EP1C4F324C6 - Cyclone FPGA 4K LE 324-BGA | Intel / Altera
부품 번호: EP1C4F324C6 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $24.95 | $249.50 |
| 100 | $21.2 | $2,120.00 |
| 500 | $18.4 | $9,200.00 |
| 1,000 | $16.75 | $16,750.00 |
EP1C4F324C6 개요
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device built from an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated I/O and memory resources. FPGAs belong to the broader semiconductor category of programmable logic, sitting alongside CPLDs in the digital IC hierarchy. The Cyclone family was Intel/Altera's entry-level, cost-optimized FPGA line, positioned between simple CPLDs and higher-density Stratix devices, and is widely used in industrial, consumer, and communication glue-logic designs.
Key features of the EP1C4F324C6 include 4,000 logic elements (LEs), 78,336 bits of embedded RAM (organized as M4K blocks), two phase-locked loops (PLLs) for clock management, support for LVDS, LVTTL, LVCMOS, SSTL, and PCI I/O standards, and 249 maximum user I/O pins. The device operates from a 1.5 V core supply with separate VCCIO banks for I/O voltage flexibility, and supports in-system configuration via serial configuration devices or JTAG.
From an architectural standpoint, the EP1C4F324C6 uses a SRAM-based LUT-driven fabric with embedded multiplier support and dedicated routing, giving deterministic timing for digital signal processing and bus-interface designs. Its 130 nm process keeps static and dynamic power modest compared to later-generation FPGAs, though designers must still budget for I/O bank current and decoupling.
Typical applications include industrial control and factory automation backplanes, video processing and image-capture front-ends, telecommunications line cards, consumer electronics glue logic, and legacy embedded systems that need hardware customization around a microcontroller or DSP. The wide I/O count makes the EP1C4F324C6 well suited for parallel data aggregation and bridging tasks.
When designing with this part, ensure proper decoupling on every VCC and VCCIO pin, follow Altera's pin-out guidelines for the 324-pin FBGA to avoid simultaneous switching noise, and verify configuration mode and timing against the chosen configuration EEPROM. Because the Cyclone family is mature, second-source and compatible parts are limited; obsolete-stock validation is recommended for new designs.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the original manufacturer datasheet, helping engineers shorten the selection cycle for cost-sensitive FPGA-based designs.
드롭인 대체품: EP1C4F324C6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1C4F324C6 (동일 폼 팩터 및 풋프린트) — 차이점: RoHS Status, Package, Process Technology, Total RAM Bits, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1C4F324C7N
✅ 드롭인✓ 재고 있음
$25.75 / 개
데이터시트 보기 →EP1C4F324C8N
✅ 드롭인✓ 재고 있음
$14.2 / 개
데이터시트 보기 →EP1C4F324I7N
✅ 드롭인✓ 재고 있음
$23.1 / 개
데이터시트 보기 →EP1C6F324C6
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1C4F324C6 최대 정격 & 전기적 특성
| Manufacturer | Intel (formerly Altera) |
| Series | Cyclone |
| Logic Elements (LE) | 4,000 |
| Total RAM Bits | 78,336 |
| Maximum User I/O | 249 |
| PLLs | 2 |
| Process Technology | 130 nm |
| Core Voltage (VCCINT) | 1.5 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Maximum Internal Frequency | 405.2 MHz |
| Package Type | 324-ball FineLine BGA (FBGA) |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0C to +85C (commercial, C6 suffix) |
| Configuration Method | Serial / JTAG |
| RoHS 상태 | Compliant |
EP1C4F324C6 324-ball fineline bga (fbga) 핀 구성 가이드
EP1C4F324C6(324-ball fineline bga (fbga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1C4F324C6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1C4F324C6 적합 용도: 6 애플리케이션s: Industrial Control and Factory Automation Backplanes, Video Processing and Image-Capture Front-Ends, Telecommunications Line Cards and Protocol Bridging, Consumer Electronics Glue Logic and Custom Interfacing, Legacy Embedded Systems and Microcontroller Co-Processors, Test and Measurement Instrumentation Front-Ends.
Industrial Control and Factory Automation Backplanes
The EP1C4F324C6 fits industrial control backplanes because its 4,000 LEs and 78,336 RAM bits handle glue-logic, motor-control signal conditioning, and protocol bridging (RS-485, CAN, Modbus) at a low unit cost. With 249 user I/O pins in the 324-ball FBGA, it can aggregate parallel sensor arrays and drive multiple isolated buses simultaneously. Cyclone I's deterministic timing and JTAG-based in-field reprogramming simplify factory-floor firmware updates, while the 1.5 V core keeps power dissipation modest for enclosed cabinets. Designers should pair the FPGA with industrial-grade surrounding components and respect the 0C to +85C commercial temperature envelope, migrating to EP1C4F324I7N for harsh environments.
추천
Video Processing and Image-Capture Front-Ends
The EP1C4F324C6's wide I/O count and 78,336 bits of embedded RAM make it well suited for video pipeline front-ends that bridge parallel CMOS sensors to back-end processors. Its M4K RAM blocks can buffer scan lines, perform simple pixel manipulation, and handle ITU-R BT.656 timing extraction in real time. The 405 MHz maximum internal frequency supports standard-definition and entry-level HD video rates. Compared with a DSP, the FPGA gives deterministic latency for frame capture, and the 324-ball FBGA exposes enough pins to ingest 16-bit parallel video plus auxiliary control signals. Designers must pay attention to I/O bank VCCIO assignments to keep image-data integrity clean.
