ATSAMA5D27C-CUR - ARM Cortex-A5 MPU 500MHz | 289-LFBGA
부품 번호: ATSAMA5D27C-CUR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.92 | $18.92 |
| 10 | $17.55 | $175.50 |
| 100 | $15.8 | $1,580.00 |
| 500 | $14.25 | $7,125.00 |
| 1,000 | $12.9 | $12,900.00 |
ATSAMA5D27C-CUR 개요
A microprocessor (MPU) is the central processing unit of an embedded system, integrating CPU core, memory interfaces, peripherals, and security on a single die. The ATSAMA5D27C-CUR belongs to the application processor family, sitting above microcontrollers (MCUs) in the compute hierarchy, and is well suited for running Linux (Mainline kernel and Yocto distributions) alongside real-time deterministic workloads.
Key features include an ARM Cortex-A5 core with NEON and FPU support, 32 KB I-cache and 32 KB D-cache, 128 KB SRAM, DDR2/LPDDR/DDR3/LPDDR3 external memory controller (16-bit bus), 10/100 Ethernet MAC with IEEE 1588 support, dual CAN-FD controllers, USB 2.0 HS OTG + Host, up to 3 SD/SDIO/MMC interfaces, a TFT LCD controller up to 1024x768, and an embedded audio front-end (Class-D amplifier interface, I2S, SPDIF). The device also integrates a hardware cryptographic accelerator (AES, SHA, TRNG) and secure boot ROM.
The architecture is built on a low-power 65 nm process, achieving typical active power below 0.5 W at full 500 MHz load and only 5 µA in backup (Self-Refresh DDR) mode. The wide operating junction range of -40 °C to +85 °C supports industrial deployments such as HMI panels, smart energy gateways, and IoT edge nodes.
Typical applications include industrial HMI panels with capacitive touch, IoT edge gateways with secure boot, smart energy metering (IEC 61850 / DLMS), medical device HMIs, and connected POS / vending terminals. The SAMA5D2 family is also commonly used as a Linux-based coprocessor in industrial PLCs and building automation controllers.
When designing with this device, allocate adequate PCB area for the DDR2/LPDDR memory interface and follow Microchip AN-3203 layout guidelines to maintain signal integrity. The 0.8 mm ball pitch LFBGA requires NSMD pads with via-in-pad for reliable manufacturing, and the device must be paired with a PMIC such as the MCP16502 to supply the core, I/O, and DDR rails in the proper sequence.
This page synthesizes distributor pricing, drop-in SAMA5D2 family alternatives, and practical design notes that complement the official Microchip datasheet and schematic-checklist application notes.
드롭인 대체품: ATSAMA5D27C-CUR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAMA5D27C-CUR (동일 폼 팩터 및 풋프린트) — 차이점: Ethernet, USB, Package, Operating Temperature, Core Architecture.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAMA5D27C-CU
✅ 드롭인✓ 재고 있음
$11.9 / 개
데이터시트 보기 →ATSAMA5D27B-CUR
✅ 드롭인✓ 재고 있음
$11.85 / 개
데이터시트 보기 →ATSAMA5D27A-CUR
✅ 드롭인✓ 재고 있음
$12.95 / 개
데이터시트 보기 →ATSAMA5D26C-CUR
✅ 드롭인✓ 재고 있음
$6.85 / 개
데이터시트 보기 →ATSAMA5D24C-CUR
✅ 드롭인✓ 재고 있음
$10.2 / 개
데이터시트 보기 →ATSAMA5D27C-CUR 최대 정격 & 전기적 특성
| Core Architecture | ARM Cortex-A5 (32-bit) with NEON and FPU |
| Maximum CPU Clock | 500 MHz |
| Core Count | 1 |
| Cache (I-cache / D-cache) | 32 KB / 32 KB |
| Internal SRAM | 128 KB |
| ROM | 160 KB |
| External Memory Bus | 16-bit DDR2 / LPDDR / DDR3 / LPDDR3 |
| 패키지 | 289-LFBGA (14 x 14 mm, 0.8 mm pitch) |
| Operating Voltage (Core) | 1.2 V |
| 동작 온도 범위 | -40 °C to +85 °C (industrial) |
| Ethernet | 10/100 MAC with IEEE 1588 (EMAC) |
| USB | USB 2.0 HS Host + HS OTG + HS Device (3 ports) |
| CAN | 2x CAN-FD controllers |
| Display Controller | TFT LCD up to 1024 x 768 |
| Touch Controller | Peripheral Touch Controller (PTC) |
| Audio Subsystem | Embedded (Class-D, I2S, SPDIF) |
| Cryptography | AES, SHA, TRNG, secure boot |
| Backup Mode Current | 5 µA typical (DDR in Self-Refresh) |
| 실장 유형 | Surface Mount (Tape & Reel) |
| RoHS 상태 | Compliant |
ATSAMA5D27C-CUR 289-lfbga (14 x 14 mm, 0.8 mm pitch) 핀 구성 가이드
ATSAMA5D27C-CUR(289-lfbga (14 x 14 mm, 0.8 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAMA5D27C-CUR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAMA5D27C-CUR 적합 용도: 6 애플리케이션s: Industrial HMI with Capacitive Touch, IoT Edge Gateway with Secure Boot, Smart Energy Metering (IEC 61850 / DLMS), Connected POS / Vending Terminal, Building Automation Controller, Medical Device HMI.
