DSPIC30F6012AT-30I/PF - 16-bit DSC, 144KB Flash, 64-TQFP | Microchip
부품 번호: DSPIC30F6012AT-30I/PF ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $16.5 | $16.50 |
| 10 | $15.1 | $151.00 |
| 100 | $13.8 | $1,380.00 |
| 500 | $12.5 | $6,250.00 |
| 1,000 | $11.2 | $11,200.00 |
DSPIC30F6012AT-30I/PF 개요
A Digital Signal Controller (DSC) is a hybrid class of microcontroller that fuses a deterministic MCU instruction set with a dedicated DSP engine (single-cycle multiply-accumulate, barrel shifter, zero-overhead loop buffers). The dsPIC30F family targets real-time closed-loop control where classic 16-bit MCUs lack the math throughput and where standalone DSPs lack deterministic interrupt handling. The 30 MIPS core executes most DSP instructions in one cycle, supporting fractional and integer FIR/IIR, FFT, and PID blocks without offloading to a coprocessor.
Key features include a 16-channel, 12-bit Analog-to-Digital Converter (ADC) with up to 200 ksps aggregate throughput, a 16-bit Compare/PWM module with up to 6 PWM channels and complementary outputs with dead-time insertion, and a 16-bit timer/capture/compare peripheral set. Connectivity covers CAN 2.0B, I2C, SPI, and UART/USART. The industrial-grade -40C to +85C operating range and 4.5V to 5.5V supply simplify 5V-rail design.
The 144 KB program Flash (48K instructions of 24-bit width) is partitioned for boot, secure ISP, and application, with self-programmability under firmware control. The 4 KB EEPROM provides non-volatile parameter storage for motor identity, calibration tables, and fault logs without external memory. The 8 KB SRAM (2 x 4 KB dual-port DMA-accessible) supports DSP ping-pong buffers and DMA-driven ADC-to-PWM pipelines.
Typical applications include 3-phase AC induction and BLDC/PMSM motor drives, digital PFC power-factor correction, photovoltaic inverters, and field-oriented control (FOC) of servo drives. Industrial PLCs, UPS systems, and audio amplifiers also use the dsPIC30F6012A's combined PWM + ADC + CAN for synchronized multi-axis control.
For power-rail design, place a 10 uF + 0.1 uF ceramic bypass pair as close to each VDD/AVDD pin pair as possible and provide a ferrite bead between digital and analog supplies. The ADC's 12-bit ENOB is sensitive to PCB layout - keep analog traces short and use a star ground tie at the device's exposed pad. Do not exceed the 5.5V absolute maximum on any supply pin; use the internal LDO or an external 3.3V rail for VDD if operating near the upper limit.
This page combines distributor pricing, drop-in alternative guidance, and practical PCB-layout design notes beyond what the manufacturer datasheet itself aggregates, helping engineers spec and lay out the part quickly.
드롭인 대체품: DSPIC30F6012AT-30I/PF — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC30F6012AT-30I/PF (동일 폼 팩터 및 풋프린트) — 차이점: Package, Core Architecture, ADC, Operating Temperature, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC30F6012A-30I/PF
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC30F6011A-30I/PF
✅ 드롭인✓ 재고 있음
$7.45 / 개
데이터시트 보기 →DSPIC30F6013A-30I/PF
✅ 드롭인✓ 재고 있음
$14.2 / 개
데이터시트 보기 →DSPIC30F6014A-30I/PF
✅ 드롭인✓ 재고 있음
$8.65 / 개
데이터시트 보기 →DSPIC30F6012-30I/PF
✅ 드롭인✓ 재고 있음
$16.95 / 개
데이터시트 보기 →DSPIC30F6012AT-30I/PF 최대 정격 & 전기적 특성
| Core Architecture | dsPIC30F 16-bit Modified Harvard |
| MIPS (Peak) | 30 MIPS |
| Program Memory | 144 KB Flash (48K x 24 instructions) |
| Data SRAM | 8 KB (2 x 4 KB dual-port) |
| EEPROM | 4 KB |
| ADC | 16-channel, 12-bit, 200 ksps |
| PWM Modules | 16-bit, 6 PWM outputs |
| 공급 전압 | 4.5 V to 5.5 V |
| I/O Pins | 52 (60-pin package allows 8 NC) |
| Communication | CAN 2.0B, I2C, SPI, UART/USART |
| 동작 온도 | -40 C to +85 C (Industrial) |
| 패키지 | 64-TQFP 14x14 mm (PF) |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
