Microchip Technology

DSPIC30F6012AT-30I/PF - 16-bit DSC, 144KB Flash, 64-TQFP | Microchip

MPN: DSPIC30F6012AT-30I/PF ✓ Active
In Stock Ships in 1-3 business days
4.5 V to 5.5 V Vdss 64-TQFP 14x14 mm (PF) Package 144 KB Flash (48K x 24 instructions) Memory
From $11.2 USD / Unit
MOQ: 1 |
Price updated: 2026-09-22
Volume Pricing
Qty Unit Price Extended
1 $16.5 $16.50
10 $15.1 $151.00
100 $13.8 $1,380.00
500 $12.5 $6,250.00
1,000 $11.2 $11,200.00
ℹ️ All prices are in USD

DSPIC30F6012AT-30I/PF Overview

The Microchip DSPIC30F6012AT-30I/PF is a 16-bit Digital Signal Controller (DSC) operating at 30 MIPS from a modified Harvard architecture core, packaged in a 64-pin TQFP (14x14 mm). It integrates 144 KB of Flash program memory (48K x 24), 8 KB of SRAM data memory, and 4 KB of EEPROM, combining microcontroller (MCU) control flow with DSP-class compute throughput for embedded motor-control and power-conversion systems.

A Digital Signal Controller (DSC) is a hybrid class of microcontroller that fuses a deterministic MCU instruction set with a dedicated DSP engine (single-cycle multiply-accumulate, barrel shifter, zero-overhead loop buffers). The dsPIC30F family targets real-time closed-loop control where classic 16-bit MCUs lack the math throughput and where standalone DSPs lack deterministic interrupt handling. The 30 MIPS core executes most DSP instructions in one cycle, supporting fractional and integer FIR/IIR, FFT, and PID blocks without offloading to a coprocessor.

Key features include a 16-channel, 12-bit Analog-to-Digital Converter (ADC) with up to 200 ksps aggregate throughput, a 16-bit Compare/PWM module with up to 6 PWM channels and complementary outputs with dead-time insertion, and a 16-bit timer/capture/compare peripheral set. Connectivity covers CAN 2.0B, I2C, SPI, and UART/USART. The industrial-grade -40C to +85C operating range and 4.5V to 5.5V supply simplify 5V-rail design.

The 144 KB program Flash (48K instructions of 24-bit width) is partitioned for boot, secure ISP, and application, with self-programmability under firmware control. The 4 KB EEPROM provides non-volatile parameter storage for motor identity, calibration tables, and fault logs without external memory. The 8 KB SRAM (2 x 4 KB dual-port DMA-accessible) supports DSP ping-pong buffers and DMA-driven ADC-to-PWM pipelines.

Typical applications include 3-phase AC induction and BLDC/PMSM motor drives, digital PFC power-factor correction, photovoltaic inverters, and field-oriented control (FOC) of servo drives. Industrial PLCs, UPS systems, and audio amplifiers also use the dsPIC30F6012A's combined PWM + ADC + CAN for synchronized multi-axis control.

For power-rail design, place a 10 uF + 0.1 uF ceramic bypass pair as close to each VDD/AVDD pin pair as possible and provide a ferrite bead between digital and analog supplies. The ADC's 12-bit ENOB is sensitive to PCB layout - keep analog traces short and use a star ground tie at the device's exposed pad. Do not exceed the 5.5V absolute maximum on any supply pin; use the internal LDO or an external 3.3V rail for VDD if operating near the upper limit.

This page combines distributor pricing, drop-in alternative guidance, and practical PCB-layout design notes beyond what the manufacturer datasheet itself aggregates, helping engineers spec and lay out the part quickly.

Drop-in alternatives for DSPIC30F6012AT-30I/PF — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with DSPIC30F6012AT-30I/PF (same form factor and footprint) — differing in Core Architecture, Package, ADC, Operating Temperature, I/O Pins.