Industrial HMI with Capacitive Touch
The ATSAMA5D27C-CUR is purpose-built for industrial HMI panels thanks to its integrated Peripheral Touch Controller (PTC) that drives up to a 1024 x 768 TFT LCD without an external touch IC. The 500 MHz Cortex-A5 with NEON easily runs Qt for Embedded Linux at 60 fps, and the 0.8 mm-pitch LFBGA enables slim panel designs. Unlike a discrete touch MCU plus display controller, the integrated PTC saves BOM cost and PCB area while keeping the BOM secure-boot capable via the on-chip crypto engine.
추천
IoT Edge Gateway with Secure Boot
Deploying Linux at the network edge demands hardware root-of-trust and low standby current, both delivered by the ATSAMA5D27C-CUR. The hardware AES/SHA/TRNG engine plus secure boot ROM verifies signed firmware at every power-on, while 10/100 Ethernet with IEEE 1588 timestamping supports PTP and TSN protocols. The 5 µA backup current lets battery-backed gateways ride out long outages. Compared to Cortex-M gateways, this part runs full TLS stacks and container runtimes on Yocto Linux.
추천
Smart Energy Metering (IEC 61850 / DLMS)
Smart meters need a deterministic real-time path plus secure communications; the ATSAMA5D27C-CUR satisfies both with hardware crypto and 10/100 Ethernet carrying DLMS/COSEM or IEC 61850 GOOSE. The 500 MHz core handles encryption without offloading, and the industrial -40 °C to +85 °C junction range meets outdoor cabinet requirements. Compared to a Cortex-M7 MCU solution, the integrated LCD controller drives a graphical tariff display without a separate graphics controller, reducing both BOM and attack surface.
추천
Connected POS / Vending Terminal
POS and vending terminals require capacitive touch, a color display, secure payment processing, and connectivity, all of which the ATSAMA5D27C-CUR provides on a single die. The embedded Class-D amplifier interface plus I2S/SPDIF drives speaker prompts, while the USB 2.0 HS ports handle printer peripherals and contactless card readers. Secure boot and hardware AES protect transaction keys. Versus a multi-chip MCU solution, this MPU consolidates audio, display, and connectivity onto one part, cutting both BOM count and PCB area.
추천
Building Automation Controller
KNX, BACnet, and Modbus building controllers benefit from the ATSAMA5D27C-CUR's dual CAN-FD ports for elevator and HVAC networks, plus the 10/100 Ethernet for BACnet/IP backhaul. Running Yocto Linux, the part executes scheduling and analytics logic while the hardware crypto engine secures OTA firmware updates. The -40 °C to +85 °C operating junction range covers mechanical rooms. Compared to PLC + HMI split architectures, this single-chip approach reduces cabinet space and total installed cost.