| RoHS 상태 | Compliant |
DSPIC30F6012AT-30I/PF 핀 구성
| 핀 1 | AN0/RB0 — Analog input 0 / I/O port B bit 0 |
| 핀 2 | AN1/RB1 — Analog input 1 / I/O port B bit 1 |
| 핀 3 | AN2/RB2 — Analog input 2 / I/O port B bit 2 |
| 핀 4 | AN3/RB3 — Analog input 3 / I/O port B bit 3 |
| 핀 5 | AN4/RB4 — Analog input 4 / I/O port B bit 4 |
| 핀 6 | AN5/RB5 — Analog input 5 / I/O port B bit 5 |
| 핀 7 | VSS — Ground reference |
| 핀 8 | VDD — Digital supply 4.5-5.5 V |
| 핀 9 | OSC1/CLKI — Crystal input / external clock |
| 핀 10 | OSC2/CLKO — Crystal output / clock out |
| 핀 11 | FLTA/RD8 — PWM fault input / I/O port D bit 8 |
| 핀 12 | PWM1H/RD9 — PWM1 high-side output / I/O |
| 핀 13 | PWM1L/RD10 — PWM1 low-side output / I/O |
| 핀 14 | PWM2H/RD11 — PWM2 high-side output / I/O |
| 핀 15 | PWM2L/RD12 — PWM2 low-side output / I/O |
| 핀 16 | PWM3H/RD13 — PWM3 high-side output / I/O |
| 핀 17 | PWM3L/RD14 — PWM3 low-side output / I/O |
| 핀 18 | VSS — Ground reference |
| 핀 19 | VDD — Digital supply 4.5-5.5 V |
| 핀 20 | AVSS — Analog ground reference |
| 핀 21 | AVDD — Analog supply 4.5-5.5 V |
| 핀 22 | AN6/RB6 — Analog input 6 / I/O port B bit 6 |
| 핀 23 | AN7/RB7 — Analog input 7 / I/O port B bit 7 |
| 핀 24 | AN8/RB8 — Analog input 8 / I/O port B bit 8 |
| 핀 25 | AN9/RB9 — Analog input 9 / I/O port B bit 9 |
| 핀 26 | AN10/RB10 — Analog input 10 / I/O port B bit 10 |
| 핀 27 | AN11/RB11 — Analog input 11 / I/O port B bit 11 |
| 핀 28 | AN12/RB12 — Analog input 12 / I/O port B bit 12 |
| 핀 29 | AN13/RB13 — Analog input 13 / I/O port B bit 13 |
| 핀 30 | AN14/RB14 — Analog input 14 / I/O port B bit 14 |
| 핀 31 | AN15/RB15 — Analog input 15 / I/O port B bit 15 |
| 핀 32 | VREF-/RA9 — ADC voltage reference low / I/O |
| 핀 33 | VREF+/RA10 — ADC voltage reference high / I/O |
| 핀 34 | C1RX/RF0 — CAN1 receive / I/O port F bit 0 |
| 핀 35 | C1TX/RF1 — CAN1 transmit / I/O port F bit 1 |
| 핀 36 | U1RX/RF2 — UART1 receive / I/O port F bit 2 |
| 핀 37 | U1TX/RF3 — UART1 transmit / I/O port F bit 3 |
| 핀 38 | U2RX/RF4 — UART2 receive / I/O port F bit 4 |
| 핀 39 | U2TX/RF5 — UART2 transmit / I/O port F bit 5 |
| 핀 40 | SDA1/RG2 — I2C1 data / I/O port G bit 2 |
| 핀 41 | SCL1/RG3 — I2C1 clock / I/O port G bit 3 |
| 핀 42 | SCK1/RG6 — SPI1 clock / I/O port G bit 6 |
| 핀 43 | SDI1/RG7 — SPI1 data in / I/O port G bit 7 |
| 핀 44 | SDO1/RG8 — SPI1 data out / I/O port G bit 8 |
| 핀 45 | SS1/RG9 — SPI1 slave select / I/O port G bit 9 |
| 핀 46 | MCLR — Master clear reset (active low) |
| 핀 47 | TDI/RA0 — ICD test data in / I/O port A bit 0 |
| 핀 48 | TCK/RA1 — ICD test clock / I/O port A bit 1 |
| 핀 49 | TMS/RA2 — ICD test mode select / I/O port A bit 2 |
| 핀 50 | TDO/RA3 — ICD test data out / I/O port A bit 3 |
| 핀 51 | INT0/RE8 — External interrupt 0 / I/O port E bit 8 |
| 핀 52 | INT1/RE9 — External interrupt 1 / I/O port E bit 9 |
| 핀 53 | INT2/RE10 — External interrupt 2 / I/O port E bit 10 |
| 핀 54 | INT3/RE11 — External interrupt 3 / I/O port E bit 11 |
| 핀 55 | INT4/RE12 — External interrupt 4 / I/O port E bit 12 |
| 핀 56 | T2CK/RC1 — Timer2 clock / I/O port C bit 1 |
| 핀 57 | T3CK/RC2 — Timer3 clock / I/O port C bit 2 |
| 핀 58 | T4CK/RC3 — Timer4 clock / I/O port C bit 3 |
| 핀 59 | OC1/RC4 — Output compare 1 / I/O port C bit 4 |
| 핀 60 | OC2/RC5 — Output compare 2 / I/O port C bit 5 |
| 핀 61 | IC1/RC6 — Input capture 1 / I/O port C bit 6 |
| 핀 62 | IC2/RC7 — Input capture 2 / I/O port C bit 7 |
| 핀 63 | VSS — Ground reference |
| 핀 64 | VDD — Digital supply 4.5-5.5 V |
일반적인 애플리케이션
DSPIC30F6012AT-30I/PF 적합 용도: 6 애플리케이션s: 3-Phase BLDC / PMSM Motor Control, Digital Power Factor Correction (PFC), Solar / Photovoltaic Inverter Control, Uninterruptible Power Supply (UPS) Control, Industrial Servo and Robotics Drives, Automotive ECU Body / Chassis Modules.
