DSPIC33FJ64GP804-E/ML - 16-bit DSC, 64KB Flash, 40MHz | Microchip
MPN: DSPIC33FJ64GP804-E/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $17.51 | $17.51 |
| 10 | $15.9 | $159.00 |
| 100 | $13.8 | $1,380.00 |
| 500 | $11.5 | $5,750.00 |
| 1,000 | $9.9 | $9,900.00 |
DSPIC33FJ64GP804-E/ML Overview
A Digital Signal Controller combines the computational throughput of a digital signal processor (DSP) with the peripheral integration and ease of use of a microcontroller (MCU). In the product hierarchy, the dsPIC33FJ family sits within Microchip's 16-bit architecture line, bridging general-purpose PIC24 microcontrollers and dedicated DSPs. DSCs are widely chosen when a system needs both control-loop handling and math-intensive signal processing in a single chip.
Key features of the DSPIC33FJ64GP804-E/ML include 64 KB of Flash ROM for program storage, 16 KB of on-chip SRAM, operation from a 3.0 V to 3.6 V single supply (3.3 V nominal), 21 I/O ports, and DSP engine capability for MAC-class operations. The device belongs to the dsPIC33FJ64GPX04 family (dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, dsPIC33FJ128GPX02/X04), which integrates advanced analog peripherals suited to motor control, digital power, and sensing applications.
Architecturally, the device uses a 16-bit modified Harvard core with a dedicated DSP engine, hardware multiply-accumulate (MAC) unit, and a 40 MHz clock, delivering deterministic single-cycle DSP-class math. The ALU and DSP engine allow C-compiled code plus inline DSP assembly for filters and transforms. Flash program memory supports in-circuit self-programming, and the device supports ICSP (In-Circuit Serial Programming) using any matched PGECx/PGEDx pin pair.
Typical applications include sensor signal conditioning with on-chip filtering, digital power supplies, embedded industrial control, portable instrumentation, and general-purpose DSP tasks such as audio processing and FFT-based analysis. The extended -40C to +125C range and QFN-44 surface-mount package make it suitable for harsh or thermally demanding environments.
A key design consideration: ICSP programming requires PGECx and PGEDx pins to be used strictly as pairs - if PGEC2 carries ICSPCLK, ICSPDAT must connect to PGED2. Also keep the exposed pad connected to a solid ground plane for thermal and signal-integrity performance.
This page synthesizes verified distributor data, drop-in family alternatives, and practical programming/design notes not found in the manufacturer datasheet, providing a single citable engineering reference.
Drop-in alternatives for DSPIC33FJ64GP804-E/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33FJ64GP804-E/ML (same form factor and footprint) — differing in Operating Temperature, Core Architecture, Lead Finish, Package, Package Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33FJ64GP804-I/ML
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33FJ128GP804-E/ML
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
Contact for price
View Datasheet →DSPIC33FJ128GP804-I/ML
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$8.9 / Unit
View Datasheet →DSPIC33FJ64MC804-H/ML
✅ Drop-In✓ In Stock
$4.55 / Unit
View Datasheet →DSPIC33FJ128GP204-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33FJ32MC204-I/ML
✅ Drop-In✓ In Stock
$4.37 / Unit
View Datasheet →DSPIC33FJ64GP804-E/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit DSC (dsPIC33FJ) |
| Program Memory Type | Flash |
| Flash Program Memory | 64 KB |
| SRAM | 16 KB |
| Maximum Clock Speed | 40 MHz |
| Supply Voltage Range | 3.0 V to 3.6 V |
| Nominal Supply Voltage | 3.3 V |
| I/O Ports | 21 |
| Operating Temperature | -40C to +125C (extended, E suffix) |
| Package Type | QFN-44 (8x8 mm), lead-free plastic, exposed pad |
| Mounting Type | Surface Mount |
| Programming Interface | ICSP (PGECx/PGEDx pin pairs) |
| Life Cycle Stage | Active (In Production) |
| Lead Finish | Lead-free |
| Product Family | dsPIC33FJ64GPX04 |
| RoHS Status | Compliant (lead-free package per datasheet listing) |
DSPIC33FJ64GP804-E/ML qfn-44 (8x8 mm), lead-free plastic, exposed pad Pin Configuration Guide
Pin configuration for DSPIC33FJ64GP804-E/ML (qfn-44 (8x8 mm), lead-free plastic, exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33FJ64GP804-E/ML.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33FJ64GP804-E/ML is suitable for 6 applications: Sensor Signal Conditioning and Data Acquisition, Digital Power Supplies, Industrial Control and Automation, Audio Signal Processing, Portable and Battery-Powered Instrumentation, Motor-Adjunct Control and Sensing.
