Intel

EP1C4F324C8 - Cyclone FPGA 4000 Cells, 249 I/O, 324-FBGA | Intel

부품 번호: EP1C4F324C8 ⚠ 최종 구매

재고 있음 영업일 기준 1~3일 내 발송

1.5 V Vdss FBGA-324, 19 mm x 19 mm, 1.0 mm pitch Package 405.2 MHz Speed

시작가 $52.75 USD / 개

MOQ: 1 |

가격 업데이트: 2026-09-06

볼륨 가격

수량	단가	합계
1	$78.5	$78.50
10	$72	$720.00
100	$65.4	$6,540.00
500	$58.9	$29,450.00
1,000	$52.75	$52,750.00

ℹ️ 모든 가격은 USD 기준입니다

데이터시트 보기 (PDF) 대체품 보기

수량

EP1C4F324C8 개요

The Intel EP1C4F324C8 is a Cyclone® series Field Programmable Gate Array (FPGA) featuring 4,000 logic elements, 78,336 RAM bits, and 249 user I/Os, housed in a 324-ball FineLine BGA (FBGA-324) package measuring 19 mm x 19 mm with a 1.0 mm ball pitch. The device is fabricated on a 130 nm CMOS process and operates from a 1.5 V core supply with a maximum internal clock frequency of up to 405 MHz. The 'C8' suffix denotes the commercial speed grade 8 device in the Cyclone family.

An FPGA (Field Programmable Gate Array) is a type of integrated circuit that contains an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells, allowing hardware designers to implement custom digital logic functions after manufacturing. FPGAs sit in the programmable logic hierarchy between ASICs (custom-fabricated) and CPLDs (smaller, non-volatile), offering the highest logic density and richest feature set for prototyping and low-to-mid volume production. The Cyclone family is positioned as Intel's (formerly Altera's) low-cost, high-volume FPGA line for cost-sensitive applications.

Key features of the EP1C4F324C8 include 4,000 logic elements distributed across 249 user I/Os, 78,336 bits of embedded RAM organized as M4K memory blocks, and support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device integrates dedicated 18 x 18 hardware multipliers and Phase-Locked Loops (PLLs) for clock management, enabling DSP and high-speed interface implementations. The 324-FBGA package exposes sufficient user I/O for parallel data buses and high-pin-count peripheral interfaces.

The Cyclone FPGA architecture combines a fine-grained logic array with embedded memory columns and DSP blocks, all interconnected via a multi-level routing hierarchy. The 130 nm CMOS process balances cost and performance, making the device suitable for consumer, industrial, and communications applications where power and cost matter more than the highest possible performance. The device supports configuration via passive serial, active serial, and JTAG modes.

Typical applications for the EP1C4F324C8 include digital signal processing, video bridging and display controllers, industrial control and motor drives, telecommunications line cards, embedded controllers, and glue-logic consolidation. Its 324-pin BGA footprint and 249 user I/Os make it well-suited for designs requiring multiple parallel interfaces such as memory buses, video ports, and high-speed serial links when used with external transceivers.

When designing with the EP1C4F324C8, ensure proper decoupling with 0.1 uF and 10 uF capacitors near each power pin and that all unused I/Os are tied to a defined logic level through software attributes. JTAG chain integrity should be verified before relying on in-system programming, and the FBGA-324 land pattern requires precise PCB fabrication tolerances due to the 1.0 mm ball pitch.

This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes for the EP1C4F324C8 that supplement the manufacturer datasheet with sourcing and engineering context.

드롭인 대체품: EP1C4F324C8 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EP1C4F324C8 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Process Technology, RoHS Status, Total RAM Bits, Package.

EP1C4F324C6

Intel

Operating Temperature: 0C to +85C (commercial, C6 suffix)

Process Technology: 130 nm

RoHS Status: Compliant

비교 대상: EP1C4F324C8 →

EP1C4F324C6N

Intel

Operating Temperature: 0C to +85C (commercial)

Process Technology: 130 nm

Total RAM Bits: 78,336

비교 대상: EP1C4F324C8 →

EP1C4F324C7

Intel

Operating Temperature: Commercial (0 °C to +85 °C) inferred from speed grade C7

Process Technology: CMOS, 130 nm-class (Cyclone generation)

RoHS Status: Compliant (lead-free FBGA)

비교 대상: EP1C4F324C8 →

EP1C4F324C7N

Intel

Operating Temperature: 0C to +85C (commercial)

Process Technology: 0.13 um SRAM-based CMOS

RoHS Status: Compliant (lead-free FBGA)

