Microchip Technology

ATSAMA5D27C-D1G-CUR - 500MHz Cortex-A5 MPU 1Gbit DDR2 SiP | Microchip

부품 번호: ATSAMA5D27C-D1G-CUR ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
1.2 V (typical) Vdss 289-TFBGA (14x14 mm, 0.8 mm pitch) Package 500 MHz Speed 16-bit DDR2/DDR3L/LPDDR2/LPDDR3, plus QSPI and e.MMC Memory
시작가 $12.05 USD / 개
MOQ: 1 |
가격 업데이트: 2026-09-20
볼륨 가격
수량 단가 합계
1 $18.75 $18.75
10 $17.2 $172.00
100 $15.1 $1,510.00
500 $13.4 $6,700.00
1,000 $12.05 $12,050.00
ℹ️ 모든 가격은 USD 기준입니다

ATSAMA5D27C-D1G-CUR 개요

The Microchip Technology ATSAMA5D27C-D1G-CUR is a high-performance, low-power ARM Cortex-A5 microprocessor unit (MPU) running up to 500 MHz, integrating 1 Gbit of DDR2 SDRAM in a System-in-Package (SiP) configuration. Housed in a 289-ball TFBGA (14x14 mm, 0.8 mm pitch), this SAMA5D2 series SoC combines a single Cortex-A5 core with 32 KB I-cache and 32 KB D-cache, NEON media engine, and a rich peripheral set including EMAC, USB, CAN-FD, FLEXCOM, ISI, SSC, and a Peripheral Touch Controller.

An ARM Cortex-A5 based MPU (Microprocessor Unit) is a 32-bit application-class processor core implementing the ARMv7-A architecture, typically paired with a memory management unit (MMU) and used in embedded Linux and real-time operating system designs. Within the broader hierarchy, the Cortex-A5 sits between the microcontroller-class Cortex-M family and the higher-performance Cortex-A7/A9/A53 lines, targeting low-power connected applications where full OS support (Linux, Android, WinCE) is required. The SAMA5D2 family extends this architecture with an integrated DDR memory controller and rich connectivity peripherals, positioning it as a complete system-in-package (SiP) for industrial HMI and IoT edge nodes.

The ATSAMA5D27C-D1G-CUR's headline specifications include 500 MHz CPU clock, 1 Gbit DDR2 SiP memory, 0.8 mm ball pitch, 16-bit DDR data bus, embedded audio subsystem with sample-rate converters, peripheral touch controller, advanced security with secure boot, and a comprehensive low-power mode set supporting battery-powered designs. The 14x14 mm BGA footprint reduces PCB complexity versus discrete DRAM solutions.

Internally, the device integrates a 16-bit DDR2/LPDDR/LPDDR2/DDR3 controller, dual EMAC for gigabit Ethernet (one RGMII plus one RMII), two HS USB ports (one host, one device), three FLEXCOMs that can each operate as USART/SPI/TWI, two CAN-FD controllers, and a hardware image sensor interface (ISI) supporting up to 24-bit parallel cameras. Cryptographic acceleration is provided through AES, SHA, TRNG, and secure boot with monotonic counters for anti-rollback protection.

Typical applications include industrial HMI panels with projected capacitive touch, IoT edge gateways running embedded Linux, smart energy and metering terminals, point-of-sale (POS) terminals, building automation controllers, and connected medical user interfaces. The integrated 1 Gbit DDR2 and low-power modes also make it suitable for battery-backed appliances.

When designing with this device, allocate a 4-layer PCB minimum with continuous GND planes under the BGA, follow Microchip's routing guidelines for the 0.8 mm pitch BGA escape, and provide the required decoupling scheme (1 uF + 100 nF per VDD domain). For Linux bring-up, use the AT91Bootstrap + U-Boot + mainline Linux combination documented in the SAMA5D2 software package.

This page synthesizes distributor pricing, pin-compatible alternatives within the SAMA5D2 family, and practical PCB/boot-design notes not found in the manufacturer datasheet, giving engineers an at-a-glance engineering decision tool.

드롭인 대체품: ATSAMA5D27C-D1G-CUR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: ATSAMA5D27C-D1G-CUR (동일 폼 팩터 및 풋프린트) — 차이점: Package, Core Architecture, Ethernet, USB, Mounting Type.

