EP1C4F324I7 - Cyclone FPGA 4K LE 324-FBGA Industrial | Intel / Altera
부품 번호: EP1C4F324I7 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.2 | $382.00 |
| 100 | $34.1 | $3,410.00 |
| 500 | $30.55 | $15,275.00 |
| 1,000 | $27.8 | $27,800.00 |
EP1C4F324I7 개요
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic function is defined by user configuration rather than by hard-wired masks. FPGAs sit in the broader programmable logic device (PLD) hierarchy, alongside CPLDs, and above fixed-function ASICs in flexibility but below them in unit cost at very high volumes. The Cyclone family was Altera's first low-cost SRAM-based FPGA line, designed to compete with Xilinx Spartan-3 in glue logic, control, and mid-density DSP/protocol bridging applications.
Key features include 4,000 logic elements organized into 400 logic array blocks (LABs), 78 Kbits of M4K embedded memory blocks, 17 embedded 18x18 hardware multipliers suited for DSP, two PLLs for clock synthesis and de-skew, and 249 user I/O pins supporting LVDS, LVTTL, LVCMOS, SSTL, and PCI I/O standards. Single-ended I/O rates up to 640 Mbps and LVDS up to 567 Mbps are documented. Configuration is supported via active serial (AS), passive serial (PS), and JTAG modes.
The EP1C4F324I7 uses a 4-input look-up table (LUT) based logic element architecture with a switched routing fabric and embedded memory columns, all backed by SRAM configuration cells that require a configuration device (such as the EPCS1/EPCS4 serial flash) for power-up bitstream loading. The 130 nm process and 1.5 V core balance static power versus performance, and the FBGA-324 FineLine BGA package exposes the full user-I/O count while keeping the footprint compact at 19x19 mm.
Typical applications include industrial control and motor drive signal conditioning, telecom line-card glue logic and protocol bridging (TDM-to-I2S, UART bridging), low-cost video processing and display controllers, automotive infotainment prototypes, and educational/development boards where a low-cost mid-density FPGA is required. Engineers also commonly use this device in PCI target designs because of its 3.3 V PCI-compliant I/O support.
When designing with the EP1C4F324I7, ensure that all four PLL supply pins (VCCA_PLL) are decoupled with a separate filtered 1.5 V rail and that the JTAG chain shares a robust TMS/TCK pull-up scheme to avoid configuration errors. The exposed die pad (if present) should be soldered to a grounded thermal copper pour to reduce junction temperature and improve long-term reliability, especially when most of the 17 multipliers are active simultaneously.
드롭인 대체품: EP1C4F324I7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1C4F324I7 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Process Technology, RoHS Status, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1C4F324C8N
✅ 드롭인✓ 재고 있음
$14.2 / 개
데이터시트 보기 →EP1C4F324C8L
✅ 드롭인✓ 재고 있음
$59.5 / 개
데이터시트 보기 →EP1C4F324C7N
✅ 드롭인✓ 재고 있음
$25.75 / 개
데이터시트 보기 →EP1C4F324C6N
✅ 드롭인✓ 재고 있음
$24.95 / 개
데이터시트 보기 →EP1C4F324C7
✅ 드롭인✓ 재고 있음
$46.8 / 개
데이터시트 보기 →EP1C4F324C6
✅ 드롭인✓ 재고 있음
$16.75 / 개
데이터시트 보기 →EP1C4F324I7 최대 정격 & 전기적 특성
| Series | Cyclone |
| Family | Cyclone I |
| Logic Elements | 4,000 |
| Logic Array Blocks (LABs) | 400 |
| Total RAM Bits | 78,336 |
| Embedded 18x18 Multipliers | 17 |
| User I/O Pins | 249 |
| PLLs | 2 |
| Process Technology | 130 nm |
| Core Supply Voltage | 1.5 V |
| I/O Supply Voltage | 3.3 V |
| Internal Clock Frequency (max) | 405 MHz |
| 동작 온도 | -40C to +85C (Industrial) |
| 패키지 | 324-FBGA (FineLine BGA), 19x19 mm, 1.0 mm pitch |
| 실장 유형 | Surface Mount |
| Configuration Mode | AS / PS / JTAG |
| RoHS 상태 | Lead Free (per datasheet marking) |
EP1C4F324I7 324-fbga (fineline bga), 19x19 mm, 1.0 mm pitch 핀 구성 가이드
EP1C4F324I7(324-fbga (fineline bga), 19x19 mm, 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1C4F324I7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1C4F324I7 적합 용도: 6 애플리케이션s: Industrial Motor Control and PLC Logic, Telecom Line-Card Glue Logic and Protocol Bridging, Low-Cost Video Processing and Display Controllers, PCI Target / Add-in Card Designs, Educational FPGA Development and Prototyping, Automotive Infotainment Prototyping.