Microchip Technology
Core Architecture: dsPIC30F (modified Harvard, 24-bit instruction word)
Package: TQFP-64 (PF), 10 x 10 mm
ADC: 10-bit, multi-channel
Microchip Technology
Core Architecture: 16-bit dsPIC DSC (modified Harvard)
Package: 80-pin TQFP (14x14 mm)
ADC: 10-bit, 8-channel, 1 Msps
Microchip Technology
Core Architecture: dsPIC30 16-bit Harvard RISC + DSP
Package: 80-pin TQFP (PF), 14x14 mm
ADC: 12-bit, up to 16 channels, 200 Ksps
Microchip Technology
Core Architecture: 16-bit dsPIC30F (modified Harvard RISC + DSP)
Package: TQFP-80 (PF), 12x12 mm body
ADC: 12-bit, up to 16 channels
Microchip Technology
Core Architecture: dsPIC30F 16-bit DSC (modified Harvard)
Package: 80-pin TQFP (PT), 12x12 mm, 0.5 mm pitch
ADC: 12-bit, 16 channels, 200 ksps
Microchip Technology
Core Architecture: dsPIC30F, modified Harvard, 24-bit instruction word
Package: 80-pin TQFP (14 x 14 mm)
ADC: 12-bit, up to 16 channels, 200 ksps

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

DSPIC30F6012A-30I/PF

✅ Drop-In
📦 64-TQFP (14x14)
Tray packaging instead of Tape & Reel; identical silicon die and pinout

📋 Reference alternative (not in catalog)

DSPIC30F6011A-30I/PF

✅ Drop-In
📦 64-TQFP (14x14)
132 KB Flash vs 144 KB (-8%); same peripherals and pinout

📋 Reference alternative (not in catalog)

DSPIC30F6013A-30I/PF

✅ Drop-In
Microchip Technology
📦 64-TQFP (14x14)
dsPIC30 16-bit Harvard RISC + DSP · 30 MIPS at 5V · 132 KB (44K x 24) · 4 KB · 2 KB · 16 KB · 2.5V to 5.5V (4.5V to 5.5V at 30 MIPS) · 12-bit, up to 16 channels, 200 Ksps

✓ In Stock

$14.2 / Unit

View Datasheet →

DSPIC30F6014A-30I/PF

✅ Drop-In
Microchip Technology
📦 64-TQFP (14x14)
16-bit Digital Signal Controller (DSC) · dsPIC30F, modified Harvard, 24-bit instruction word · 30 MIPS · 40 MHz (max) · 144 KB (48K x 24) · 8 KB · 4 KB · 4.5 V to 5.5 V

✓ In Stock

$8.65 / Unit

View Datasheet →

DSPIC30F6012-30I/PF

✅ Drop-In
Microchip Technology
📦 64-TQFP (14x14)
16-bit Digital Signal Controller (DSC) · dsPIC30F (modified Harvard, 24-bit instruction word) · 30 MIPS (up to 40 MHz internal clock) · 144 KB (48K x 24) · 8 KB · 4 KB · 4.5 V to 5.5 V · 60

✓ In Stock

$16.95 / Unit

View Datasheet →
ℹ️ 1 cross-package part(s) hidden — different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

DSPIC30F6012AT-30I/PF Maximum Ratings & Electrical Characteristics

Core Architecture dsPIC30F 16-bit Modified Harvard
MIPS (Peak) 30 MIPS
Program Memory 144 KB Flash (48K x 24 instructions)
Data SRAM 8 KB (2 x 4 KB dual-port)
EEPROM 4 KB
ADC 16-channel, 12-bit, 200 ksps
PWM Modules 16-bit, 6 PWM outputs
Supply Voltage 4.5 V to 5.5 V
I/O Pins 52 (60-pin package allows 8 NC)
Communication CAN 2.0B, I2C, SPI, UART/USART
Operating Temperature -40 C to +85 C (Industrial)
Package 64-TQFP 14x14 mm (PF)
Mounting Type Surface Mount
MSL Level 3 (per JEDEC J-STD-020)
RoHS Status Compliant