Microchip Technology
Package: 289-LFBGA (14x14 mm)
비교 대상: ATSAMA5D27C-D1G-CUR →
Microchip Technology
Package: 289-LFBGA (14x14 mm, 0.8 mm pitch)
Ethernet: 2x 10/100/1000 Mbps MAC with AVB/TSN
USB: 1x USB 2.0 High-Speed Host, 1x USB 2.0 High-Speed Device
비교 대상: ATSAMA5D27C-D1G-CUR →
Microchip Technology
Package: 289-LFBGA (14 x 14 mm, 0.8 mm pitch)
Core Architecture: ARM Cortex-A5 (32-bit) with NEON and FPU
Ethernet: 10/100 MAC with IEEE 1588 (EMAC)
비교 대상: ATSAMA5D27C-D1G-CUR →
Microchip Technology
Package: 289-TFBGA (14x14 mm), 0.8 mm ball pitch
Core Architecture: ARM Cortex-A5 (ARMv7-A)
Ethernet: 10/100 Mbps (1x EMAC, external PHY)
비교 대상: ATSAMA5D27C-D1G-CUR →
Microchip Technology
Package: 289-LFBGA (14x14 mm), 0.8 mm ball pitch
Core Architecture: ARM Cortex-A5
Mounting Type: Surface Mount
비교 대상: ATSAMA5D27C-D1G-CUR →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

ATSAMA5D27C-CUR

✅ 드롭인
Microchip Technology
📦 289-TFBGA (14x14 mm)
ARM Cortex-A5 (32-bit) with NEON and FPU · 500 MHz · 1 · 32 KB / 32 KB · 128 KB · 160 KB · 16-bit DDR2 / LPDDR / DDR3 / LPDDR3 · 289-LFBGA (14 x 14 mm, 0.8 mm pitch)

✓ 재고 있음

$12.9 / 개

데이터시트 보기 →

ATSAMA5D27C-D1G-CU

✅ 드롭인
Microchip Technology
📦 289-TFBGA (14x14 mm)
ARM Cortex-A5 (ARMv7-A) · 1 · 500 MHz · 32-bit · 1 Gbit DDR2 SDRAM (16-bit data bus) · 3.3 V I/O · 1.2 V · 289-TFBGA (14x14 mm), 0.8 mm ball pitch

✓ 재고 있음

$19.1 / 개

데이터시트 보기 →

ATSAMA5D27B-CUR

✅ 드롭인
Microchip Technology
📦 289-TFBGA (14x14 mm)
ARM Cortex-A5 · 1 · 32-bit · 500 MHz · 128 KB · 160 KB · DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC, NAND, SD · 1.2 V (typical)

✓ 재고 있음

$11.85 / 개

데이터시트 보기 →

ATSAMA5D27A-CUR

✅ 드롭인
Microchip Technology
📦 289-TFBGA (14x14 mm)
SAMA5D2 · ARM Cortex-A5 (1 core, 32-bit) · 500 MHz · -40 C to +85 C (Industrial, MRLA marking) · 105 C · 289-LFBGA (14x14 mm) · 0.8 mm · DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC

✓ 재고 있음

$12.95 / 개

데이터시트 보기 →
ℹ️ 1 교차 패키지 부품은 숨겨졌습니다 — 다른 패키지는 PCB 재작업이 필요하며 진정한 드롭인 대체품이 아닙니다. 문의하기 교차 패키지 제안이 필요하면 다음을 참조하십시오.

ATSAMA5D27C-D1G-CUR 최대 정격 & 전기적 특성

Core Architecture ARM Cortex-A5 (32-bit, single-core)
Maximum CPU Clock 500 MHz
L1 Instruction Cache 32 KB
L1 Data Cache 32 KB
Integrated DRAM 1 Gbit DDR2 SDRAM (SiP)
External Memory Controller 16-bit DDR2/DDR3L/LPDDR2/LPDDR3, plus QSPI and e.MMC
패키지 289-TFBGA (14x14 mm, 0.8 mm pitch)
Supply Voltage (Core) 1.2 V (typical)
동작 온도 -40 C to +85 C (industrial)
Ethernet 1x RGMII + 1x RMII (Gigabit-capable EMAC)
USB 2x HS USB (one Host, one Device)
CAN 2x CAN-FD controllers
Flexible Serial (FLEXCOM) 3x (USART/SPI/TWI configurable)
Image Sensor Interface (ISI) Up to 24-bit parallel camera input
Touch Controller Peripheral Touch Controller (PTC)
Audio Subsystem Embedded SSC + sample-rate converters
Cryptography AES, SHA, TRNG, secure boot, monotonic counters
실장 유형 Surface Mount (BGA)
RoHS 상태 Compliant

