ATSAMA5D27B-CUR - 500MHz ARM Cortex-A5 MPU, 289-LFBGA | Microchip
부품 번호: ATSAMA5D27B-CUR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.75 | $167.50 |
| 100 | $14.95 | $1,495.00 |
| 500 | $13.2 | $6,600.00 |
| 1,000 | $11.85 | $11,850.00 |
ATSAMA5D27B-CUR 개요
What is an MPU? An embedded microprocessor unit (MPU) is a CPU-centric system-on-chip that requires external memory and peripherals, in contrast to a microcontroller (MCU) which integrates flash and I/O on-die. MPUs typically run higher-level operating systems (Linux, Android, RTOS) at hundreds of MHz to GHz speeds, and occupy the tier above microcontrollers in the embedded hierarchy: MPU -> microprocessor -> SoC -> integrated circuit -> semiconductor. The SAMA5D2 family in particular targets secure-connected edge nodes and HMI panels where Cortex-A class performance is needed without the power of an application processor.
Key features include a single Arm Cortex-A5 core with Neon and FPU, hardware cryptography accelerator (AES, SHA, TRNG), dual CAN-FD interfaces, dual Gigabit Ethernet with AVB/TSN support, USB 2.0 high-speed host and device, multiple UART/SPI/I2C, a 12-bit ADC, and a CMOS camera interface. The peripheral set is tailored for industrial gateways and graphical HMI, while advanced security features include secure boot, tamper detection, and on-die key storage - meeting IEC 62443-style requirements for industrial security.
At 500 MHz the device consumes on the order of a few hundred milliwatts active, with deep-sleep retention modes dropping consumption into the milliamp range for battery-backed always-on duty cycles. The 289-LFBGA package requires careful PCB stack-up and 0.8 mm ball pitch routing, but Microchip provides a full Linux distribution (mainline-based), a bare-metal SDK, and reference schematics to accelerate bring-up.
Typical applications include industrial IoT gateways, building automation controllers, smart-home concentrators, POS terminals, medical patient monitors, and graphical HMI panels. Its dual GbE and CAN-FD capability also make it attractive for vehicle telematics and fleet-management edge nodes.
When designing with the ATSAMA5D27B-CUR, ensure the PCB has impedance-controlled DDR traces, a clean 1.2 V core rail with adequate bulk decoupling, and a properly sequenced power-up; the integrated boot ROM supports QSPI, e.MMC, SD card, and NAND bootstrap, so firmware planning can defer storage choice to later in the design cycle.
This page synthesizes distributor pricing, same-family drop-in variants, and practical design notes not found in the manufacturer datasheet alone, with full datasheet cross-reference for engineers evaluating the SAMA5D2 family.
드롭인 대체품: ATSAMA5D27B-CUR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAMA5D27B-CUR (동일 폼 팩터 및 풋프린트) — 차이점: Ethernet, Package, USB, CAN, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAMA5D27B-CU
✅ 드롭인✓ 재고 있음
$11.85 / 개
데이터시트 보기 →ATSAMA5D27A-CUR
✅ 드롭인✓ 재고 있음
$12.95 / 개
데이터시트 보기 →ATSAMA5D27A-CU
✅ 드롭인✓ 재고 있음
$7.83 / 개
데이터시트 보기 →ATSAMA5D27A-CNR
✅ 드롭인✓ 재고 있음
$10.95 / 개
데이터시트 보기 →ATSAMA5D27A-CN
✅ 드롭인✓ 재고 있음
$20.5 / 개
데이터시트 보기 →ATSAMA5D26C-CUR
✅ 드롭인✓ 재고 있음
$6.85 / 개
데이터시트 보기 →ATSAMA5D26C-CU
✅ 드롭인✓ 재고 있음
$11.8 / 개
데이터시트 보기 →ATSAMA5D26C-CNR
✅ 드롭인✓ 재고 있음
$10.85 / 개
데이터시트 보기 →ATSAMA5D27B-CUR 최대 정격 & 전기적 특성
| Core Processor | ARM Cortex-A5 |
| Number of Cores | 1 |
| 데이터 버스 폭 | 32-bit |
| Maximum CPU Clock | 500 MHz |
| On-Chip SRAM | 128 KB |
| On-Chip ROM | 160 KB |
| External Memory Support | DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC, NAND, SD |
| Core Supply Voltage | 1.2 V (typical) |
| 패키지 | 289-LFBGA (14x14 mm, 0.8 mm pitch) |
| 실장 유형 | Surface Mount |
| 동작 온도 범위 | -40C to +85C (industrial) |
| Graphics Support | LCD TFT controller up to 1024x768 |
| Camera Interface | CMOS sensor (12-bit parallel) |
| Ethernet | 2x 10/100/1000 Mbps MAC with AVB/TSN |
| USB | 1x USB 2.0 High-Speed Host, 1x USB 2.0 High-Speed Device |
| CAN | 2x CAN-FD |
| Hardware Crypto | AES, SHA, TRNG, secure boot, tamper pins |
| RoHS 상태 | Compliant |
ATSAMA5D27B-CUR 289-lfbga (14x14 mm, 0.8 mm pitch) 핀 구성 가이드
ATSAMA5D27B-CUR(289-lfbga (14x14 mm, 0.8 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAMA5D27B-CUR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAMA5D27B-CUR 적합 용도: 6 애플리케이션s: Industrial IoT Gateway, Building Automation Controller, Smart Home Concentrator, POS Terminal, Medical Patient Monitor, Vehicle Telematics Edge Node.
