DSPIC33FJ128GP804-E/ML - 16-bit DSC 40 MIPS 128KB Flash | Microchip
부품 번호: DSPIC33FJ128GP804-E/ML ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
DSPIC33FJ128GP804-E/ML 개요
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and ease of use of a microcontroller. Within the power-management hierarchy, the dsPIC33F family sits alongside Microchip's PIC24H 16-bit MCU line, sharing the same core architecture and pinout philosophy, so migration between PIC24F, dsPIC30F and dsPIC33F devices is seamless.
Key features include the 16-bit dsPIC33F CPU with single-cycle multiply and hardware divide support, 8-channel DMA, seven timers, and Peripheral Pin Select (PPS), which allows most digital peripherals to be remapped to any of a large number of package pins - a major advantage for PCB layout optimization. The GP (general purpose) variant includes advanced analog and audio-oriented peripherals such as ADC modules and serial interfaces (UART, SPI, I2C) suited for signal-chain integration.
Architecturally, the device uses CMOS technology with a modified Harvard architecture, two operational loop accumulators, and DSP instruction support including MAC operations. The -E suffix denotes the extended operating temperature grade, while /ML indicates the 44-terminal QFN (PQCC) surface-mount package.
Typical applications include industrial control and automation, digital power conversion, sensor signal conditioning, and motor-adjacent general purpose embedded systems that benefit from DSP-class math in a small 8x8 mm footprint.
A key design consideration is the 44-QFN thermal pad: connect the exposed pad to a ground pour with an array of vias to improve heat dissipation and signal integrity, and verify PPS mapping early in firmware development.
This page synthesizes distributor inventory data, drop-in family alternatives, and practical design guidance not consolidated in the manufacturer datasheet.
드롭인 대체품: DSPIC33FJ128GP804-E/ML — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33FJ128GP804-E/ML (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Operating Temperature, Package, RoHS Status, DMA Channels.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33FJ128GP804-I/ML
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$8.9 / 개
데이터시트 보기 →DSPIC33FJ64GP804-E/ML
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$9.9 / 개
데이터시트 보기 →DSPIC33FJ32GP804-E/ML
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33FJ128MC804-E/ML
✅ 드롭인✓ 재고 있음
$4.05 / 개
데이터시트 보기 →DSPIC33FJ128GP804-E/ML 최대 정격 & 전기적 특성
| Core Architecture | 16-bit dsPIC33F |
| Maximum MIPS | 40 MIPS |
| Program Memory | 128 KB (128K x 8) Flash |
| Data RAM | 16 KB SRAM |
| DMA Channels | 8 |
| Timers | 7 |
| Serial I/O Ports | 3 |
| Peripheral Pin Select | Yes (PPS) |
| 동작 온도 | -40C to +125C (E grade) |
| 패키지 | 44-QFN (8x8 mm) |
| 실장 유형 | Surface Mount |
| Technology | CMOS |
| Product Status | In Production |
DSPIC33FJ128GP804-E/ML 44-qfn (8x8 mm) 핀 구성 가이드
DSPIC33FJ128GP804-E/ML(44-qfn (8x8 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33FJ128GP804-E/ML.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33FJ128GP804-E/ML 적합 용도: 6 애플리케이션s: Industrial Control and Automation, Sensor Signal Conditioning and Data Acquisition, Digital Power Conversion, Portable and Battery-Powered Instruments, Audio Signal Processing Front Ends, Motor-Adjacent General Purpose Embedded Systems.
Industrial Control and Automation
The DSPIC33FJ128GP804-E/ML fits industrial control nodes that need DSP-class arithmetic in a compact footprint: its 40 MIPS 16-bit core executes PID and filtering loops with single-cycle multiply, while 8 DMA channels offload serial and ADC data movement from the CPU. The extended -40C to +125C grade tolerates hot control cabinets near drives and power electronics, and 128 KB Flash accommodates protocol stacks plus field-updatable application code. Peripheral Pin Select lets engineers route UART, SPI and I2C functions to whatever pads the PCB layout favors, simplifying board routing in dense panels. Place the controller between a switching regulator and isolated I/O, using its timers for sequencing and watchdog functions; the main trade-off versus a plain MCU is slightly higher quiescent power in exchange for deterministic math throughput.
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Sensor Signal Conditioning and Data Acquisition
In multi-channel acquisition front ends, the GP804's DSP MAC instructions implement IIR/FIR filters and RMS computations directly on sampled data, while DMA streams ADC results to 16 KB SRAM without CPU intervention. The 40 MIPS core gives roughly 25 ns instruction cycles, enough for kHz-rate control loops with real-time filtering. The -E extended temperature rating suits sensors mounted on machinery or outdoors where ambient can exceed the standard 85C ceiling. Using PPS, designers can map the serial ports to pins that best fit connector placement, and the small 8x8 mm QFN keeps the controller close to the analog front end, shortening noisy analog traces. Trade-off: verify the exposed pad is well-grounded, as QFN thermal and ground performance depends entirely on the PCB pour.
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Digital Power Conversion
Digital power supplies and converters demand fast, deterministic control loops; the dsPIC33FJ128GP804's 40 MIPS core with hardware divide and single-cycle MAC executes compensator math at fixed sample rates, while seven timers generate precisely phased gate-drive or synchronization signals. The 128 KB Flash leaves room for soft-start routines, protection state machines and communication interfaces (UART, SPI, I2C via PPS remapping). The extended -40C to +125C rating is important because controllers often sit near hot switching stages. In a typical topology the DSC samples output voltage/current, computes the duty update, and drives gate interfaces; DMA offloads ADC buffering. Note that this GP variant lacks the MC family's dedicated high-resolution PWM - for sophisticated multi-phase motor drives, the pin-compatible dsPIC33FJ128MC804 may be the better drop-in.