추천
Telecommunications Line Cards and Protocol Bridging
Telecom line cards frequently use Cyclone I FPGAs like the EP1C4F324C6 for protocol bridging between TDM buses, Ethernet MACs, and backplane fabrics. The two on-chip PLLs generate multiple clock domains needed for E1/T1, I2S, and SPI interfaces simultaneously. With 249 user I/O pins, designers can expose dozens of LVDS or LVTTL channels while keeping board area small. The 130 nm process keeps static current low enough for densely-populated line cards, and the Quartus II toolchain provides pre-built IP for UART, I2C, and SPI cores. Note that telecom OEMs typically require the industrial-temp EP1C4F324I7N rather than the C6 commercial variant.
추천
Consumer Electronics Glue Logic and Custom Interfacing
The EP1C4F324C6 is widely used in consumer electronics as glue logic between application processors, displays, audio codecs, and peripheral buses. The 4K LE fabric is large enough to implement I2S, SPDIF, I2C, UART, and GPIO-expansion bridges in a single device, replacing dozens of discrete logic ICs and shrinking BOM cost. The 324-ball FBGA's 1.0 mm pitch suits modern consumer-PCBs with controlled-impedance routing. With the commercial 0C to +85C temperature range, the C6 variant is ideal for set-top boxes, A/V receivers, and gaming peripherals. Designers should verify long-term supply before committing new SKUs because Cyclone I is end-of-life at Intel.
추천
Legacy Embedded Systems and Microcontroller Co-Processors
Embedded systems often pair a microcontroller with the EP1C4F324C6 to offload timing-critical or parallel tasks such as PWM generation, quadrature decoding, or custom bus protocols. The 4K LE fabric and 78,336 RAM bits give enough headroom for state machines and small FIFOs without consuming the MCU's cycles. The 324-ball FBGA's wide I/O count is valuable when the FPGA must replicate or extend the MCU's peripheral set. Designers gain deterministic hardware timing and a re-programmable platform that survives firmware iterations. Use the JTAG chain to co-debug the MCU and FPGA, and reuse the Quartus II SignalTap logic analyzer for hardware verification.
추천
Test and Measurement Instrumentation Front-Ends
Test and measurement gear relies on the EP1C4F324C6 for high-speed pattern generation, custom timing, and protocol-aware triggering. The two PLLs synthesize precise clock edges needed for TDR, BERT, and arbitrary waveform generation, while the 249 user I/O pins drive or sample many channels in parallel. The 78,336 bits of embedded RAM hold pre-computed stimulus patterns and capture buffers, offloading the host CPU. Compared with an ASIC, the FPGA's in-field reprogramming lets test vendors add new protocols without respinning the board. Keep VCCIO banks separate for analog and digital sections to avoid crosstalk, and use the Quartus II TimeQuest analyzer for setup/hold closure.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1C4F324C6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1C4F324C7N | EP1C4F324C8N | EP1C4F324I7N | EP1C6F324C6 |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 324-ball FBGA | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same |
| Logic Elements | 4,000 LEs | 4,000 LEs | 4,000 LEs | 4,000 LEs | 6,000 LEs |
| Embedded RAM | 78,336 bits | 78,336 bits | 78,336 bits | 78,336 bits | 92,160 bits |
| User I/O | 249 | 249 | 249 | 249 | 249 |
| Speed Grade | -6 | -7 (faster) | -8 (fastest) | -7 | -6 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) |
| PLLs | 2 | 2 | 2 | 2 | 2 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Commercial temperature grade at speed grade -6 (vs EP1C4F324I7N)
- 4K LE Cyclone I fabric in compact 324-ball FBGA (vs EP1C6F324C6)
- Drop-in speed-grade upgrade path on same footprint (vs EP1C4F324C8N)
설계 노트
Estimated: at 1.5 V core with 4,000 LEs active, quiescent VCCINT current is roughly 300-500 mA; VCCIO current depends on switching activity and I/O bank voltage. Provide at least 10uF bulk plus 0.1uF decoupling per VCC/VCCIO pin pair, and place them within 100 mils of the BGA balls. Use a low-noise LDO or switching regulator with output ripple under 30 mVpp on the 1.5 V rail because the 1.5 V core is sensitive to supply noise. For the EP1C4F324C6's commercial-temp C6 suffix, derate VCCINT to 1.425 V minimum at high ambient.
The 324-ball FineLine BGA uses a 1.0 mm pitch and requires 4-6 layer PCB stack-up with microvia or via-in-pad for breakout. Reference the Cyclone I device handbook for escape routing and matched-length pairs. Provide a solid ground plane under the FPGA and stitch vias around the BGA perimeter to suppress simultaneous switching noise on the 249 user I/O balls. Thermal vias under the package improve heat spreading because the C6 commercial variant is rated for 0C to +85C without active cooling.
Do not confuse the EP1C4F324C6 commercial 0C-85C part with the EP1C4F324I7N industrial -40C-100C variant - they share the same ball map but differ in temperature envelope. Always check the last two characters of the suffix before assembly. The 'C' speed grade is -6; faster 'C7' and 'C8' suffixes exist in the same package. For new designs, avoid Cyclone I entirely because it is end-of-life at Intel and migrate to Cyclone IV E or Cyclone 10 LP for long-term supply assurance.
규정 준수 정보
RoHS and REACH compliance per Altera/Intel product page for Cyclone family FPGAs. Not AEC-Q100 qualified because this is a commercial-grade FPGA. Halogen-free and conflict-minerals status not explicitly stated in the provided data.