Industrial IoT Gateway
The ATSAMA5D27B-CUR's 500 MHz Cortex-A5 with Linux support makes it ideal for industrial IoT gateways aggregating sensor data over Ethernet, CAN-FD, and RS-485. Its dual Gigabit Ethernet with AVB/TSN handles time-sensitive traffic while hardware AES/SHA and secure boot protect field-deployed firmware. The 289-LFBGA package and industrial -40C to +85C rating suit fanless DIN-rail enclosures, and DDR3L support allows 256 MB to 1 GB of working memory for edge analytics at the gateway.
추천
Building Automation Controller
For BACnet, Modbus, and KNX building-automation controllers the ATSAMA5D27B-CUR supplies ample CPU headroom for protocol stacks plus an integrated LCD TFT controller for on-device HMI. The Cortex-A5's MMU runs full Linux, allowing standards-based middleware, while the on-chip 12-bit ADC handles analog sensor inputs directly. Hardware crypto accelerators secure OTA firmware updates, and the low deep-sleep current suits always-on battery-backed operation during grid outages.
추천
Smart Home Concentrator
The ATSAMA5D27B-CUR aggregates Zigbee, Z-Wave, Wi-Fi, and Bluetooth radios via its high-speed USB 2.0 host and multiple UART/SPI interfaces, serving as the central hub in smart-home systems. The 500 MHz core runs concurrent stacks (Matter, Thread border router) while the Cortex-A5 NEON engine accelerates audio front-ends for voice assistants. DDR2/LPDDR2 flexibility lets designers minimize BOM cost for cost-sensitive consumer hubs.
추천
POS Terminal
POS terminals benefit from the ATSAMA5D27B-CUR's Cortex-A5 performance for payment encryption, the integrated TFT LCD controller driving touchscreens, and the CMOS camera interface supporting 1D/2D barcode scanners. The hardware AES engine handles PCI-PTS style cryptographic operations efficiently, and secure boot plus tamper pins satisfy payment-terminal certification requirements. DDR3L support enables quick transaction response times under multi-tasking loads.
추천
Medical Patient Monitor
In patient monitors the ATSAMA5D27B-CUR's deterministic real-time performance and dual Ethernet ports with AVB/TSN allow synchronized streaming of waveforms and alarms across hospital networks. The 12-bit ADC captures analog vital-sign signals, while the LCD controller drives bedside displays up to 1024x768. Hardware crypto and secure boot help meet IEC 62443 and FDA cybersecurity expectations for connected medical devices, and the industrial temperature grade supports continuous operation.
