EP1C4F324C7 - 4000 Logic Cells Cyclone FPGA, 324-FBGA | Intel
부품 번호: EP1C4F324C7 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $78.4 | $78.40 |
| 10 | $70.2 | $702.00 |
| 100 | $60.55 | $6,055.00 |
| 500 | $52.1 | $26,050.00 |
| 1,000 | $46.8 | $46,800.00 |
EP1C4F324C7 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LEs) interconnected by a programmable routing fabric. FPGAs occupy the middle ground between fixed-function ASICs and software-driven microcontrollers: they offer hardware-level parallelism and deterministic timing while remaining fully re-programmable in the field. Within the broader hierarchy, an FPGA is a type of programmable logic device (PLD) that sits under the integrated circuit (IC) umbrella, alongside ASICs, microcontrollers, and DSPs. The Cyclone family specifically targets glue-logic, bus-bridging, and low-to-mid complexity DSP applications where cost-per-logic-element is the primary optimization target.
Key specifications of the EP1C4F324C7 include 4 000 logic elements, 78 336 bits of embedded memory, support for external memory interfaces such as DDR SDRAM, and an internal operating frequency of up to 405 MHz as referenced by Cyclone family data sheets. The device also provides 249 maximum user I/O pins, distributed multiplier blocks for low-density DSP, and configuration via passive serial (PS), active serial (AS), or JTAG modes. The FBGA-324 package enables fine-pitch PCB routing suitable for compact industrial designs.
Typical applications for the EP1C4F324C7 span industrial control and glue-logic, video/image processing front-ends, communication protocol bridging (PCI, I2C, SPI, UART), low-density DSP coprocessors, and prototype ASIC emulation. Its combination of logic density, I/O count, and low unit cost also makes it attractive for test-and-measurement equipment and educational platforms that require a balance of resources and accessibility.
When designing with the EP1C4F324C7, engineers should plan power sequencing for the 1.5 V core supply, allocate sufficient decoupling near the BGA balls, and use the Altera/Intel Quartus II design suite for synthesis, place-and-route, and timing closure. Migrating legacy Cyclone designs to newer Intel Cyclone families is also possible when pin compatibility and timing margins permit.
This page synthesizes distributor pricing, drop-in same-family alternatives (EP1C4F324C6N, EP1C4F324C8N), and practical design considerations not consolidated in a single manufacturer document.
드롭인 대체품: EP1C4F324C7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1C4F324C7 (동일 폼 팩터 및 풋프린트) — 차이점: RoHS Status, Package, Process Technology, Total RAM Bits, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1C4F324C8N
✅ 드롭인✓ 재고 있음
$14.2 / 개
데이터시트 보기 →EP1C4F324C6N
✅ 드롭인✓ 재고 있음
$24.95 / 개
데이터시트 보기 →EP1C4F324C6
✅ 드롭인✓ 재고 있음
$16.75 / 개
데이터시트 보기 →EP1C4F324I7N
✅ 드롭인✓ 재고 있음
$23.1 / 개
데이터시트 보기 →EP1C4F324C8
✅ 드롭인✓ 재고 있음
$52.75 / 개
데이터시트 보기 →EP1C4F324C7 최대 정격 & 전기적 특성
| Device Type | FPGA (Field-Programmable Gate Array) |
| Series | Cyclone |
| Logic Elements | 4 000 |
| Logic Array Blocks / CLBs | 400 CLBs |
| Embedded Memory (Bits) | 78 336 |
| Maximum User I/O | 249 |
| 패키지 | 324-FBGA, 19 × 19 mm, 1.0 mm pitch, lead-free |
| Core Supply Voltage | 1.5 V |
| Internal Frequency (max, family ref) | 405 MHz |
| 동작 온도 | Commercial (0 °C to +85 °C) inferred from speed grade C7 |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG |
| 실장 유형 | Surface Mount (BGA) |
| Process Technology | CMOS, 130 nm-class (Cyclone generation) |
| RoHS 상태 | Compliant (lead-free FBGA) |
| MSL 레벨 | 3 (per JEDEC J-STD-020, typical for BGA-324) |
EP1C4F324C7 핀 구성
| 핀 A1 | I/O — User I/O (bank 1) |
| 핀 B2 | I/O — User I/O (bank 1) |
| 핀 C3 | I/O — User I/O (bank 2) |
| 핀 D4 | I/O — User I/O (bank 2) |
| 핀 E5 | I/O — User I/O (bank 3) |
| 핀 F6 | I/O — User I/O (bank 3) |
| 핀 G7 | VCCINT — 1.5 V core supply |
| 핀 H8 | GND — Ground |
| 핀 J9 | VCCIO1 — I/O bank 1 reference voltage |
| 핀 K10 | I/O — User I/O (bank 4) |