추천
Medical Device HMI
Patient monitors and infusion pumps require a reliable graphical HMI with strong isolation guarantees, both delivered by the ATSAMA5D27C-CUR. The Cortex-A5 core at 500 MHz drives a 1024 x 768 display with smooth waveform rendering, while the secure boot ROM enforces signed firmware integrity critical for FDA submissions. The 128 KB on-chip SRAM supports deterministic interrupt response for safety-critical I/O. Compared to ARM11 legacy parts, the SAMA5D2 delivers higher DMIPS per watt and an active Microchip LTS supply policy that supports long-life medical deployments.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAMA5D27C-CUR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAMA5D27C-CU | ATSAMA5D27B-CUR | ATSAMA5D27A-CUR | ATSAMA5D26C-CUR | ATSAMA5D24C-CUR |
|---|---|---|---|---|---|---|
| Package | 289-LFBGA (14x14 mm) | 289-LFBGA (14x14 mm) - same | 289-LFBGA (14x14 mm) - same | 289-LFBGA (14x14 mm) - same | 289-LFBGA (14x14 mm) - same | 289-LFBGA (14x14 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Maximum CPU Clock | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz |
| Core Architecture | ARM Cortex-A5 | ARM Cortex-A5 | ARM Cortex-A5 | ARM Cortex-A5 | ARM Cortex-A5 | ARM Cortex-A5 |
| Internal SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Embedded Audio Subsystem | Yes (Class-D, I2S, SPDIF) | Yes | Yes | Yes | No (D26 variant omits audio) | No (D24 variant omits audio) |
| Peripheral Touch Controller | Yes (PTC) | Yes | Yes | Yes | Yes | No (D24 variant omits PTC) |
| Hardware Cryptography | AES + SHA + TRNG + Secure Boot | AES + SHA + TRNG + Secure Boot | AES + SHA + TRNG + Secure Boot | AES + SHA + TRNG + Secure Boot | AES + SHA + TRNG + Secure Boot | AES + SHA + TRNG + Secure Boot |
| Silicon Revision / Step | C-step | C-step | B-step | A-step | C-step (D26 die variant) | C-step (D24 die variant) |
| Approx. Unit Price @ 1k (USD) | 12.90 | 12.90 | 11.40 | 10.20 | 11.85 | 9.60 |
주요 차별점
- Latest C-step silicon revision with all errata fixed (vs ATSAMA5D27B-CUR)
- Tape-and-Reel packaging for high-volume SMT production (vs ATSAMA5D27C-CU)
- Full D27 peripheral set including audio + PTC (vs ATSAMA5D26C-CUR / ATSAMA5D24C-CUR)
설계 노트
The 289-LFBGA at 0.8 mm pitch requires NSMD pads and via-in-pad construction per Microchip AN-3203. Allocate a minimum 6-layer stackup with continuous GND planes adjacent to the DDR signal layers to control characteristic impedance around 50 ohm single-ended / 100 ohm differential. Place the MCP16502 PMIC within 25 mm of the MPU core pins to minimize parasitic inductance on the 1.2 V rail.
Pair the ATSAMA5D27C-CUR with the Microchip MCP16502 PMIC for proper power sequencing of 1.2 V core, DDR termination, and 3.3 V I/O rails. The PMIC also drives the backup-battery rail that enables the 5 µA standby figure, putting DDR into Self-Refresh while the rest of the SoC is powered down. Do not substitute a discrete LDO arrangement unless you replicate the sequencing timing shown in Figure 36-1 of the SAMA5D2 datasheet.
Estimated: at 500 MHz with all peripherals active, the SAMA5D27 die dissipates approximately 0.5 W to 0.9 W. The 14 x 14 mm LFBGA has a typical theta_JA around 25-30 C/W on a 4-layer JEDEC test board. For enclosed industrial enclosures, place a thermal via array under the exposed die pad and connect it to an inner GND plane to spread heat. Avoid placing the part adjacent to a heat-generating Ethernet PHY.
Common pitfalls: (1) do not boot from NAND without configuring the on-die ECC in OTP fuses; (2) SDRAM traces must be length-matched to within 25 mil (0.635 mm) per Microchip DDR routing guidelines; (3) the secure-boot mode requires an OTP-signed image and cannot be reverted - leave the public-key area unlocked for development boards; (4) using a non-Microchip PMIC can prevent the backup current from achieving the 5 µA target.
The DDR2/DDR3 memory interface should be routed on the top layer beneath the BGA escape region to keep stubs under 1 mm. Series resistors on USB DP/DM lines are not required but common-mode chokes (90 ohm at 100 MHz) help pass EN 55032 Class B radiated emissions. The 10/100 Ethernet RMII signals should be guarded by GND traces; MII/RGMII modes require 25 MHz or 125 MHz reference clock jitter under 50 ps RMS.
규정 준수 정보
RoHS and lead-free per Microchip product page; not AEC-Q100 qualified (not an automotive part); halogen-free status not stated in provided data - marked unknown.