Industrial Motor Control and PLC Logic
The EP1C4F324I7 fits industrial PLC and motor-drive front-end logic because of its 4,000 logic elements, 17 hardware 18x18 multipliers for field-oriented control (FOC) math, and industrial -40C to +85C rating. The 249 user I/O pins accept 24 V opto-isolated feedback signals through external level shifters, while the 405 MHz PLL clock drives encoder sampling at 80 MHz with 12.5 ns resolution. Two PLLs allow independent clock synthesis for the control loop and a separate EtherCAT or RS-485 management interface, simplifying board partitioning. The 130 nm 1.5 V core draws roughly 200 mW at typical utilization, manageable without a heatsink in a sealed IP65 enclosure.
추천
Telecom Line-Card Glue Logic and Protocol Bridging
Telecom line cards use the EP1C4F324I7 to bridge TDM/E1 streams to packet backplanes and to fan out control signals to framer ASICs. The 78 Kbits of M4K RAM buffers small protocol frames without external SRAM, while 249 I/O pins expose ample LVTTL/LVCMOS connections to multiple PHY devices. LVDS support up to 567 Mbps enables direct interconnect to serializer/deserializer chips without external transceivers. The 1.5 V core and 130 nm process give stable thermal behavior in 1U/3U line cards where airflow is constrained, and the JTAG port allows in-system firmware updates during carrier deployment.
추천
Low-Cost Video Processing and Display Controllers
The EP1C4F324I7 is widely used in low-cost video format converters, LCD timing controllers, and surveillance DVR front-ends. Its 4,000 logic elements handle VGA-to-DVI timing conversion, basic de-interlacing, and on-screen display overlay, while the 17 hardware 18x18 multipliers accelerate 3x3 video scaling kernels in real time at 60 fps. The 249 I/O pins expose 24-bit RGB plus control signals to drive QVGA/WVGA panels directly. DDR SDRAM support through the dedicated DQS pins enables frame-buffer memory up to 64 MB, large enough for 800x600 at 16 bpp. Industrial temperature grade ensures reliable operation in outdoor kiosks and digital signage.
추천
PCI Target / Add-in Card Designs
The EP1C4F324I7 supports 3.3 V PCI-compliant I/O directly through its I/O banks, making it a popular choice for legacy PCI target cards in industrial PCs and test equipment. The 4,000 logic elements implement PCI target state machines, custom register maps, and modest DMA logic without external logic. The 324-FBGA package exposes all 249 user I/O pins plus dedicated JTAG, allowing PCI bus plus local bus plus interrupt logic on a single device. Configuration via JTAG supports in-system firmware updates in deployed field units, and the industrial temperature rating covers factory floor installations.
추천
Educational FPGA Development and Prototyping
University digital-design labs and engineering prototyping environments rely on the EP1C4F324I7 because it offers enough logic (4,000 LE) for full RISC-V soft cores, SDRAM controllers, and VGA generation at very low unit cost. The 324-FBGA package is easy to fan out on a 4-layer development board, and the 130 nm 1.5 V core runs cool at typical student workloads. The Quartus II Web Edition (free) supports the Cyclone I family, giving students professional-grade synthesis, place-and-route, and SignalTap logic analysis without license fees. Industrial temperature grade is overkill for classroom use but harmless and provides headroom for senior project prototypes.