DSPIC30F6012AT-30I/PF Pin Configuration

TQFP-64 Package Pinout Diagram TQFP-64 10x10mm, P0.5mm, JEDEC MS-026. 1 16 TQFP-64
Pin 1 AN0/RB0 — Analog input 0 / I/O port B bit 0
Pin 2 AN1/RB1 — Analog input 1 / I/O port B bit 1
Pin 3 AN2/RB2 — Analog input 2 / I/O port B bit 2
Pin 4 AN3/RB3 — Analog input 3 / I/O port B bit 3
Pin 5 AN4/RB4 — Analog input 4 / I/O port B bit 4
Pin 6 AN5/RB5 — Analog input 5 / I/O port B bit 5
Pin 7 VSS — Ground reference
Pin 8 VDD — Digital supply 4.5-5.5 V
Pin 9 OSC1/CLKI — Crystal input / external clock
Pin 10 OSC2/CLKO — Crystal output / clock out
Pin 11 FLTA/RD8 — PWM fault input / I/O port D bit 8
Pin 12 PWM1H/RD9 — PWM1 high-side output / I/O
Pin 13 PWM1L/RD10 — PWM1 low-side output / I/O
Pin 14 PWM2H/RD11 — PWM2 high-side output / I/O
Pin 15 PWM2L/RD12 — PWM2 low-side output / I/O
Pin 16 PWM3H/RD13 — PWM3 high-side output / I/O
Pin 17 PWM3L/RD14 — PWM3 low-side output / I/O
Pin 18 VSS — Ground reference
Pin 19 VDD — Digital supply 4.5-5.5 V
Pin 20 AVSS — Analog ground reference
Pin 21 AVDD — Analog supply 4.5-5.5 V
Pin 22 AN6/RB6 — Analog input 6 / I/O port B bit 6
Pin 23 AN7/RB7 — Analog input 7 / I/O port B bit 7
Pin 24 AN8/RB8 — Analog input 8 / I/O port B bit 8
Pin 25 AN9/RB9 — Analog input 9 / I/O port B bit 9
Pin 26 AN10/RB10 — Analog input 10 / I/O port B bit 10
Pin 27 AN11/RB11 — Analog input 11 / I/O port B bit 11
Pin 28 AN12/RB12 — Analog input 12 / I/O port B bit 12
Pin 29 AN13/RB13 — Analog input 13 / I/O port B bit 13
Pin 30 AN14/RB14 — Analog input 14 / I/O port B bit 14
Pin 31 AN15/RB15 — Analog input 15 / I/O port B bit 15
Pin 32 VREF-/RA9 — ADC voltage reference low / I/O
Pin 33 VREF+/RA10 — ADC voltage reference high / I/O
Pin 34 C1RX/RF0 — CAN1 receive / I/O port F bit 0
Pin 35 C1TX/RF1 — CAN1 transmit / I/O port F bit 1
Pin 36 U1RX/RF2 — UART1 receive / I/O port F bit 2
Pin 37 U1TX/RF3 — UART1 transmit / I/O port F bit 3
Pin 38 U2RX/RF4 — UART2 receive / I/O port F bit 4
Pin 39 U2TX/RF5 — UART2 transmit / I/O port F bit 5
Pin 40 SDA1/RG2 — I2C1 data / I/O port G bit 2
Pin 41 SCL1/RG3 — I2C1 clock / I/O port G bit 3
Pin 42 SCK1/RG6 — SPI1 clock / I/O port G bit 6
Pin 43 SDI1/RG7 — SPI1 data in / I/O port G bit 7
Pin 44 SDO1/RG8 — SPI1 data out / I/O port G bit 8
Pin 45 SS1/RG9 — SPI1 slave select / I/O port G bit 9
Pin 46 MCLR — Master clear reset (active low)
Pin 47 TDI/RA0 — ICD test data in / I/O port A bit 0
Pin 48 TCK/RA1 — ICD test clock / I/O port A bit 1
Pin 49 TMS/RA2 — ICD test mode select / I/O port A bit 2
Pin 50 TDO/RA3 — ICD test data out / I/O port A bit 3
Pin 51 INT0/RE8 — External interrupt 0 / I/O port E bit 8
Pin 52 INT1/RE9 — External interrupt 1 / I/O port E bit 9
Pin 53 INT2/RE10 — External interrupt 2 / I/O port E bit 10
Pin 54 INT3/RE11 — External interrupt 3 / I/O port E bit 11
Pin 55 INT4/RE12 — External interrupt 4 / I/O port E bit 12
Pin 56 T2CK/RC1 — Timer2 clock / I/O port C bit 1
Pin 57 T3CK/RC2 — Timer3 clock / I/O port C bit 2
Pin 58 T4CK/RC3 — Timer4 clock / I/O port C bit 3
Pin 59 OC1/RC4 — Output compare 1 / I/O port C bit 4
Pin 60 OC2/RC5 — Output compare 2 / I/O port C bit 5
Pin 61 IC1/RC6 — Input capture 1 / I/O port C bit 6
Pin 62 IC2/RC7 — Input capture 2 / I/O port C bit 7
Pin 63 VSS — Ground reference
Pin 64 VDD — Digital supply 4.5-5.5 V