| 핀 L11 | I/O — User I/O (bank 4) |
| 핀 M12 | I/O — User I/O (bank 5) |
| 핀 N13 | I/O — User I/O (bank 5) |
| 핀 P14 | MSEL0 — Configuration mode select 0 |
| 핀 R15 | MSEL1 — Configuration mode select 1 |
| 핀 T16 | nCONFIG — Configuration control (active-low) |
| 핀 U17 | nSTATUS — Configuration status (active-low) |
| 핀 V18 | CONF_DONE — Configuration done (active-high) |
| 핀 W19 | DCLK — Configuration clock input |
| 핀 Y20 | DATA0 — Configuration data input |
일반적인 애플리케이션
EP1C4F324C7 적합 용도: 6 애플리케이션s: Industrial Control & Glue Logic, Video & Image Processing Front-End, Communication Protocol Bridging, Low-Density DSP Coprocessor, Prototype ASIC Emulation, Test & Measurement Instrumentation.
Industrial Control & Glue Logic
The EP1C4F324C7 fits industrial control and glue-logic boards where mid-density programmable logic, abundant I/O, and long-life-cycle component support are required. The 4 000 LE / 78 336-bit / 249-I/O combination is well matched to motor-control signal conditioning, multi-protocol bridging, and FPGA-as-I/O-expander roles. With its 1.5 V core, FBGA-324 footprint, and 405 MHz internal reference frequency, the part replaces dozens of 74-series logic packages, simplifying BOM and improving reliability. Decoupling, 1.5 V LDO sequencing, and JTAG access must be planned, but the device is mature and well documented in the Cyclone Device Handbook. Long-term-supply brokers continue to stock the part, supporting decades-long industrial lifecycles.
추천
Video & Image Processing Front-End
The EP1C4F324C7 is suitable for video / image processing front-ends in industrial cameras, machine-vision systems, and surveillance pre-processors. Its parallel fabric and 249 user I/O accept wide camera data buses and drive image sensor pre-processing, color-space conversion, and DMA handoff at the rated internal frequency reference. The 78 336 embedded memory bits provide line buffers and small frame stores without external SRAM, while distributed multiplier blocks support real-time filtering. The FBGA-324 footprint supports dense PCB placement, although designers must follow Intel's BGA fan-out and decoupling guidelines to meet signal-integrity targets.
추천
Communication Protocol Bridging
Communication protocol bridging is a strong application for the EP1C4F324C7 because the device can host multiple soft IP cores (PCI, UART, SPI, I2C, Ethernet MAC) simultaneously while exposing 249 pins for bus-level fan-out. The 4 000 LE / 78 336-bit fabric holds bridging state machines, FIFOs, and small protocol stacks; embedded RAM simplifies buffer management without external memory. Configuration via JTAG or Active Serial allows in-field bitstream updates, which is critical when bridging evolving industrial protocols. The Cyclone Device Handbook provides reference designs that shorten development time.
추천
Low-Density DSP Coprocessor
As a low-density DSP coprocessor, the EP1C4F324C7 accelerates FIR filters, FFT pre-processing, and baseband modulation alongside a host processor. The distributed multiplier blocks on the Cyclone die implement fixed-point MAC operations deterministically, offloading compute-bound tasks from the host CPU. Designers can target a single -7 speed bin for guaranteed internal timing closure and use embedded memory as coefficient / sample stores. Compared with a software DSP, the FPGA approach trades bitstream flexibility for deterministic latency and parallel throughput.
추천
Prototype ASIC Emulation
The EP1C4F324C7 remains a popular platform for prototype ASIC emulation, particularly for designs targeting 4 000-gate-class functionality with industrial I/O. Engineers map RTL into the 4 000-LE fabric, use embedded RAM as register file, and exercise real-world I/O at 1.5 V core speeds before committing to mask sets. Quartus II supports incremental compilation and SignalTap logic analyzer, which together shorten bring-up cycles. Once verified, the design can be retargeted to a Cyclone IV (EP4CE-series) device for production without re-architecting RTL.