비교 대상: EP1C4F324C8 →

EP1C4F324C8L

Altera

Operating Temperature: 0 C to 85 C (Commercial)

Package: 324-ball FBGA (FineLine BGA)

✅ 드롭인

Intel

📦 FBGA-324

Intel (formerly Altera) · Cyclone · 4,000 · 78,336 · 249 · 2 · 130 nm

✓ 재고 있음

$16.75 / 개

데이터시트 보기 →

EP1C4F324C8 최대 정격 & 전기적 특성

Family	Cyclone
Logic Elements	4,000
Logic Blocks (LEs / LABs)	4000 cells / 249 LABs
Total RAM Bits	78,336 bits
User I/Os	249
Maximum Internal Frequency	405.2 MHz
Speed Grade	C8 (commercial, speed grade 8)
Process Technology	130 nm CMOS
Core Supply Voltage	1.5 V
패키지	FBGA-324, 19 mm x 19 mm, 1.0 mm pitch
실장 유형	Surface Mount (BGA)
Operating Temperature Grade	Commercial (0 C to +85 C)
Configuration Modes	Passive Serial, Active Serial, JTAG
Embedded Multipliers	18 x 18 hardware multipliers
Clock Management	PLLs integrated
RoHS 상태	Compliant (per Alldatasheet package description)

EP1C4F324C8 fbga-324, 19 mm x 19 mm, 1.0 mm pitch 핀 구성 가이드

EP1C4F324C8(fbga-324, 19 mm x 19 mm, 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

EP1C4F324C8의 fbga-324, 19 mm x 19 mm, 1.0 mm pitch 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: EP1C4F324C8.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

EP1C4F324C8 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Bridge and Display Controller, Telecommunications Line Card Glue Logic, Embedded Controller and Glue Logic Consolidation, Digital Signal Processing Front-End, Prototyping and Education Platform.

🏭

Industrial Motor Control

The EP1C4F324C8's 4,000 logic elements and 249 user I/Os in a 324-FBGA package make it a strong fit for multi-axis industrial motor control boards that need to consolidate PWM generation, encoder decoding, and fieldbus glue logic in one device. With 18 x 18 hardware multipliers and embedded M4K RAM blocks, the Cyclone device can host closed-loop control loops at several kHz update rates while leaving headroom for safety and diagnostics. The 1.5 V core and commercial temperature range fit cabinet-mounted industrial environments.

추천

📺

Video Bridge and Display Controller

With 4,000 logic elements, dedicated 18 x 18 multipliers, and 249 user I/Os, the EP1C4F324C8 is well-suited to bridge legacy video formats (BT.656, VGA, LVDS) to modern flat-panel interfaces in industrial and medical displays. The 324-FBGA package exposes enough pins for parallel RGB, LVDS pairs, and control I2C/SPI buses without multiplexing. The Cyclone PLL block generates pixel clocks at common video rates, while M4K memory blocks serve as line buffers and color lookup tables.

추천

EP1C12F324C8N · Altera EP1C20F400C8N · Intel

🌐

Telecommunications Line Card Glue Logic

The EP1C4F324C8 is a proven solution for telecom line-card glue logic, where its 249 user I/Os and 324-FBGA footprint can address multiple E1/T1 framers, UARTs, and bus-conversion interfaces in a single device. The 1.5 V core, combined with flexible I/O voltage standards (LVTTL, LVCMOS, HSTL, SSTL) supported by Cyclone, makes it compatible with legacy 3.3 V and modern 1.8 V ASICs on the same board. JTAG-based in-system programmability eases board bring-up and field upgrades.

추천

EP1C6Q240C8N · Altera EP1C20F400C8N · Intel

🔧

Embedded Controller and Glue Logic Consolidation

Designers use the EP1C4F324C8 to replace multiple 74-series glue-logic packages, CPLDs, and small bus-conversion ASICs with a single programmable device, reducing PCB area and BOM cost. With 4,000 LEs and 78,336 RAM bits, the Cyclone FPGA can implement custom register interfaces, address decoding, bus bridges (e.g., ISA to local bus), and timing generators. The 249 user I/Os accommodate address, data, and control signals for 8/16/32-bit external buses.

추천

EP1C3T100C8N · Intel EP1C12Q240C8N · Intel

🎧

Digital Signal Processing Front-End

The EP1C4F324C8's 18 x 18 hardware multipliers and M4K RAM blocks enable implementation of FIR filters, FFT engines, and digital downconverters at modest sample rates in DSP front-end subsystems. At the C8 speed grade, the 405 MHz internal frequency supports 100+ MHz DSP pipelines for audio and baseband processing. The 324-FBGA package provides enough I/O for parallel ADC/DAC interfaces and serial LVDS data links.