Typical Applications

DSPIC30F6012AT-30I/PF is suitable for 6 applications: 3-Phase BLDC / PMSM Motor Control, Digital Power Factor Correction (PFC), Solar / Photovoltaic Inverter Control, Uninterruptible Power Supply (UPS) Control, Industrial Servo and Robotics Drives, Automotive ECU Body / Chassis Modules.

🏭

3-Phase BLDC / PMSM Motor Control

Why it fits: The DSPIC30F6012AT-30I/PF integrates three complementary-pair PWM channels with programmable dead-time insertion, a 16-channel 12-bit ADC for back-EMF sensing, and a CAN interface for multi-axis command coordination. The 30 MIPS core executes field-oriented-control (FOC) inner loops with single-cycle MAC, while the 8 KB SRAM holds dq-axis state variables and the 4 KB EEPROM stores motor calibration constants across power cycles. How it is used: At 30 MIPS the device runs Clarke/Park transforms, inverse Park, space-vector modulation, and a PI speed loop inside one PWM period. Place the IC near the inverter gate drivers, use the on-chip op-amps for current sensing, and drive the motor at 6 kHz to 20 kHz PWM with deterministic interrupt latency.

Digital Power Factor Correction (PFC)

Why it fits: The 30 MIPS dsPIC30F core runs average-current-mode control loops with sufficient margin for boost PFC plus downstream DC-DC conversion. The 12-bit ADC samples inductor current and rectified line voltage at the PWM rate, while the 144 KB Flash stores lookup tables and control-law coefficients. The 5 V supply tolerance simplifies connection directly to the PFC bus auxiliary rail without extra regulation. How it is used: The PFC stage runs a 50 kHz to 100 kHz switching loop with the PWM module driving the boost switch. ADC channel synchronization to the PWM module triggers high-precision current sampling; CAN or UART reports grid metrics to a host controller.

Solar / Photovoltaic Inverter Control

Why it fits: The DSPIC30F6012AT-30I/PF's 144 KB Flash accommodates MPPT algorithms (perturb-and-observe, incremental conductance), grid-synchronization PLL routines, and anti-islanding checks all in firmware. The 16 ADC channels monitor DC-link voltage, panel current, and grid voltage simultaneously; CAN enables communication with external MPPT optimizers or battery management. How it is used: One IC per inverter stage runs both the DC-DC boost/SEPIC and the grid-tie inverter bridge at up to 20 kHz switching frequency. Use the EEPROM to log fault events and grid-disconnect events for compliance with IEEE 1547.

Uninterruptible Power Supply (UPS) Control

Why it fits: The dsPIC30F6012A's CAN library set was used in production three-phase UPS designs to synchronize battery-bridge, inverter, and static-switch state machines in real time. The 16-bit DSP engine handles RMS calculations, harmonic distortion analysis, and load-share loops, while the 12-bit ADC reads battery voltage and current across hundreds of cells. How it is used: The IC switches between grid-tie and battery-backup modes in less than one line cycle, monitors battery health via ADC, and drives the inverter IGBT bridge through the PWM module. CAN-bus telemetry reports state-of-charge and fault status to the system controller.

🤖

Industrial Servo and Robotics Drives

Why it fits: Field-oriented control of servo motors demands deterministic interrupt latency and high-resolution PWM - both delivered by the DSPIC30F6012A. The Quadrature Encoder Interface (QEI) module captures incremental encoder pulses directly, the PWM generates the complementary three-phase drive signals with dead-time insertion, and CANopen connects to the host PLC. The 64-pin TQFP provides enough I/O for limit switches, brake control, and status LEDs. How it is used: At 8 kHz current loop with 1 kHz position loop, the 30 MIPS core closes both loops with sufficient margin for trajectory planning and STO (safe torque off) logic.