Sensor Signal Conditioning and Data Acquisition
The DSPIC33FJ64GP804-E/ML fits sensor-conditioning nodes because its 16-bit DSP engine executes single-cycle MAC operations for digital filtering (IIR/FIR), offset correction, and calibration math at a 40 MHz clock, while on-chip advanced analog peripherals digitize sensor outputs without an external ADC in many designs. In a typical topology, the sensor front end feeds the integrated analog inputs, the DSP engine applies notch or averaging filters, and results stream out over UART/SPI/I2C. The 16 KB SRAM buffers multi-channel acquisition windows, and the 64 KB Flash holds firmware plus calibration tables. The extended -40C to +125C range suits industrial sensor housings.
Recommended
Digital Power Supplies
Digital power converters benefit from the DSPIC33FJ64GP804-E/ML's deterministic 16-bit core and DSP engine: compensation loops (type-III, PI) execute in a few microseconds at 40 MHz, and its advanced analog peripherals support voltage/current feedback sampling for closed-loop control of buck, boost, or PFC stages. The GP804 variant is used where the controller also handles housekeeping tasks such as sequencing, telemetry over I2C/SMBus, and fault logging in its 64 KB Flash. The 3.0-3.6 V supply integrates cleanly with low-voltage logic rails, and the QFN-44 exposed pad grounds directly to the power ground plane, aiding noise performance in switching environments.
Recommended
Industrial Control and Automation
In factory automation nodes, the DSPIC33FJ64GP804-E/ML provides 21 I/O ports for driving relays, reading limit switches, and interfacing with encoders, while the DSP engine offloads tasks such as vibration analysis or periodic FFT health checks. The extended -40C to +125C rating tolerates panel enclosures near drives and heaters, and the 3.3 V logic interfaces directly with industrial transceivers through external CAN/RS-485 PHYs. The 64 KB Flash accommodates protocol stacks and field-updatable firmware via ICSP or self-programming. Fail-safe design benefits from watchdog and brown-out features standard in the dsPIC33FJ architecture.
Recommended
Audio Signal Processing
The DSPIC33FJ64GP804-E/ML handles embedded audio tasks - active noise cancellation, audio effects, tone generation, and acoustic sensing - using its single-cycle MAC unit for real-time FIR/IIR filtering at 40 MHz. The 16 KB SRAM sustains several milliseconds of sample buffering at typical 8-48 kHz sample rates, and the GP-family analog inputs support microphone biasing and signal capture. Unlike a dedicated audio DSP, the DSC also manages user interface, protocol, and power-management duties in the same chip, reducing BOM count. The 8x8 mm QFN-44 keeps the design compact for portable and head-unit-adjacent applications.
Recommended
Portable and Battery-Powered Instrumentation
Handheld instruments use the DSPIC33FJ64GP804-E/ML because a single 3.3 V rail powers the controller, its 16-bit architecture executes measurement math quickly enough to allow short active duty cycles, and low-power sleep/idle modes of the dsPIC33FJ family extend battery life between measurements. The 21 I/O ports drive a display, keypad, and buzzer simultaneously, while the DSP engine processes ADC samples from probe front ends. The 8x8 mm QFN-44 footprint conserves board area, and the 64 KB Flash stores multi-scale calibration tables. The extended temperature grade adds robustness for field instruments used outdoors.