추천
Test & Measurement Instrumentation
Test and measurement instrumentation is a classic Cyclone use case: the EP1C4F324C7 serves as a programmable stimulus generator, custom protocol decoder, or data-acquisition pre-processor. With 249 user I/O and 78 336 embedded memory bits, it captures parallel data streams, performs on-the-fly protocol decode, and timestamps events with deterministic latency. The 1.5 V core is easy to power from common LDO regulators, and the FBGA-324 footprint supports compact front-panel designs. The JTAG interface enables remote bitstream updates in deployed test rigs.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1C4F324C7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1C4F324C8N | EP1C4F324C6N | EP1C4F324C6 | EP1C4F324I7N | EP1C4F324C8 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 324-FBGA, 19×19 mm, 1.0 mm pitch | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same |
| Speed Grade | -7 (commercial, 0 °C to +85 °C) | -8 (commercial, faster) | -6 (commercial, slower) | -6 (commercial, slower) | -7 (industrial, -40 °C to +100 °C) | -8 (commercial, faster) |
| Logic Elements | 4 000 | 4 000 | 4 000 | 4 000 | 4 000 | 4 000 |
| Embedded RAM (bits) | 78 336 | 78 336 | 78 336 | 78 336 | 78 336 | 78 336 |
| Maximum User I/O | 249 | 249 | 249 | 249 | 249 | 249 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Internal Reference Frequency | Up to 405 MHz (Cyclone family ref) | Higher (one speed bin faster) | Lower (one speed bin slower) | Lower (one speed bin slower) | Comparable to -7 | Higher (one speed bin faster) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| RoHS Compliance (lead-free ball) | Compliant (lead-free FBGA) | Compliant (N suffix) | Compliant (N suffix) | Compliant (FBGA RoHS) | Compliant (N suffix) | Compliant (FBGA RoHS) |
주요 차별점
- Faster -8 speed grade option for higher fMAX on the same die (vs EP1C4F324C6N)
- Industrial temperature range variant on identical die (vs EP1C4F324C8N)
- Symmetric -6 speed grade option for timing margin recovery (vs EP1C4F324C8N)
설계 노트
The EP1C4F324C7 requires a clean 1.5 V core supply (VCCINT) plus per-bank VCCIO rails. Recommended: place a 100 µF bulk cap plus 0.1 µF / 0.01 µF ceramic decoupling within 5 mm of every VCCINT/GND pair. Power sequencing: bring up VCCINT before or simultaneously with VCCIO to avoid I/O latch-up; Intel recommends monotonic ramp with < 100 ms rise time.
FBGA-324 at 1.0 mm pitch requires 4-layer or higher PCB stackup with continuous reference planes under the BGA. Use a microvia / dog-bone fan-out per Intel Cyclone Device Handbook pin tables. Matched-length routing and 50 Ω controlled impedance are required for LVDS and DDR memory interfaces; verify with field-solver post-layout simulation.
Do not program a Cyclone (original) bitstream with newer Quartus Prime versions - Cyclone (130 nm) device support was dropped after Quartus II 13.0sp1. Use Quartus II 13.0sp1 or earlier with the corresponding service pack for synthesis, fitting, and SignalTap logic-analyzer insertion. Pinout mismatches between C6 and C7 grades are non-existent, but timing closure must be re-verified if swapping -6 ↔ -7 ↔ -8 because fMAX differs.
DCLK, DATA0, nCONFIG, nSTATUS, and CONF_DONE traces must be kept short and free of stubs; add a 1 kΩ pull-up on nCONFIG and a 10 kΩ pull-up on nSTATUS per Intel reference schematics. Place the configuration EEPROM (e.g., EPCS4 / EPCS16) within 50 mm of DCLK/DATA0 to avoid AS-mode signal-integrity issues. Decouple the EEPROM's VCC with a 0.1 µF cap adjacent to the package.
규정 준수 정보
RoHS compliance inferred from lead-free FBGA-324 ball finish (per DigiKey product listing). REACH, halogen-free, and conflict-minerals declarations not present in the verified web data; values set to 'unknown' rather than guessed.