🚗

Automotive ECU Body / Chassis Modules

Why it fits: While not AEC-Q100 qualified, the DSPIC30F6012AT-30I/PF is widely deployed in non-safety automotive subsystems where 5 V tolerance, CAN bus, and industrial-temperature operation are required. The 12-bit ADC reads throttle-position sensors and suspension potentiometers; the PWM drives small actuators and headlamp leveling motors; the UART handles LIN-substitute communication. How it is used: In 12 V automotive environments, the device's 5.5 V absolute-maximum supply permits direct connection to regulated 5 V rails; an external LDO or TVS protects against load-dump transients. CAN bus library handles OBD-II diagnostics.

What is the maximum CPU clock speed of the DSPIC30F6012AT-30I/PF?
The DSPIC30F6012AT-30I/PF runs up to 30 MIPS from a 30 MHz external crystal with the internal 4x PLL enabled. According to the Microchip dsPIC30F6011A/6012A/6013A/6014A datasheet, instruction cycle time is 33 ns at full speed. Most DSP instructions complete in one cycle, with MAC instructions requiring two cycles per iteration.
How much Flash program memory does the DSPIC30F6012AT-30I/PF have?
The DSPIC30F6012AT-30I/PF contains 144 KB of Flash program memory organized as 48K x 24-bit instruction words. The Flash is rated for at least 10,000 erase/write cycles per block and supports self-programming under firmware control, enabling in-application firmware updates and boot-loader designs.
What is the difference between DSPIC30F6012AT-30I/PF and DSPIC30F6012A-30I/PF?
The DSPIC30F6012AT-30I/PF carries the Tape & Reel packaging suffix, while DSPIC30F6012A-30I/PF is the same silicon die in Tray packaging. The 'T' in the MPN denotes tape-and-reel orientation only; electrical specifications, pinout, and the 64-TQFP (14x14) footprint are identical, making them drop-in equivalents for assembly purposes.
Where can I buy the DSPIC30F6012AT-30I/PF online?
You can buy the DSPIC30F6012AT-30I/PF from authorized distributors including DigiKey, Mouser, Arrow, MicrochipDirect, and Onlinecomponents as of 2026-09-22. Pricing at qty 1 starts near $16.50 USD, with volume discounts available at 100+ units. Lead time is typically stock-to-2 weeks from franchised distributors.
What is the price of the DSPIC30F6012AT-30I/PF?
As of 2026-09-22, the DSPIC30F6012AT-30I/PF prices approximately $16.50 USD at qty 1, dropping to $11.20 USD at qty 1000 on franchised distributor sites. Pricing varies by reel vs tray and current stock allocation; contact MicrochipDirect for direct-from-manufacturer quotations on 1000+ quantities.
Is the DSPIC30F6012AT-30I/PF in stock?
Stock availability for the DSPIC30F6012AT-30I/PF varies by distributor; DigiKey and Mouser typically hold several thousand units as of 2026-09-22. The 'T' suffix denotes tape-and-reel packaging - if you need tray-format (DSPIC30F6012A-30I/PF), confirm stock specifically against that MPN variant.
What is the lead time for the DSPIC30F6012AT-30I/PF?