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Portable and Battery-Powered Instruments
Handheld instruments benefit from the controller's 16-bit architecture balancing performance and efficiency: the 40 MIPS clock can be scaled down in low-power modes to stretch battery life, while 128 KB Flash supports menus, calibration tables and logging. The 44-QFN 8x8 mm package is compact enough for handheld PCBs yet has 0.5 mm-pitch terminations that remain hand-reviewable, unlike fine-pitch BGA alternatives. Extended temperature tolerance (-40C to +125C) protects against enclosed, sun-exposed or vehicle-mounted instruments. PPS remapping lets one PCB serve multiple product variants by relocating display and sensor interfaces in firmware rather than respinning the board. Engineers should budget the SRAM carefully, since 16 KB is ample for signal processing but modest for heavy logging buffers, complementing it with external storage over SPI.
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Audio Signal Processing Front Ends
The GP (General Purpose) family includes audio-oriented analog and serial peripherals, making the DSPIC33FJ128GP804 well suited to audio preprocessing: the DSP MAC pipeline handles equalization, level detection and echo algorithms, while DMA keeps sample streams moving between codec interfaces and memory without stalls. At 40 MIPS there is headroom for 48 kHz stereo processing with multiple biquad stages. The 44-QFN package minimizes board area behind panel connectors, and the extended temperature grade covers amplifiers in ventilated but hot enclosures. Signal-chain placement is typically between an audio codec/ADC and power amplifier, with the DSC performing filtering and gain control. Compared with a dedicated audio DSP, this part integrates general control (UI, storage, comms) on one die, reducing BOM count at the cost of lower absolute DSP throughput.
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Motor-Adjacent General Purpose Embedded Systems
Systems that supervise or communicate with a separate motor drive - conveyors, pumps, HVAC controllers - fit the GP804 well: it handles HMI, serial communication and monitoring logic at 40 MIPS, while its extended -40C to +125C rating survives the hot environment near motor windings and drives. The 128 KB Flash stores protocol stacks and logging, and PPS lets designers position CAN/UART/SPI transceiver interfaces wherever the wiring harness demands. Where the actual motor control is done on the same board, the pin-compatible dsPIC33FJ128MC804 is a firmware-level alternative with dedicated PWM peripherals - a key advantage of this shared-footprint family. Thermal design is straightforward: a solid ground pour under the QFN exposed pad suffices at the controller's power levels, but confirm junction estimates with local ambient near the drive.
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추천 제품 요약
엔지니어링 참조 데이터: DSPIC33FJ128GP804-E/ML — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33FJ128GP804-I/ML | DSPIC33FJ64GP804-E/ML | DSPIC33FJ32GP804-E/ML | DSPIC33FJ128MC804-E/ML |
|---|---|---|---|---|---|
| Package | 44-QFN (8x8) | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 128 KB | 128 KB | 64 KB | 32 KB | 128 KB |
| SRAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Maximum Performance | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS |
| Operating Temperature | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) | -40C to +125C (E) |
| Peripheral Targeting | General Purpose (GP) with advanced analog | General Purpose (GP) | General Purpose (GP) | General Purpose (GP) | Motor Control (MC) PWM |
| DMA Channels | 8 | 8 | 8 | 8 | 8 |
주요 차별점
- Extended temperature grade for hot environments (vs DSPIC33FJ128GP804-I/ML)
- Full 128 KB Flash in the smallest QFN footprint (vs DSPIC33FJ64GP804-E/ML)
- General Purpose peripheral set with advanced analog (vs DSPIC33FJ128MC804-E/ML)
설계 노트
The 44-QFN (8x8) exposed pad must be soldered to a ground plane through an array of at least 9 (3x3) thermal vias. Beyond heat dissipation, the pad is the main low-inductance ground return, and incomplete reflow here is the most common cause of erratic analog behavior in QFN dsPIC designs. Follow Microchip's QFN land-pattern guidelines in the family datasheet; use a solder-mask-defined aperture with careful paste segmentation to avoid pad floating during reflow.
Peripheral Pin Select (PPS) allows most digital peripherals (UART, SPI, I2C, input capture) to map to many RP pins. Exploit this during layout: place the crystal and analog pins first, then route PPS-mapped digital signals last. Lock your PPS map in firmware initialization before any peripheral use, and never re-map pins while peripherals are active - PPS writes during operation are a classic intermittent-failure source on dsPIC33F designs.
Estimated: the -E grade permits up to +125C ambient. Before selecting the -E part, calculate your worst-case junction: Tj ≈ Ta + Pd * theta_JA. The precise theta_JA value for the 44-QFN should be taken from the family datasheet electrical characteristics section; use the -E grade headroom conservatively when the board sits near power stages where local ambient can exceed cabinet ambient by 15-20C. If your environment never exceeds +85C, the -I/ML variant saves cost without sacrifice.
Do not confuse the /ML (44-QFN) with /PT (44-TQFP) suffixes - they are electrically identical but NOT footprint-compatible, so BOM substitutions between them require PCB rework. Also confirm operating voltage decoupling: place 100 nF ceramic capacitors at each VDD/VSS pair as close to the pins as possible. For ICSP programming, reserve MCLR, PGD and PGC header access even in production boards; PPS-mapped pins must not conflict with PGD/PGC during programming.
규정 준수 정보
Compliance status not stated in provided web data. The -E/ML suffix conventionally indicates lead-free/extended processing at Microchip, but verify RoHS and REACH status on the official Microchip product page before procurement.