추천

EP1C20F400C8N · Intel EP1C12F324C8N · Altera

🖥️

Prototyping and Education Platform

Universities and engineering labs use the EP1C4F324C8 on Cyclone development boards as a platform for teaching digital design, RTL synthesis, and embedded systems. The 4,000-LE capacity is large enough for student projects including RISC-V soft cores, video processing pipelines, and custom peripherals, but small enough to fit within Quartus II Web Edition's free license. The 324-FBGA package exposes abundant I/O for breadboard-friendly daughtercards.

추천

EP1C3T144C8N · Altera EP1C6Q240C8N · Altera

추천 제품 요약

EP1C20F400C8N Intel 사용처: Industrial Motor Control, Video Bridge and Display Controller, Telecommunications Line Card Glue Logic, Digital Signal Processing Front-End EP1C12Q240C8N Intel 사용처: Industrial Motor Control, Embedded Controller and Glue Logic Consolidation EP1C12F324C8N Altera 사용처: Video Bridge and Display Controller, Digital Signal Processing Front-End EP1C6Q240C8N Altera 사용처: Telecommunications Line Card Glue Logic, Prototyping and Education Platform EP1C3T100C8N Intel 사용처: Embedded Controller and Glue Logic Consolidation EP1C3T144C8N Altera 사용처: Prototyping and Education Platform

What is the logic capacity of EP1C4F324C8?

The EP1C4F324C8 contains 4,000 logic elements (LEs) and 78,336 bits of embedded RAM organized as M4K memory blocks, with 249 user I/Os. According to the Altera Cyclone Family datasheet, the device is fabricated on a 130 nm CMOS process and is intended for cost-sensitive digital logic integration. The 4,000-LE capacity places it in the lower-density tier of the Cyclone family, suitable for glue-logic and modest DSP tasks.

What package does EP1C4F324C8 use?

The EP1C4F324C8 is housed in a 324-ball FineLine BGA (FBGA-324) package measuring 19 mm x 19 mm with a 1.0 mm ball pitch. Per the manufacturer datasheet, this 1.0 mm-pitch BGA exposes 249 user I/Os and requires PCB fabrication tolerances compliant with IPC-7351 BGA land pattern guidelines. The package is lead-free and RoHS compliant per the manufacturer's package marking convention.

What is the maximum operating frequency of EP1C4F324C8?

The EP1C4F324C8 supports a maximum internal clock frequency of 405.2 MHz at the C8 speed grade. The Cyclone family datasheet specifies the C8 speed grade as the slowest commercial grade in the family, so designs targeting higher performance should consider C7, C6, or lower-numbered speed grades. The actual achievable frequency depends on the routing path, logic depth, and I/O standard selected.

Where can I buy EP1C4F324C8 online?

The EP1C4F324C8 is available from authorized distributors including DigiKey (where it is listed under stock code 703751) and from specialty FPGA distributors like Jotrin, Lisleapex, and FPGAX that focus on long-term supply for aerospace, automotive, industrial, and defense sectors. As of 2026-09-06, prices on the secondary market reflect last-time-buy status; obtain a current quote for production volumes.

What is the price of EP1C4F324C8?

As of 2026-09-06, the EP1C4F324C8 unit price is approximately USD 78.50 at qty 1, with tier pricing dropping to about USD 52.75 at qty 1000. Pricing reflects the device's last-time-buy status and limited authorized-channel availability; quotes from specialty distributors like FPGAX may differ. Always request a fresh quote because FPGA prices on the secondary market fluctuate rapidly with remaining stock.

What is the lead time for EP1C4F324C8?

Lead time for the EP1C4F324C8 as of 2026-09-06 ranges from immediate stock (DigiKey listin ships today when in stock) to 8-12 weeks from specialty distributors supporting long-term FPGA supply chains. Because the device is in last-time-buy status with Intel/Altera, lead times typically lengthen as authorized stock depletes. Customers planning production should secure inventory or migrate to the Cyclone II or Cyclone III family.

Is EP1C4F324C8 in stock?

As of 2026-09-06, the EP1C4F324C8 is listed as in stock at DigiKey and select specialty FPGA distributors, though authorized stock is declining because the device is in last-time-buy status. Intel/Altera has transitioned mainstream Cyclone production to the Cyclone IV and Cyclone 10 LP families. For high-volume production, plan for migration or engage authorized distributors for buffer stock allocation.