추천
Automotive Infotainment Prototyping
Automotive Tier-1 suppliers use the EP1C4F324I7 for prototyping infotainment head-unit controllers, CAN-to-Ethernet gateways, and rear-seat entertainment systems before committing to AEC-Q100 qualified parts. The 17 hardware 18x18 multipliers accelerate audio codec operations, while 249 I/O pins support multiple CAN bus interfaces, MOST network connections, and RGB display outputs. LVDS support enables direct connection to automotive LCD panels without external bridge chips. The industrial -40C to +85C rating covers cabin environments; engine-bay applications require AEC-Q100 qualified variants such as the Cyclone IV E automotive grade, but for lab and pre-production prototypes the EP1C4F324I7 is a cost-effective choice.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1C4F324I7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1C4F324C8N | EP1C4F324C8L | EP1C4F324C7N | EP1C4F324C6N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 324-FBGA, 19x19 mm, 1.0 mm pitch | 324-FBGA, 19x19 mm, 1.0 mm pitch - same | 324-FBGA, 19x19 mm, 1.0 mm pitch - same | 324-FBGA, 19x19 mm, 1.0 mm pitch - same | 324-FBGA, 19x19 mm, 1.0 mm pitch - same |
| Logic Elements | 4,000 | 4,000 | 4,000 | 4,000 | 4,000 |
| Embedded RAM (bits) | 78,336 | 78,336 | 78,336 | 78,336 | 78,336 |
| User I/O Pins | 249 | 249 | 249 | 249 | 249 |
| Speed Grade | I7 (industrial) | C8 (commercial, higher Fmax) | C8 (commercial, lead-free) | C7 (commercial) | C6 (commercial) |
| Operating Temperature | -40C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
| 18x18 Hardware Multipliers | 17 | 17 | 17 | 17 | 17 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
주요 차별점
- Industrial temperature grade at the same price tier (vs EP1C4F324C8N)
- Highest-speed commercial grade for performance-critical designs (vs EP1C4F324C6N)
- Mid-density Cyclone I sweet spot with maximum I/O count (vs EP1C3T144I7N)
설계 노트
The EP1C4F324I7 requires a clean 1.5 V ±5% core supply on VCCINT and a separate filtered 1.5 V rail on each VCCA_PLL pin (4 pins total) to prevent PLL jitter. Use a ferrite bead or pi-filter between the digital 1.5 V and PLL analog 1.5 V. I/O banks can run at 3.3 V, 2.5 V, 1.8 V, or 1.5 V independently, but unused banks should still be powered to a valid VCCIO to avoid floating inputs causing I/O leakage. A typical design with 50% LE utilization draws around 200-300 mA from VCCINT.
The 324-FBGA package uses 1.0 mm ball pitch in a 22x22 grid with depopulated corners. Use a 4-layer PCB stack-up with continuous GND plane under the device and at least 4 vias per GND ball to a solid ground pour for thermal dissipation. All JTAG signals (TCK, TMS, TDI, TDO) should be pulled up to VCCIO of the configuration bank through 10 kohm resistors. Place the EPCS configuration flash within 25 mm of the FPGA DATA0/DCLK/nCS pins and route the AS configuration traces with 50 ohm characteristic impedance.
Do not leave any VCCINT ball floating; the device will not configure reliably with even a single missing core supply. Avoid mixing 5 V input signals directly into LVCMOS 3.3 V I/O - use external resistor dividers or level shifters, as the absolute maximum input voltage on a 3.3 V I/O is 4.0 V. When using the LVDS I/O, match trace lengths within 150 mils and maintain 100 ohm differential impedance. Always re-run TimeQuest timing analysis after changing speed grade, because I7 and C8 have different timing margins even on the same RTL.
규정 준수 정보
RoHS and lead-free per Altera/Intel material declaration. Industrial temperature grade but NOT AEC-Q100 qualified; for AEC-Q100 automotive applications use the equivalent part from the automotive-grade Cyclone family. REACH SVHC compliance maintained through standard Intel product stewardship program.