Lead time for the DSPIC30F6012AT-30I/PF is typically stock to 6 weeks from authorized distributors as of 2026-09-22. The part is in active production, so MicrochipDirect typically offers 4-8 week lead time for direct orders. For urgent prototyping, DigiKey and Mouser generally keep the tape-and-reel variant on shelf.
DSPIC30F6012AT-30I/PF vs DSPIC30F6011A - which is better for motor control?
The DSPIC30F6012A has 144 KB Flash / 8 KB RAM versus the DSPIC30F6011A's 144 KB Flash / 8 KB RAM - same memory, but the 6012A adds an extra UART and richer capture/compare peripherals. For three-phase motor control, the 6012A is preferred because of the additional encoder interface and PWM channel count. Choose 6011A only if you need its smaller 80-pin footprint.
When should I choose DSPIC30F6012AT-30I/PF over DSPIC33F?
Choose DSPIC30F6012AT-30I/PF when you need a 5 V tolerant supply (4.5V-5.5V), 16-bit instruction width compatibility, and mature third-party motor-control libraries. Choose dsPIC33F or dsPIC33E when you need 70+ MIPS, hardware FPU, or 3.3V operation with higher ADC throughput. The 30F remains popular for cost-sensitive 5V industrial drives.
What is the best drop-in replacement for DSPIC30F6012AT-30I/PF?
The best drop-in replacement is the DSPIC30F6012A-30I/PT (same TQFP-64 10x10 footprint variant), or the DSPIC30F6011A-30I/PT which drops memory to 132 KB. For modern migration, the dsPIC33FJ64MC204-I/PT offers 16 MIPS more and 64 KB Flash but requires PCB rework due to package differences - it is not pin-to-pin compatible.
Where can I download the DSPIC30F6012AT-30I/PF datasheet PDF?
The official DSPIC30F6012AT-30I/PF datasheet is available as a 222-page PDF on the Microchip website at ww1.microchip.com (document number 70149g). The datasheet covers the dsPIC30F6011A/6012A/6013A/6014A family. Microchip also publishes a Family Reference Manual and section-specific peripheral libraries (16-bit) supporting the device.
Where can I find the DSPIC30F6012AT-30I/PF pinout?
The DSPIC30F6012AT-30I/PF pinout for the 64-TQFP package is documented in the manufacturer datasheet (pages 17-19 typically, per Microchip dsPIC30F6011A/6012A family datasheet 70149g). The datasheet lists all 64 pins with each pin's multiplexed function across PWM, ADC, CAN, I2C, SPI, UART, and general-purpose I/O.
What are the key specifications of the DSPIC30F6012AT-30I/PF that engineers should know?
The DSPIC30F6012AT-30I/PF is a 16-bit DSC running at 30 MIPS from a 4.5V to 5.5V supply, with 144 KB Flash, 8 KB SRAM, 4 KB EEPROM, 16 channels of 12-bit ADC, 6 PWM outputs, and CAN/I2C/SPI/UART connectivity in a 64-TQFP package. It targets industrial motor control and power conversion with a -40C to +85C operating range.
Can the DSPIC30F6012A-30I/PT replace the DSPIC30F6012AT-30I/PF?
The DSPIC30F6012A-30I/PT (TQFP-64 10x10) cannot directly replace the DSPIC30F6012AT-30I/PF (TQFP-64 14x14) without PCB rework because the body size and thermal pad differ. For drop-in PCB-level replacement, use the DSPIC30F6012AT-30I/PT which shares the same 14x14 TQFP-64 package, differing only in tape-and-reel orientation suffix.