What is the difference between EP1C4F324C8 and EP1C4F324C8N?

The EP1C4F324C8N is the lead-free (Pb-free) variant of the EP1C4F324C8, sharing identical silicon die, 4,000 logic elements, 78,336 RAM bits, 249 I/Os, and 324-FBGA package per the manufacturer part numbering convention. According to the ETEI comparison page, both parts share the same 1.5 V core supply and C8 speed grade. The 'N' suffix indicates compliance with lead-free assembly requirements; otherwise the parts are functionally identical drop-in replacements on the same 324-FBGA land pattern.

What is the difference between EP1C4F324C8 and EP1C4F324C6N?

The EP1C4F324C8 (speed grade 8, slowest commercial) and EP1C4F324C6N (speed grade 6, faster) differ in timing closure and maximum internal frequency per the Cyclone family datasheet speed grade definitions. Both parts share the same 4,000 logic elements, 78,336 RAM bits, 324-FBGA package, and 249 user I/Os. The C6 grade typically delivers about 15-20% higher Fmax than C8, making C6N preferable for performance-critical designs.

What is the best drop-in replacement for EP1C4F324C8?

The best drop-in replacement for the EP1C4F324C8 is the EP1C4F324C8N, which shares the identical 324-FBGA package, 4,000-LE die, and 249 user I/Os but adds lead-free assembly compliance. For designs requiring a faster speed grade, the EP1C4F324C7N (C7 grade, lead-free) and EP1C4F324C6N (C6 grade, lead-free) are pin-compatible drop-in alternatives in the same 324-FBGA footprint, all available on the XAIPART site MPN list.

When should I choose EP1C4F324C8 over EP1C4F324C6N?

Choose the EP1C4F324C8 when your design timing can close at the C8 (slowest commercial) speed grade, which is typically adequate for glue logic, slow control interfaces, and non-timing-critical glue logic. Choose the EP1C4F324C6N when you need higher Fmax for DSP pipelines, video processing, or memory interfaces operating above 100 MHz. The C8 grade is preferred when it is available and meets timing, as it is the most widely stocked and lowest-cost grade in production.

Where can I download the EP1C4F324C8 datasheet PDF?

The EP1C4F324C8 datasheet is available from the manufacturer as part of the Altera Cyclone Family Data Sheet (document C51001), which covers the entire Cyclone family. Per the AllDatasheet listing, the family datasheet is approximately 94 pages and covers EP1C3, EP1C4, EP1C6, EP1C8, EP1C12, and EP1C20 variants. Direct PDF links are maintained at the Intel Altera literature archive and the FindIC, AllDatasheet, and Octopart mirror sites.

Where can I find the EP1C4F324C8 pinout?

The EP1C4F324C8 pinout is documented in the Cyclone Family Data Sheet (C51001), specifically in the device pin tables section covering the 324-FBGA package variant. The 324-ball BGA uses a standard grid array with 19 mm x 19 mm body and 1.0 mm ball pitch. Pinout diagrams and signal-name assignments can be exported directly from the Altera/Intel Quartus II Pin Planner tool after selecting the EP1C4 device and FBGA-324 package.

What are the key specifications of EP1C4F324C8 that engineers should know?

The EP1C4F324C8 integrates 4,000 logic elements, 78,336 bits of embedded RAM (organized as M4K blocks), 249 user I/Os, 18 x 18 hardware multipliers, and PLLs on a 130 nm CMOS process running at 1.5 V core. It is housed in a 19 mm x 19 mm 324-FBGA package with 1.0 mm ball pitch, supports configuration via passive serial, active serial, or JTAG, and operates across the commercial 0 C to +85 C temperature range. The C8 suffix denotes the slowest commercial speed grade, with 405.2 MHz maximum internal frequency.

What is the equivalent Intel/Altera part for legacy designs?

For legacy Cyclone designs based on the EP1C4F324C8, the recommended migration path within the same Intel/Altera portfolio is the EP1C4F324C8N (drop-in, lead-free), EP1C4F324C7N (drop-in, faster C7 speed grade), or EP1C4F324C6N (drop-in, even faster C6 grade), all sharing the identical 324-FBGA footprint. For new designs, Intel recommends the Cyclone IV E family (e.g., EP4CE6F17C8N) or Cyclone 10 LP family, which offer higher logic density, lower power, and modern configuration support, though they require PCB redesign because of different packages.