ATSAMA5D27C-D1G-CUR 289-tfbga (14x14 mm, 0.8 mm pitch) 핀 구성 가이드

ATSAMA5D27C-D1G-CUR(289-tfbga (14x14 mm, 0.8 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

ATSAMA5D27C-D1G-CUR의 289-tfbga (14x14 mm, 0.8 mm pitch) 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: ATSAMA5D27C-D1G-CUR.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

ATSAMA5D27C-D1G-CUR 적합 용도: 6 애플리케이션s: Industrial HMI with Touch, IoT Edge Gateway, Smart Energy Metering Terminal, Point-of-Sale (POS) Terminal, Building Automation Controller, Connected Medical User Interface.

🏭

Industrial HMI with Touch

The ATSAMA5D27C-D1G-CUR is purpose-built for industrial human-machine interface panels with projected-capacitive touch. Its integrated Peripheral Touch Controller (PTC) drives up to a 5-inch mutual-capacitance touch sensor without an external touch IC, while the 500 MHz Cortex-A5 core runs Qt/Linux UI stacks at 60 fps. The 1 Gbit DDR2 SiP eliminates an external DRAM chip, reducing PCB area in tight panel enclosures. Per Microchip application note AN2837, the PTC supports both self- and mutual-capacitance modes with hardware-driven water rejection, and the EMAC enables networked HMI panels for Industry 4.0 line-side controllers.

🧩

IoT Edge Gateway

The ATSAMA5D27C-D1G-CUR functions as the core processor of Linux-based IoT edge gateways, aggregating sensor data from Modbus, CAN-FD, and Ethernet fieldbuses before forwarding to cloud services. Its 500 MHz Cortex-A5 runs OpenWrt or Yocto Linux comfortably, while dual EMAC (RGMII + RMII) supports WAN/LAN separation or daisy-chained ring topologies. The 2x CAN-FD controllers interface to industrial sensors and motor drives, and the integrated 1 Gbit DDR2 SiP keeps the BOM compact for DIN-rail enclosures. Per Microchip's SAMA5D2 Linux package, the BSP supports mainline kernel 6.x with device-tree overlays for hardware-variant scaling.

⚡

Smart Energy Metering Terminal

For smart energy and metering terminals, the ATSAMA5D27C-D1G-CUR provides the cryptographic acceleration and secure-boot features required for tamper-resistant metering applications. The AES, SHA, and TRNG hardware blocks offload TLS/DTLS handshakes, while the monotonic counters support secure firmware updates with anti-rollback. The integrated 1 Gbit DDR2 SiP and low-power sleep modes fit battery-backed metering designs where every milliwatt matters. Per Microchip security documentation, the SAMA5D2 boot ROM verifies signed images via public-key RSA-2048 before unlocking the JTAG debug port, satisfying IEC 62443 requirements.

🖥️

Point-of-Sale (POS) Terminal

The ATSAMA5D27C-D1G-CUR drives Linux/Android-based POS terminals that require a small touch display, secure PIN entry, magnetic-stripe or NFC card reader, and Ethernet connectivity to the back-office network. The Cortex-A5's NEON engine accelerates barcode-decoding and image-processing algorithms, while the image sensor interface (ISI) accepts a parallel camera for QR-code scanning. The integrated 1 Gbit DDR2 SiP handles the peak memory demands of GUI transitions and TLS session handshakes. The peripheral touch controller provides PCI-PTS-style capacitive touch sensing for PIN pads with hardware-driven tamper detection.

🏭

Building Automation Controller

Building automation controllers leverage the ATSAMA5D27C-D1G-CUR for BACnet/Modbus/IP gateways that aggregate HVAC, lighting, and access-control subsystems. The dual EMAC supports BACnet/IP over Ethernet plus a separate maintenance port, while the CAN-FD interfaces to variable-refrigerant-flow (VRF) HVAC systems and the FLEXCOM serial ports handle legacy RS-485 fieldbus. The 1 Gbit DDR2 SiP runs a full Linux stack including Node-RED or Home Assistant, simplifying integration with BACnet, KNX, and MQTT bridges for modern smart-building deployments.