Recommended
Motor-Adjunct Control and Sensing
While the MC-family sister part is purpose-built for motors, the DSPIC33FJ64GP804-E/ML serves as a motor-adjunct controller: it supervises start/stop sequencing, monitors temperature and current feedback through its analog inputs, performs vibration signature analysis with the DSP engine, and communicates drive status over serial links. The extended -40C to +125C rating matches the thermal environment near motor windings and drives. Where the application needs dedicated high-resolution PWM motor peripherals, footprint-compatible DSPIC33FJ64MC804 variants in the same 44-pin QFN allow a PCB-level family swap without respin.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33FJ64GP804-E/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33FJ64GP804-I/ML | DSPIC33FJ128GP804-E/ML | DSPIC33FJ64MC804-H/ML | DSPIC33FJ128GP204-I/ML | DSPIC33FJ32MC204-I/ML |
|---|---|---|---|---|---|---|
| Package | QFN-44 (8x8 mm) | QFN-44 (8x8 mm) - same | QFN-44 (8x8 mm) - same | QFN-44 (8x8 mm) - same | QFN-44 (8x8 mm) - same family | QFN-44 (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 64 KB | 64 KB | 128 KB | 64 KB | 128 KB | 32 KB |
| Clock Speed | 40 MHz | 40 MHz | 40 MHz | 40 MHz (H grade option) | 40 MHz | 40 MHz |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Peripheral Emphasis | General Purpose (GP) | General Purpose (GP) | General Purpose (GP) | Motor Control (MC) | General Purpose (GP) | Motor Control (MC) |
| Lifecycle Status | Active (In Production) | Active | Active | Active | Active | Active |
Key Differentiators
- Extended temperature range in the 804 package (vs DSPIC33FJ64GP804-I/ML)
- Cost-efficient 64 KB Flash midpoint (vs DSPIC33FJ128GP804-E/ML)
- General-purpose analog/DSP balance (vs DSPIC33FJ64MC804-H/ML)
- Trade-off: no verified cross-brand drop-in exists (vs Competing 16-bit DSCs (TI C2000, Renesas RX))
Design Notes
The QFN-44 (8x8 mm) package has an exposed pad underneath the die that must be soldered to a grounded copper pad on the PCB. Use an array of thermal vias (typically 3x3 or 4x4 grid) connecting the pad to internal ground planes to reduce thermal resistance and improve ground integrity. Design the footprint per Microchip's recommended QFN land pattern with solder-mask-defined openings slightly smaller than the package pads to prevent solder bridging between the 0.5 mm pitch leads.
ICSP programming requires PGECx and PGEDx pins to be used strictly as matched pairs, per the device documentation: if PGEC2 carries ICSPCLK, then ICSPDAT must connect to PGED2. Mixing pins from different pairs is a common cause of programming failures. Route the chosen PGEC/PGED pair to a programming header with series resistors (about 100 ohm) and keep traces short. Also avoid driving the MCLR pin externally during normal operation without proper isolation from the programmer.
Supply the device from a clean 3.0 V to 3.6 V rail (3.3 V nominal). Place 100 nF ceramic decoupling capacitors at each VDD/VSS pin pair, as close to the pins as possible, plus one bulk capacitor (4.7 uF to 10 uF) near the supply entry. Digital switching of the 40 MHz core and DSP engine creates supply transients; a solid ground plane tied to the exposed pad keeps ground bounce low. Verify brown-out/reset settings so transient sags during motor or relay switching do not corrupt Flash.
Estimated: for a worst-case power estimate, assume core plus I/O current of roughly 50-80 mA at 3.3 V (0.17-0.26 W). The QFN-44 exposed pad with a proper via array to ground plane keeps the junction well within the -40C to +125C extended rating in most ambient conditions; without the exposed pad soldered, thermal resistance rises substantially and the extended-temperature advantage is lost. Always verify with Microchip thermal modeling data in the family datasheet for your exact stack-up.
Compliance Information
Package described as lead-free plastic QFN per digchip specification listing ('QFNL, Other, 8 X 8 MM, LEAD FREE, PLASTIC, QFN-44'); RoHS compliance inferred from lead-free package designation. REACH, halogen-free, and conflict-minerals status not stated in provided data.