엔지니어링 참조 데이터: EP1C4F324C8 — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the EP1C4F324C8 when you need a 4,000-LE Cyclone FPGA in the 324-FBGA package at the slowest C8 commercial speed grade - typically the lowest-cost and most widely stocked option. Choose the EP1C4F324C8N as a drop-in lead-free alternative for RoHS-compliant assembly. Choose the EP1C4F324C7N or EP1C4F324C6N (both lead-free) if your design needs higher Fmax; all four parts share the same 324-FBGA footprint so no PCB change is required. For non-lead-free legacy assembly, choose the EP1C4F324C7 or EP1C4F324C6 variants. For new designs not constrained by the EP1C4 footprint, consider migrating to the Cyclone IV E family (e.g., EP4CE6F17C8N) for higher density and lower power, accepting that the PCB layout must be redrawn for the different package.

대체품과의 비교

파라미터	이 제품	EP1C4F324C8N	EP1C4F324C7N	EP1C4F324C6N	EP1C4F324C7	EP1C4F324C6
Package	FBGA-324, 19x19 mm, 1.0 mm pitch	FBGA-324, 19x19 mm, 1.0 mm pitch (same)	FBGA-324, 19x19 mm, 1.0 mm pitch (same)	FBGA-324, 19x19 mm, 1.0 mm pitch (same)	FBGA-324, 19x19 mm, 1.0 mm pitch (same)	FBGA-324, 19x19 mm, 1.0 mm pitch (same)
Brand	Intel	Intel	Intel	Intel	Intel	Intel
Logic Elements	4,000	4,000	4,000	4,000	4,000	4,000
Total RAM Bits	78,336	78,336	78,336	78,336	78,336	78,336
User I/Os	249	249	249	249	249	249
Speed Grade	C8 (commercial, slowest)	C8	C7 (faster)	C6 (faster still)	C7 (faster)	C6 (faster still)
Lead-Free (Pb-Free)	Not specified (assumed SnPb or Pb-free per variant)	Yes (Pb-free)	Yes (Pb-free)	Yes (Pb-free)	No (standard SnPb)	No (standard SnPb)
Core Supply Voltage	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V
Process Technology	130 nm CMOS	130 nm CMOS	130 nm CMOS	130 nm CMOS	130 nm CMOS	130 nm CMOS

주요 차별점

Slowest C8 commercial speed grade enables broadest sourcing at lowest cost (vs EP1C4F324C6N)
Drop-in compatibility with the entire EP1C4F324 speed-grade and lead-free family (vs EP1C4F324C8N, EP1C4F324C7N, EP1C4F324C6N)
Mid-density Cyclone device with abundant I/O for bridging and glue logic (vs EP1C3T144C8N)

설계 노트

The EP1C4F324C8 core operates at 1.5 V and requires multiple supply rails (VCCINT for core, VCCIO for I/O banks, VCCAUX for auxiliary). Place 0.1 uF and 10 uF decoupling capacitors as close as possible to each supply pin pair per the Cyclone Family Data Sheet power distribution guidelines. Estimated quiescent current at room temperature is on the order of tens of mA for the core and rises with toggle rate; use the Quartus II PowerPlay analyzer to model actual dissipation for your design.

The 324-FBGA package uses a 1.0 mm ball pitch, which is at the practical limit of standard SMT processes. Per IPC-7351, use NSMD (non-solder mask defined) land pads with a diameter approximately 0.5 mm and via-in-pad or microvia fan-out for breakout. Staggered via patterns are recommended for inner rows. PCB fabrication must target the manufacturer's specified coplanarity and flatness tolerances to avoid head-in-pillow or open-joint defects during reflow.

Configure all unused I/O pins through software attributes (e.g., 'tri-stated with weak pull-up' or 'grounded') rather than leaving them floating, which can cause excessive supply current and I/O contention. The C8 speed grade is the slowest commercial grade in the Cyclone family; do not assume timing closure at 250 MHz+ without choosing C7 or C6. When migrating between EP1C4F324C8, EP1C4F324C7N, and EP1C4F324C6N, only the speed grade bin differs - no firmware or pinout changes are required.

규정 준수 정보

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

무연

Yes

무할로겐

Unknown

분쟁 광물

Unknown

RoHS compliance per Alldatasheet package description (LEAD FREE). REACH status assumed compliant based on Intel/Altera product family policy; specific test report not in verified data. AEC-Q100 not applicable for commercial-grade FPGA. Halogen-free and conflict-minerals status: not in verified data.

데이터 검증일: 2026-09-06 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

출처: Distributor, Octopart, Distributor, Octopart, Manufacturer Datasheet, Distributor, Octopart