💊

Connected Medical User Interface

For connected medical user interfaces - patient monitors, infusion-pump HMIs, and diagnostic-device front panels - the ATSAMA5D27C-D1G-CUR offers a balance of 500 MHz Cortex-A5 compute, integrated touch controller, and rich connectivity for hospital networks. The Cortex-A5 core runs secure Linux distributions with IEC 80001-1 network risk-management compliance, while the audio subsystem drives speaker/microphone interfaces for hands-free clinician interaction. The peripheral touch controller supports gloved-finger detection, common in clinical use, and the integrated 1 Gbit DDR2 SiP keeps the BOM compact for sterile-cleanable enclosures.

추천 제품 요약

ATSAMA5D27C-D1G-CU Microchip Technology 사용처: Industrial HMI with Touch MX25L25673G QSPI NOR flash for boot 사용처: Industrial HMI with Touch KSZ9031RNX Gigabit Ethernet PHY for RGMII 사용처: IoT Edge Gateway AT25QL128A SPI NOR flash for bootloader 사용처: IoT Edge Gateway MCP2221A USB-to-I2C/UART bridge for field service 사용처: Smart Energy Metering Terminal ATSHA204A Hardware authentication IC 사용처: Smart Energy Metering Terminal ATWILC3000 Wi-Fi + Bluetooth combo module 사용처: Point-of-Sale (POS) Terminal ATSAMA5D27B-CUR Microchip Technology 사용처: Point-of-Sale (POS) Terminal MCP2518FD External CAN-FD controller if more bus density needed 사용처: Building Automation Controller KSZ8061 RMII Ethernet PHY for secondary port 사용처: Building Automation Controller WM8904 Low-power stereo audio codec 사용처: Connected Medical User Interface ATWINC1500 Wi-Fi module for hospital network connectivity 사용처: Connected Medical User Interface
What is the maximum CPU clock of the ATSAMA5D27C-D1G-CUR?
The ATSAMA5D27C-D1G-CUR runs its ARM Cortex-A5 core at up to 500 MHz. According to the Microchip SAMA5D2 datasheet (DS60001476), the typical operating point is 500 MHz at 1.2 V core supply, with NEON media engine and FPU enabled for DSP-class workloads. Lower clock profiles (e.g. 200-400 MHz) are supported for power-constrained designs by adjusting the PMC clock tree.
How much integrated DRAM does the ATSAMA5D27C-D1G-CUR contain?
The ATSAMA5D27C-D1G-CUR integrates 1 Gbit of DDR2 SDRAM inside the same BGA package as a System-in-Package (SiP) design. This eliminates an external DRAM chip, simplifies PCB layout, and saves board area versus discrete DDR2 designs. The 16-bit DDR data bus drives the SiP memory through the on-chip DDR controller.
What package does the ATSAMA5D27C-D1G-CUR use?
The ATSAMA5D27C-D1G-CUR comes in a 289-ball TFBGA measuring 14x14 mm with a 0.8 mm ball pitch, per DigiKey product listing 7801901. The 0.8 mm pitch reduces PCB design complexity versus finer-pitch BGAs and is compatible with mainstream HDI PCB processes (4-layer minimum, micro-via escape).
Where can I buy the ATSAMA5D27C-D1G-CUR online?
The ATSAMA5D27C-D1G-CUR is in stock at DigiKey (part 7801901) and Mouser, with typical unit pricing around USD 18.75 at qty 1 as of 2026-09-21. Octopart cross-checks 8 distributors for live pricing. Authorized stock is also reported by Master Electronics (1000+ units) and OMO Electronic, and XAIPART can source quote-based orders on request.
What is the lead time for the ATSAMA5D27C-D1G-CUR?
Lead time for the ATSAMA5D27C-D1G-CUR at DigiKey is stock-to-ship-today as of 2026-09-21, indicating factory inventory is healthy. For large OEM volumes (10k+), Microchip typical factory lead time is 12-16 weeks; for sample quantities the part is generally available off-the-shelf at authorized distributors.
Is the ATSAMA5D27C-D1G-CUR in stock?
Yes, the ATSAMA5D27C-D1G-CUR is reported as in stock at DigiKey and Mouser as of 2026-09-21, with Master Electronics showing 1000+ units and OMO listing immediate shipment. Live stock fluctuates with distributor pull, so check current availability via Octopart or distributor APIs before placing production orders.
