EP1C3T144C6N - Cyclone 2910-LE FPGA, 144-pin TQFP | Intel
부품 번호: EP1C3T144C6N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $21.97 | $21.97 |
| 10 | $19.78 | $197.80 |
| 100 | $16.48 | $1,648.00 |
| 500 | $13.86 | $6,930.00 |
| 1,000 | $11.94 | $11,940.00 |
EP1C3T144C6N 개요
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs sit in the programmable logic device (PLD) hierarchy above simple PLDs and CPLDs because they contain programmable logic blocks, programmable interconnects, and configurable I/O cells. The Cyclone family specifically targets low-cost, high-volume applications where ASIC-like performance is needed without the NRE costs of an ASIC.
Key features include 2910 logic elements, 59904 bits of embedded memory, 104 user I/O pins, and 13 embedded 18x18 multipliers for DSP functions. The part supports configuration via serial configuration devices or JTAG, and includes phase-locked loops for clock management. Operating temperature range spans 0C to +85C in the commercial grade (C6 speed grade) variant.
The Cyclone I architecture uses a 4-input lookup table (LUT) per logic element, embedded memory blocks (M4K) configurable as RAM, ROM, or FIFO, and dedicated multiplier blocks for digital signal processing. The 130 nm process delivers low static power consumption while still supporting high toggle rates, and the TQFP-144 package provides easy prototyping with standard solder reflow processes.
Typical applications include industrial control logic, consumer electronics glue logic, video processing pipelines, communications protocol bridging, and educational FPGA development platforms. Its combination of moderate logic density and low unit cost makes it well-suited for moderate-complexity glue logic and low-volume ASIC replacement designs.
When designing with this device, plan for an external configuration device (EPCS) or JTAG programmer. The TQFP-144 footprint allows hand-soldering and breadboard-style prototyping on through-hole adapter boards, which is ideal for lab and educational work. For new designs, however, consider newer Cyclone IV or Cyclone V families because Cyclone I is in mature lifecycle and may carry supply constraints.
This page consolidates distributor pricing, drop-in package alternatives, and design guidance not found in the manufacturer datasheet alone, helping engineers quickly evaluate the EP1C3T144C6N for both new designs and legacy board repair.
드롭인 대체품: EP1C3T144C6N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1C3T144C6N (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Speed Grade, Configuration Method, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1C3T144C6
✅ 드롭인✓ 재고 있음
$17.32 / 개
데이터시트 보기 →EP1C3T144C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$16.2 / 개
데이터시트 보기 →EP1C3T144C8N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$14.1 / 개
데이터시트 보기 →EP1C3T144I6N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP1C4T144C6N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP1C6T144C6N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$18.85 / 개
데이터시트 보기 →EP1C3T144C6N 최대 정격 & 전기적 특성
| Family | Cyclone I |
| Logic Elements | 2910 |
| Total Memory Bits | 59904 |
| User I/Os | 104 |
| Number of LABs/CLBs | 291 |
| Number of Logic Cells | 2910 |
| Embedded Multipliers | 13 (18x18) |
| Embedded Block RAM (M4K) | 13 blocks |
| Maximum Operating Frequency | 405.2 MHz |
| Process Technology | 130 nm |
| Core Voltage | 1.5 V |
| 패키지 | 144-pin TQFP (T144) |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0C to +85C (commercial) |
| Speed Grade | C6 |
| PLLs | Yes (on-chip) |
| Configuration Method | Serial / JTAG |
EP1C3T144C6N 144-pin tqfp (t144) 핀 구성 가이드
EP1C3T144C6N(144-pin tqfp (t144) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1C3T144C6N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1C3T144C6N 적합 용도: 6 애플리케이션s: Industrial Glue Logic Replacement, Video Timing and Display Controller, Communications Protocol Bridging, DSP / FIR Filter Acceleration, FPGA Education and Prototyping Boards, Legacy Board Repair and ASIC Replacement.