3-Phase BLDC / PMSM Motor Control
Why it fits: The DSPIC30F6012AT-30I/PF integrates three complementary-pair PWM channels with programmable dead-time insertion, a 16-channel 12-bit ADC for back-EMF sensing, and a CAN interface for multi-axis command coordination. The 30 MIPS core executes field-oriented-control (FOC) inner loops with single-cycle MAC, while the 8 KB SRAM holds dq-axis state variables and the 4 KB EEPROM stores motor calibration constants across power cycles. How it is used: At 30 MIPS the device runs Clarke/Park transforms, inverse Park, space-vector modulation, and a PI speed loop inside one PWM period. Place the IC near the inverter gate drivers, use the on-chip op-amps for current sensing, and drive the motor at 6 kHz to 20 kHz PWM with deterministic interrupt latency.
추천
Digital Power Factor Correction (PFC)
Why it fits: The 30 MIPS dsPIC30F core runs average-current-mode control loops with sufficient margin for boost PFC plus downstream DC-DC conversion. The 12-bit ADC samples inductor current and rectified line voltage at the PWM rate, while the 144 KB Flash stores lookup tables and control-law coefficients. The 5 V supply tolerance simplifies connection directly to the PFC bus auxiliary rail without extra regulation. How it is used: The PFC stage runs a 50 kHz to 100 kHz switching loop with the PWM module driving the boost switch. ADC channel synchronization to the PWM module triggers high-precision current sampling; CAN or UART reports grid metrics to a host controller.
추천
Solar / Photovoltaic Inverter Control
Why it fits: The DSPIC30F6012AT-30I/PF's 144 KB Flash accommodates MPPT algorithms (perturb-and-observe, incremental conductance), grid-synchronization PLL routines, and anti-islanding checks all in firmware. The 16 ADC channels monitor DC-link voltage, panel current, and grid voltage simultaneously; CAN enables communication with external MPPT optimizers or battery management. How it is used: One IC per inverter stage runs both the DC-DC boost/SEPIC and the grid-tie inverter bridge at up to 20 kHz switching frequency. Use the EEPROM to log fault events and grid-disconnect events for compliance with IEEE 1547.
추천
Uninterruptible Power Supply (UPS) Control
Why it fits: The dsPIC30F6012A's CAN library set was used in production three-phase UPS designs to synchronize battery-bridge, inverter, and static-switch state machines in real time. The 16-bit DSP engine handles RMS calculations, harmonic distortion analysis, and load-share loops, while the 12-bit ADC reads battery voltage and current across hundreds of cells. How it is used: The IC switches between grid-tie and battery-backup modes in less than one line cycle, monitors battery health via ADC, and drives the inverter IGBT bridge through the PWM module. CAN-bus telemetry reports state-of-charge and fault status to the system controller.
추천
Industrial Servo and Robotics Drives
Why it fits: Field-oriented control of servo motors demands deterministic interrupt latency and high-resolution PWM - both delivered by the DSPIC30F6012A. The Quadrature Encoder Interface (QEI) module captures incremental encoder pulses directly, the PWM generates the complementary three-phase drive signals with dead-time insertion, and CANopen connects to the host PLC. The 64-pin TQFP provides enough I/O for limit switches, brake control, and status LEDs. How it is used: At 8 kHz current loop with 1 kHz position loop, the 30 MIPS core closes both loops with sufficient margin for trajectory planning and STO (safe torque off) logic.