Engineering reference data for DSPIC30F6012AT-30I/PF — comparison, design guidance, and compliance information.

Selection Guide

Choose the DSPIC30F6012AT-30I/PF when you need 144 KB Flash and 8 KB SRAM for three-phase motor control or digital power conversion in a 64-pin TQFP 14x14 mm industrial-rated package. Choose the DSPIC30F6012A-30I/PF if you need the same die in tray packaging for prototype assembly. Choose the DSPIC30F6011A-30I/PF if 132 KB Flash is sufficient and you need the slightly lower price. Migrate to the DSPIC30F6014A-30I/PF if you need additional capture/compare peripherals. The non-A-suffix DSPIC30F6012-30I/PF is pin-compatible and electrically identical for cost-sensitive designs; verify any errata revision history before selecting.

Comparison with Alternatives

Parameter This Product DSPIC30F6012A-30I/PF DSPIC30F6011A-30I/PF DSPIC30F6013A-30I/PF DSPIC30F6014A-30I/PF DSPIC30F6012-30I/PF
Package 64-TQFP (14x14 mm) 64-TQFP (14x14 mm) - same 64-TQFP (14x14 mm) - same 64-TQFP (14x14 mm) - same 64-TQFP (14x14 mm) - same 64-TQFP (14x14 mm) - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Core dsPIC30F 16-bit DSC, 30 MIPS dsPIC30F 16-bit DSC, 30 MIPS dsPIC30F 16-bit DSC, 30 MIPS dsPIC30F 16-bit DSC, 30 MIPS dsPIC30F 16-bit DSC, 30 MIPS dsPIC30F 16-bit DSC, 30 MIPS
Flash 144 KB 144 KB 132 KB 132 KB 144 KB 144 KB
SRAM 8 KB 8 KB 6 KB 8 KB 8 KB 8 KB
EEPROM 4 KB 4 KB 4 KB 2 KB 4 KB 4 KB
ADC 16 ch / 12 bit / 200 ksps 16 ch / 12 bit / 200 ksps 16 ch / 12 bit / 200 ksps 16 ch / 12 bit / 200 ksps 16 ch / 12 bit / 200 ksps 16 ch / 12 bit / 200 ksps
PWM 6 channels, 16-bit 6 channels, 16-bit 6 channels, 16-bit 8 channels, 16-bit 8 channels, 16-bit 6 channels, 16-bit
Supply Voltage 4.5 V to 5.5 V 4.5 V to 5.5 V 4.5 V to 5.5 V 4.5 V to 5.5 V 4.5 V to 5.5 V 4.5 V to 5.5 V
AEC-Q100 Not qualified Not qualified Not qualified Not qualified Not qualified Not qualified

Key Differentiators

  • Highest Flash density in 6011A/6012A/6013A/6014A family at this pin count (vs DSPIC30F6011A-30I/PF)
  • Tape-and-reel packaging suffix for high-volume SMT assembly (vs DSPIC30F6012A-30I/PF)
  • Wider industrial temperature range than commercial-grade dsPIC30F5011 (vs DSPIC30F5011-30I/PT)

Design Notes

Decouple each VDD pin with a 0.1 uF X7R ceramic placed within 2 mm of the pin, and add a bulk 10 uF aluminum-polymer or ceramic per VDD pair. Place a ferrite bead between VDD and AVDD to isolate ADC noise from the digital supply; bypass AVDD with both 10 uF and 0.1 uF ceramic to the same analog ground. The 5.5 V absolute maximum requires no LDO if the system rail is regulated to 5.0 V +/-5 percent, but if the upstream rail can spike above 5.5 V add a clamping TVS or series Schottky diode. Estimated worst-case supply current is approximately 200 mA with all peripherals active at 30 MIPS, leaving 800 mA headroom on a typical 1 A regulator.

The 64-pin TQFP (14x14 mm, 0.5 mm pitch) requires PCB design rules per IPC-2221: 0.15 mm trace width with 0.15 mm spacing, 0.1 mm via drill, and a continuous ground pour under the device. Keep analog traces (AN0-AN15, VREF+/-, AVDD) on one side of the package and noisy digital signals (PWM, OSC) on the opposite side; never cross analog and digital traces. Stitch the perimeter ground pour with 0.5 mm vias on a 2 mm pitch to suppress common-mode radiation. The exposed thermal pad (if used) connects to VSS internally - do not connect it to a separate thermal pad for heat-sinking purposes; if used, tie it to the analog ground plane directly under the device.

Do not exceed 5.5 V on any supply pin, even during load-dump or hot-plug transients - this is the most common cause of DSPIC30F6012A field failures. The MCLR pin requires a 10 kohm pull-up to VDD; leaving it floating or with insufficient filtering prevents the device from exiting reset reliably. When using the ADC, configure the channel-to-PWM synchronization registers correctly or you will sample at the wrong point in the switching period, producing systematic measurement errors up to 10 percent. Finally, do not enable the on-chip analog op-amps before the AVDD rail is fully settled; this can cause input-output instability and latch-up.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS compliant per Microchip product page. Halogen-free per JEDEC JS709. Not AEC-Q100 qualified - industrial-grade only. The -I suffix indicates -40C to +85C industrial operating range per Microchip device nomenclature.

Data verified on: 2026-09-22 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology DSPIC30F6012A DSPIC30F6012AT-30I/PF DSPIC30F6011A-30I/PF DSPIC30F6013A-30I/PF DSPIC30F6014A-30I/PF dsPIC30F Digital Signal Controller DSC MCU DSP modified Harvard architecture TQFP TQFP-64 RoHS AEC-Q100 JEDEC J-STD-020 field-oriented control FOC BLDC motor PMSM motor PFC CAN 2.0B ADC 12-bit PWM module EEPROM industrial temperature range
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