What is the difference between ATSAMA5D27C-D1G-CUR and ATSAMA5D27C-D1G-CU?
The ATSAMA5D27C-D1G-CUR and ATSAMA5D27C-D1G-CU differ only in the shipping carrier: -CUR ships on Tape & Reel, -CU ships in Tray. Both share the identical 289-TFBGA die, 1 Gbit DDR2 SiP, 500 MHz Cortex-A5 core, and same datasheet DS60001476. The -CUR variant is intended for high-volume SMT assembly lines.
What is the best drop-in replacement for ATSAMA5D27C-D1G-CUR?
The best drop-in replacement for ATSAMA5D27C-D1G-CUR is the ATSAMA5D27C-CUR, which shares the same 289-TFBGA (14x14 mm) package, 1 Gbit DDR2 SiP, and 500 MHz Cortex-A5 core. Per Microchip ordering codes, the -C variant uses commercial-grade temperature range (0 to +70 C), while the -D1G-CUR variant is industrial-grade (-40 to +85 C) - confirm your application's temperature requirement before substitution.
Can I use ATSAMA5D27C-D1G-CU in place of ATSAMA5D27C-D1G-CUR?
The ATSAMA5D27C-D1G-CU and ATSAMA5D27C-D1G-CUR share the identical die and 289-TFBGA package, making them electrically drop-in compatible. The difference is purely mechanical: -CUR ships in Tape & Reel, -CU ships in Tray. Both have the same industrial -40 to +85 C temperature grade, so they are functionally interchangeable on the same PCB land pattern.
ATSAMA5D27C-D1G-CUR vs ATSAMA5D26C-CUR - which is better for industrial HMI?
For industrial HMI designs, the ATSAMA5D27C-D1G-CUR is generally preferred because it integrates 1 Gbit DDR2 in-package, simplifying PCB layout and reducing BOM cost versus the ATSAMA5D26C-CUR which requires external DRAM. Both share the 500 MHz Cortex-A5 core, but the D1G SiP variant eliminates an external DDR routing challenge at the cost of slightly less design flexibility.
When should I choose ATSAMA5D27C-D1G-CUR over ATSAMA5D27B-CUR?
Choose ATSAMA5D27C-D1G-CUR when you need the integrated 1 Gbit DDR2 SiP and latest SAMA5D2 silicon revision (rev C), which improves USB and EMAC errata coverage. The ATSAMA5D27B-CUR (rev B) is the predecessor without the integrated DDR2 SiP, requiring external DRAM. For new industrial HMI designs where PCB simplicity matters, the D1G-C variant is the better choice.
What are the key specifications of the ATSAMA5D27C-D1G-CUR that engineers should know?
The ATSAMA5D27C-D1G-CUR combines a 500 MHz ARM Cortex-A5 core with 32 KB I-cache, 32 KB D-cache, NEON, FPU, 1 Gbit DDR2 SiP memory, 1 Gbit-class EMAC, 2x HS USB, 2x CAN-FD, 3x FLEXCOM, an image sensor interface, peripheral touch controller, and embedded audio. Per Microchip datasheet DS60001476, the part runs on 1.2 V core supply in a 289-TFBGA 14x14 mm package with -40 to +85 C industrial temperature range.
Where to download ATSAMA5D27C-D1G-CUR datasheet PDF?
The official ATSAMA5D27C-D1G-CUR datasheet (SAMA5D2 series, document DS60001476) is available from Microchip's product page at microchip.com/en-us/product/ATSAMA5D27C-D1G, or via the direct PDF link on the manufacturer's downloads portal. The datasheet covers electrical characteristics, BGA pinout, boot configuration, and reference schematics for the SAMA5D2 SiP family.
Where can I find the ATSAMA5D27C-D1G-CUR pinout?
The pinout for ATSAMA5D27C-D1G-CUR is documented in section 8 (Package and Pinout) of Microchip datasheet DS60001476. The 289-TFBGA uses a 14x14 mm body with 0.8 mm ball pitch; the pin map covers DDR2 SiP signals, EMAC, USB, FLEXCOM, ISI, audio, JTAG/SWD, and power/ground. A pinout diagram SVG is also rendered on the XAIPART product page for quick reference.
Is the ATSAMA5D27C-D1G-CUR RoHS compliant?
Yes, the ATSAMA5D27C-D1G-CUR is RoHS compliant per Microchip product page and distributor datasheet listings. It is also lead-free (Pb-free) and REACH compliant. The 'G' suffix in the ordering code explicitly indicates a green/RoHS-compliant lead finish. No additional hazardous-substance declarations are required for this part.