Industrial Glue Logic Replacement
The EP1C3T144C6N is well-suited for industrial glue-logic replacement applications because it integrates 2910 logic elements, 13 embedded 18x18 multipliers, and 104 user I/Os into a single TQFP-144 device, replacing multiple 74-series TTL or CMOS chips on legacy boards. The 130 nm Cyclone I architecture delivers proven industrial reliability, while the on-chip PLLs provide flexible clock synthesis for interfacing with asynchronous industrial buses. Its commercial 0C to +85C temperature range covers most factory-floor enclosures. Compared to a CPLD, the FPGA offers far more flexibility and DSP capability for tasks like motor-control PWM generation, sensor-signal conditioning, and protocol conversion.
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Video Timing and Display Controller
The EP1C3T144C6N handles VGA/DVI timing generation and LCD backplane control thanks to its 2910 logic elements plus 13 dedicated 18x18 multipliers, sufficient to drive a 640x480@60 Hz timing controller and a basic video overlay engine. The 104 user I/Os accommodate 24-bit RGB plus sync and clock lines, while the 59904 bits of embedded M4K memory can hold frame buffers for small still-image overlays. The Cyclone I on-chip PLL generates precise pixel clocks from a low-cost reference oscillator. For lower-resolution displays or character LCD controllers, the EP1C3's logic density is more than adequate, making it a cost-effective glue-logic FPGA for kiosk displays and industrial HMIs.
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Communications Protocol Bridging
The EP1C3T144C6N fits protocol-bridging applications (UART-to-SPI, I2C-to-parallel, RS-232-to-USB) because its 2910 logic elements can implement multiple soft IP cores simultaneously, while the 13 hardware multipliers accelerate any CRC or scrambling functions needed by the bridge. The 104 user I/Os give enough pins for multiple bus interfaces, and the on-chip M4K memory blocks act as FIFOs between asynchronous clock domains. The 1.5 V core plus 3.3 V I/O design makes it easy to bridge legacy 3.3 V peripherals to modern 1.8 V or 1.5 V ASICs. For new designs, however, a newer Cyclone IV / V device with hardened IP is recommended.
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DSP / FIR Filter Acceleration
The EP1C3T144C6N is suitable for moderate-complexity DSP tasks such as audio FIR filters, simple FFT pipelines, and motor-control d-q transforms because it integrates 13 embedded 18x18 multipliers, each capable of a 250 MHz multiply-accumulate cycle. The 59904 bits of M4K memory (roughly 13 blocks x 4 Kbit) provides coefficient storage and line-delay buffers for 64-tap FIR filters at audio rates. The on-chip PLL allows the DSP core to run at a higher internal frequency than the I/O domain, simplifying the interface to ADC/DAC peripherals. Compared with a software DSP on a microcontroller, the FPGA offers deterministic latency and parallel processing at low unit cost.
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FPGA Education and Prototyping Boards
The EP1C3T144C6N is a long-standing favorite for FPGA education and university teaching labs because its 144-pin TQFP package supports hand-soldering and breadboard adapter use, while the 2910 LE density exercises meaningful design examples without overwhelming students. The T144 footprint is supported by a wide range of low-cost Altera/Intel Cyclone I development boards (e.g. Terasic DE0, older Altera dev kits). Quartus II Web Edition (free) supports the EP1C3T144C6N, giving students access to schematic entry, Verilog/VHDL, and the SignalTap logic analyzer. For undergraduate digital-design and computer-architecture courses, this part remains a reliable, low-cost platform.
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Legacy Board Repair and ASIC Replacement
The EP1C3T144C6N is widely used for legacy board repair and ASIC replacement because it can drop into existing Cyclone I board designs whose original part has gone obsolete. With 2910 LE, 104 I/O, and a TQFP-144 footprint, it is a direct substitute for the smaller Cyclone I variants (EP1C3 family only) and offers functional compatibility with most EP1C4/EP1C6 designs that were under-utilized. The Cyclone I design toolchain (Quartus II 13.0sp1 or earlier) preserves the original RTL source code. For boards that originally used a Cyclone I but the die is now obsolete, sourcing remaining EP1C3T144C6N stock from authorized distributors keeps legacy equipment running without a redesign.