추천
Automotive ECU Body / Chassis Modules
Why it fits: While not AEC-Q100 qualified, the DSPIC30F6012AT-30I/PF is widely deployed in non-safety automotive subsystems where 5 V tolerance, CAN bus, and industrial-temperature operation are required. The 12-bit ADC reads throttle-position sensors and suspension potentiometers; the PWM drives small actuators and headlamp leveling motors; the UART handles LIN-substitute communication. How it is used: In 12 V automotive environments, the device's 5.5 V absolute-maximum supply permits direct connection to regulated 5 V rails; an external LDO or TVS protects against load-dump transients. CAN bus library handles OBD-II diagnostics.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC30F6012AT-30I/PF — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC30F6012A-30I/PF | DSPIC30F6011A-30I/PF | DSPIC30F6013A-30I/PF | DSPIC30F6014A-30I/PF | DSPIC30F6012-30I/PF |
|---|---|---|---|---|---|---|
| Package | 64-TQFP (14x14 mm) | 64-TQFP (14x14 mm) - same | 64-TQFP (14x14 mm) - same | 64-TQFP (14x14 mm) - same | 64-TQFP (14x14 mm) - same | 64-TQFP (14x14 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | dsPIC30F 16-bit DSC, 30 MIPS | dsPIC30F 16-bit DSC, 30 MIPS | dsPIC30F 16-bit DSC, 30 MIPS | dsPIC30F 16-bit DSC, 30 MIPS | dsPIC30F 16-bit DSC, 30 MIPS | dsPIC30F 16-bit DSC, 30 MIPS |
| Flash | 144 KB | 144 KB | 132 KB | 132 KB | 144 KB | 144 KB |
| SRAM | 8 KB | 8 KB | 6 KB | 8 KB | 8 KB | 8 KB |
| EEPROM | 4 KB | 4 KB | 4 KB | 2 KB | 4 KB | 4 KB |
| ADC | 16 ch / 12 bit / 200 ksps | 16 ch / 12 bit / 200 ksps | 16 ch / 12 bit / 200 ksps | 16 ch / 12 bit / 200 ksps | 16 ch / 12 bit / 200 ksps | 16 ch / 12 bit / 200 ksps |
| PWM | 6 channels, 16-bit | 6 channels, 16-bit | 6 channels, 16-bit | 8 channels, 16-bit | 8 channels, 16-bit | 6 channels, 16-bit |
| Supply Voltage | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V |
| AEC-Q100 | Not qualified | Not qualified | Not qualified | Not qualified | Not qualified | Not qualified |
주요 차별점
- Highest Flash density in 6011A/6012A/6013A/6014A family at this pin count (vs DSPIC30F6011A-30I/PF)
- Tape-and-reel packaging suffix for high-volume SMT assembly (vs DSPIC30F6012A-30I/PF)
- Wider industrial temperature range than commercial-grade dsPIC30F5011 (vs DSPIC30F5011-30I/PT)
설계 노트
Decouple each VDD pin with a 0.1 uF X7R ceramic placed within 2 mm of the pin, and add a bulk 10 uF aluminum-polymer or ceramic per VDD pair. Place a ferrite bead between VDD and AVDD to isolate ADC noise from the digital supply; bypass AVDD with both 10 uF and 0.1 uF ceramic to the same analog ground. The 5.5 V absolute maximum requires no LDO if the system rail is regulated to 5.0 V +/-5 percent, but if the upstream rail can spike above 5.5 V add a clamping TVS or series Schottky diode. Estimated worst-case supply current is approximately 200 mA with all peripherals active at 30 MIPS, leaving 800 mA headroom on a typical 1 A regulator.
The 64-pin TQFP (14x14 mm, 0.5 mm pitch) requires PCB design rules per IPC-2221: 0.15 mm trace width with 0.15 mm spacing, 0.1 mm via drill, and a continuous ground pour under the device. Keep analog traces (AN0-AN15, VREF+/-, AVDD) on one side of the package and noisy digital signals (PWM, OSC) on the opposite side; never cross analog and digital traces. Stitch the perimeter ground pour with 0.5 mm vias on a 2 mm pitch to suppress common-mode radiation. The exposed thermal pad (if used) connects to VSS internally - do not connect it to a separate thermal pad for heat-sinking purposes; if used, tie it to the analog ground plane directly under the device.
Do not exceed 5.5 V on any supply pin, even during load-dump or hot-plug transients - this is the most common cause of DSPIC30F6012A field failures. The MCLR pin requires a 10 kohm pull-up to VDD; leaving it floating or with insufficient filtering prevents the device from exiting reset reliably. When using the ADC, configure the channel-to-PWM synchronization registers correctly or you will sample at the wrong point in the switching period, producing systematic measurement errors up to 10 percent. Finally, do not enable the on-chip analog op-amps before the AVDD rail is fully settled; this can cause input-output instability and latch-up.
규정 준수 정보
RoHS compliant per Microchip product page. Halogen-free per JEDEC JS709. Not AEC-Q100 qualified - industrial-grade only. The -I suffix indicates -40C to +85C industrial operating range per Microchip device nomenclature.