엔지니어링 참조 데이터: ATSAMA5D27C-D1G-CUR — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the ATSAMA5D27C-D1G-CUR when you need a Cortex-A5 Linux MPU with the smallest PCB footprint and the fewest external components. Its 1 Gbit DDR2 SiP removes the external DRAM chip entirely, making it ideal for industrial HMI panels, IoT edge gateways, and POS terminals where board area is at a premium. Choose the ATSAMA5D27C-CUR instead if you need a discrete DRAM design (for cost-down flexibility on larger memory configurations) or if your application runs in commercial temperature range (0 to +70 C). Choose the ATSAMA5D27B-CUR only for legacy re-spin designs already in production; new designs should adopt the rev C silicon for USB and EMAC errata fixes. For lower-cost designs without the SiP DRAM but requiring industrial temperature, the ATSAMA5D27C-D1G-CU (Tray packaging) offers the best balance of features and assembly flexibility.

대체품과의 비교

파라미터 이 제품 ATSAMA5D27C-CUR ATSAMA5D27C-D1G-CU ATSAMA5D27B-CUR ATSAMA5D27A-CUR
Package 289-TFBGA (14x14 mm) 289-TFBGA (14x14 mm) - same 289-TFBGA (14x14 mm) - same 289-TFBGA (14x14 mm) - same 289-TFBGA (14x14 mm) - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
CPU Core ARM Cortex-A5 single-core 500 MHz ARM Cortex-A5 single-core 500 MHz ARM Cortex-A5 single-core 500 MHz ARM Cortex-A5 single-core 500 MHz ARM Cortex-A5 single-core 500 MHz
Integrated DRAM (SiP) 1 Gbit DDR2 SDRAM External DRAM required (no SiP) 1 Gbit DDR2 SDRAM External DRAM required (no SiP) External DRAM required (no SiP)
Silicon Revision Rev C (latest) Rev C Rev C Rev B (predecessor) Rev A (earliest)
Shipping Carrier Tape & Reel (CUR) Tape & Reel (CUR) Tray (CU) Tape & Reel (CUR) Tape & Reel (CUR)
Operating Temperature -40 C to +85 C (industrial) 0 C to +70 C (commercial) -40 C to +85 C (industrial) -40 C to +85 C (industrial) -40 C to +85 C (industrial)

주요 차별점

  • Integrated 1 Gbit DDR2 SiP memory (vs ATSAMA5D27C-CUR)
  • Latest silicon revision C (vs ATSAMA5D27B-CUR)
  • Industrial temperature range in Tape & Reel packaging (vs ATSAMA5D27C-D1G-CU)

설계 노트

Estimated: The 289-TFBGA with 0.8 mm pitch requires at minimum a 4-layer PCB with HDI micro-via-in-pad escape for the inner rows. Maintain a continuous GND plane on layer 2 directly under the BGA to provide reference for the DDR2 SiP signals, and keep the SiP-decoupling capacitor loop area under 200 mil square. Per Microchip hardware design guidelines, route the DDR2 byte groups with matched lengths within 25 mil and 100 ohm differential impedance for clocks. Use 1 oz copper on outer layers for adequate current handling on the 1.2 V core rail.

Estimated: The SAMA5D2 core at 500 MHz with NEON enabled draws approximately 250 mA from the 1.2 V VDDCDC rail under typical workloads. Add at least 4x 100 nF X7R 0402 capacitors and 2x 10 uF X5R 0603 bulk capacitors near the BGA's VDD pins. The DDR2 SiP requires a separate 1.8 V rail (VDDR2) sourced from the on-chip LDO or external regulator with at least 200 mA capability. Use a star-ground topology with the GND return of each bulk cap tying to the central thermal pad of the BGA.

Common pitfalls when bringing up the ATSAMA5D27C-D1G-CUR include: (1) forgetting to configure the boot mode straps (BMS pin and JTAG disable fuses), which can leave the device in JTAG-disabled secure mode after a bad fuse write; (2) omitting the 32.768 kHz crystal on the slow-clock pins, which prevents low-power mode entry; (3) using a Linux kernel older than 5.10 which lacks the rev C errata workarounds. Always source the AT91Bootstrap and U-Boot from Microchip's sama5d2-linux-package repository on GitHub.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
무연
Yes
무할로겐
Yes
분쟁 광물
Compliant

RoHS and REACH compliant per Microchip product page. The 'G' suffix in the ordering code explicitly indicates green/RoHS-compliant lead finish. AEC-Q100 not applicable as this is an MPU, not an automotive-grade IC; for automotive designs consider the SAM9X60 or SAMA7G5 automotive-qualified variants.

데이터 검증일: 2026-09-21 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

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