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추천 제품 요약
엔지니어링 참조 데이터: EP1C3T144C6N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1C3T144C6 | EP1C3T144C7N | EP1C3T144C8N | EP1C3T144I6N | EP1C4T144C6N | EP1C6T144C6N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-pin TQFP (T144) | 144-pin TQFP (T144) - same | 144-pin TQFP (T144) - same | 144-pin TQFP (T144) - same | 144-pin TQFP (T144) - same | 144-pin TQFP (T144) - same | 144-pin TQFP (T144) - same |
| Logic Elements | 2910 | 2910 | 2910 | 2910 | 2910 | 4000 | 5980 |
| User I/Os | 104 | 104 | 104 | 104 | 104 | 104 | 104 |
| Embedded Multipliers (18x18) | 13 | 13 | 13 | 13 | 13 | 17 | 20 |
| Total Memory Bits | 59904 | 59904 | 59904 | 59904 | 59904 | 78336 | 92160 |
| Speed Grade | C6 | C6 | C7 | C8 | I6 | C6 | C6 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Industrial (-40C to +100C) | Commercial | Commercial |
주요 차별점
- Pin-compatible lead-free variant (vs EP1C3T144C6 (without N suffix))
- Industrial temperature variant available in same package (vs EP1C3T144I6N)
- Higher-density upgrade within TQFP-144 footprint (vs EP1C4T144C6N)
설계 노트
The EP1C3T144C6N requires two supplies: VCCINT (1.5 V core, 1.425-1.575 V tolerance) and VCCIO (3.3 V I/O, 3.0-3.6 V tolerance). Decoupling recommendation per the Cyclone I handbook: place one 0.1 uF ceramic plus one 10 uF tantalum or ceramic bulk capacitor near every VCCINT pin, plus one 0.1 uF ceramic and one 4.7 uF bulk capacitor near every VCCIO pin. A PLL power pin (VCC_PLL) requires its own filtered 1.5 V supply with a ferrite bead to isolate PLL switching noise from the core logic.
The 144-pin TQFP package has 0.5 mm pitch leads, which is fine for standard reflow soldering but requires careful PCB land pattern and solder-paste stencil design. Use a 4 mil (0.1 mm) stencil aperture and lead-free SAC305 solder for production boards. Hand-soldering the TQFP-144 is feasible with a fine-tip iron and flux pen but is recommended only for prototypes and repairs; production runs should use reflow. Provide a continuous ground plane on layer 2 for return-current paths and EMI suppression.
Assign user I/O banks in Quartus II before PCB layout: bank 1 typically powers VCCIO1, bank 2 VCCIO2, bank 3 VCCIO3, etc. Mixing 3.3 V and 2.5 V peripherals requires at least two VCCIO rails; mixing 1.8 V requires three. Place JTAG chain pins (TCK, TMS, TDI, TDO) on a 0.1-inch header for programming access. Dedicated clock input pins (CLK0, CLK1, CLK2, CLK3) should be routed to a low-skew clock source or oscillator, with a series 33 ohm damping resistor if the trace is longer than 25 mm.
Estimated - confirm against the Cyclone I device errata before final design: a common pitfall is failing to power-down unused PLL blocks, which adds 10-30 mA of quiescent current. In Quartus II, set unused PLLs to 'Powered Down' under Device and Pin Options. Another pitfall is leaving the nCONFIG pin floating; it must be pulled high to VCCIO via a 10 kohm resistor to ensure clean configuration startup. For JTAG configuration, ensure the JTAG chain is properly terminated with a 1 kohm pull-up on TCK and a 1 kohm pull-up on TMS per IEEE 1149.1.
For DDR or source-synchronous interfaces (e.g. video, parallel ADC), match data and clock trace lengths to within 50 mils (1.27 mm) on the PCB. Use 50 ohm controlled-impedance traces for clock and high-speed data lines, with a continuous reference ground plane beneath. Series damping resistors (22-33 ohm) on clock outputs can reduce overshoot. Avoid routing LVDS-like signals over split power planes; keep the return path under the trace at all times. For SSRAM or SDRAM interfaces, add source-termination resistors to damp reflections.
규정 준수 정보
Lead-free terminal finish confirmed by N suffix per the verified distributor data. RoHS, REACH, halogen-free, and conflict-mineral status not explicitly stated in the provided web data and marked unknown. AEC-Q100 not applicable (FPGA is not an automotive-qualified IC in the traditional AEC-Q100 sense; refer to Intel PSG automotive-grade part numbers for AEC-Q100 qualified FPGAs).
