---|---|---|
| Package | 64-WLCSP (4.42 x 3.42 mm) | 64-WLCSP - same | 64-WLCSP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Max Speed | ARM Cortex-M4 / 120 MHz | ARM Cortex-M4 / 120 MHz | ARM Cortex-M3 / 120 MHz |
| Flash Memory | 1 MB dual-bank with ECC | 1 MB dual-bank with ECC | 512 KB |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| Software Compatibility | SAM4S (base) | Binary identical | Not binary compatible (SAM4L peripherals) |
주요 차별점
- Full SAM4S16 feature set in chip-scale footprint (vs ATSAM4S16BA-AU)
- Dual-bank Flash with ECC enables field updates (vs ATSAM4LC8BA-UUR)
- Hardware DSP acceleration (vs ATSAM3S8BA-MUR)
- Trade-off: assembly difficulty (vs ATSAM4S16BA-AU)
설계 노트
The 64-ball WLCSP requires NSMD copper pads sized per Microchip's recommended land pattern in the SAM4S datasheet, with a via-in-pad or buried fanout strategy to escape 0.4 mm-class ball pitch. Plan at least one internal layer for power/ground pour and route decoupling capacitors within 1-2 mm of supply balls. X-ray inspection is recommended post-reflow since solder joints are hidden beneath the die; rework of WLCSP parts is generally impractical, so prototype with extra boards.
Operate the core from a clean 1.62-3.6 V rail; at 120 MHz the core draws roughly 24 mA (200 uA/MHz) before peripherals. Place 100 nF ceramic capacitors at each supply ball pair plus one bulk 4.7-10 uF capacitor nearby. If a switching pre-regulator feeds the MCU, add an LC filter or ferrite because SAM4S ADC accuracy is sensitive to supply ripple. Estimated: a 3.7 V Li-ion feeding a 3.3 V LDO dissipates about (3.7-3.3) x 0.03 A = 12 mW, negligible for battery designs.
Configure Flash wait states correctly for 120 MHz operation per the SAM4S family datasheet (document 60001419); incorrect EEFC settings cause hard faults or corrupted reads at speed. Also review the SAM4S errata sheet before finalizing the clock plan for frequencies above 100 MHz. When using dual-bank firmware updates, never issue a bank swap while code executes from the target bank - boot from a small resident loader or swap from a reset state to avoid bricking the device in the field.
Keep the main crystal within 10-15 mm of the MCU oscillator balls with guard ground pours, and route fast peripheral buses (parallel capture, high-speed SPI) as short as possible on the top layer to limit reflections given the WLCSP's short bond wires. For analog signals, dedicate a quiet quadrant of the board away from switching regulators and use the SAM4S internal PLL sparingly during precision sampling to minimize clock jitter.
규정 준수 정보
Distributor listings (Mouser, LCSC) describe the part as GREEN with MRL A status, indicating RoHS-compliant lead-free construction. Formal REACH and conflict-minerals documentation should be requested from Microchip.