추천
Vehicle Telematics Edge Node
Dual CAN-FD interfaces make the ATSAMA5D27B-CUR well suited for fleet telematics edge nodes interfacing with vehicle bus networks. The 500 MHz Cortex-A5 runs Linux containers for route optimization and predictive maintenance, while dual Gigabit Ethernet supports in-vehicle backbone links. Hardware AES/SHA secures over-the-air firmware updates, and the wide operating temperature range handles under-dash automotive environments. The 289-LFBGA package also enables compact form factors.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAMA5D27B-CUR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAMA5D27B-CU | ATSAMA5D27A-CUR | ATSAMA5D27A-CU | ATSAMA5D27A-CNR | ATSAMA5D27A-CN | ATSAMA5D26C-CUR |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 289-LFBGA (14x14 mm) | 289-LFBGA (14x14 mm) | 289-LFBGA (14x14 mm) | 289-LFBGA (14x14 mm) | 289-LFBGA (14x14 mm) | 289-LFBGA (14x14 mm) | 289-LFBGA (14x14 mm) |
| Silicon Revision | Revision B | Revision B | Revision A | Revision A | Revision C (D26) | ||
| Core Processor | ARM Cortex-A5 | ARM Cortex-A5 | ARM Cortex-A5 | ARM Cortex-A5 | |||
| Maximum Clock Speed | 500 MHz | 500 MHz | 500 MHz | 500 MHz | |||
| Packaging | Tape & Reel | Tray | Tray | Tray | |||
| On-Chip SRAM | 128 KB | 128 KB | 128 KB | 128 KB | |||
| Ethernet Ports | 2x Gigabit (AVB/TSN) | 2x Gigabit (AVB/TSN) | 2x Gigabit (AVB/TSN) | 2x Gigabit (AVB/TSN) | |||
| Hardware Crypto | AES/SHA/TRNG + secure boot | AES/SHA/TRNG + secure boot | AES/SHA/TRNG + secure boot | AES/SHA/TRNG + secure boot |
주요 차별점
- Revision-B silicon with refreshed errata (vs ATSAMA5D27A-CUR)
- Full SAMA5D2 feature set with dual GbE AVB/TSN (vs ATSAMA5D26C-CUR)
- Tape-and-reel packaging for SMT assembly (vs ATSAMA5D27B-CU)
설계 노트
The ATSAMA5D27B-CUR requires a clean 1.2 V core rail capable of delivering 500 mA typical at 500 MHz, plus 1.8 V and 3.3 V I/O rails. Use a low-noise LDO (e.g. Microchip MIC5332 or equivalent) with bulk decoupling of 22 uF ceramic + 100 uF tantalum near each supply pin. Power sequencing must follow the datasheet SAMA5D2 reference design: VDDCORE before VDDPLL, with VDDANA tracking VDDPLL within 50 ms. Failing to sequence correctly risks PLL lock failure and boot ROM misinterpretation of boot mode pins.
The 289-LFBGA uses 0.8 mm ball pitch, requiring 4-layer or 6-layer stack-up with micro-via-in-pad or sub-0.15 mm laser vias on the inner layers. DDR3L traces must be length-matched within 25 mil (0.635 mm) and routed on a single inner layer with reference ground plane; reference Microchip's SAMA5D27 PCB checklist application note for via-in-pad and decoupling guidelines. Place boot-mode and JTAG pins with accessible test points, since boot-mode errors are the most common first-board bring-up failures.
At 500 MHz with all peripherals active, expect junction-to-ambient thermal resistance of approximately 20-25 C/W for the 289-LFBGA (per Microchip package thermal model). Estimated power dissipation is 1.5 W to 2 W typical, requiring thermal vias under the center balls and a minimum 4-layer PCB with dedicated ground planes. For fanless industrial enclosures, ensure ambient stays below 70 C or throttle CPU via the integrated temperature sensor and thermal framework in Linux.
Common ATSAMA5D27B-CUR bring-up pitfalls include: (1) forgetting to pull the BMS (Boot Mode Select) pin to the correct logic level for QSPI vs SD boot; (2) DDR3L ZQ calibration failing due to inadequate reference voltage accuracy (use 1% resistors); (3) USB VBUS sensing missing on the cable-adapter port, causing USB device enumeration to fail intermittently. Always validate boot with the SAM-BA bootloader on first power-up before programming the application image.
Place the 25 MHz main crystal within 5 mm of the XIN/XOUT pins with a continuous ground guard ring. The DDR reference clock must be routed as a 50 ohm controlled-impedance trace length-matched to the SDRAM CK pair. Keep high-speed Ethernet differential pairs (RGMII) length-matched within 150 mil and reference to a continuous ground plane; avoid routing over plane splits. The integrated PHY does not require an external 125 MHz reference if RGMII is used, simplifying the BOM.
규정 준수 정보
RoHS and REACH compliant per Microchip product page; not AEC-Q100 qualified (industrial grade -40C to +85C). For automotive-grade SAMA5D2 variants, refer to Microchip's automotive-qualified part numbers.