EP1S10F484I6N - Stratix 10,570 LEs FPGA 484-FBGA | Intel (Altera)
부품 번호: EP1S10F484I6N ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $474.02 | $474.02 |
| 10 | $432.5 | $4,325.00 |
| 100 | $388.1 | $38,810.00 |
| 500 | $345.75 | $172,875.00 |
| 1,000 | $305.2 | $305,200.00 |
EP1S10F484I6N 개요
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) - itself a category of integrated circuits - that allows hardware designers to configure arbitrary digital logic through SRAM-based configuration memory. In the broader system hierarchy, FPGAs sit between fixed-function ASICs and microcontrollers: they deliver ASIC-class performance and parallelism, but with field-reprogrammability that shortens time-to-market and enables post-deployment updates. Stratix FPGAs in particular target high-speed DSP, telecom line cards, and high-bandwidth data-path applications.
Key features of the EP1S10F484I6N include 920,448 bits of embedded RAM, 48 dedicated DSP blocks for high-throughput multiply-accumulate operations, support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, and 6 phase-locked loops (PLLs) for clock management. The device is configured via the IEEE 1149.1 JTAG interface or any of several passive or active serial configuration schemes. Four 1.5 V power domains are required for core, I/O banks, PLL analog supply, and configuration circuitry.
Architecturally, the Stratix family introduced the TriMatrix memory structure comprising three block sizes (M512, M4K, M-RAM) optimized for different on-chip buffering roles, together with dedicated hardware multipliers and accumulator chains that accelerate DSP workloads without consuming logic fabric. The 130 nm process gives the device its characteristic 450 MHz core performance envelope while keeping static and dynamic power within the capabilities of conventional PCB power delivery.
Typical applications include high-speed digital signal processing (radar, software-defined radio), telecom line-card glue logic, video and image processing pipelines, high-speed data-acquisition front-ends, and networking equipment that requires parallel interfaces to external memory and ASICs. The industrial temperature grade also suits test-and-measurement chassis and factory-automation controllers.
When designing with this part, pay close attention to the multiple 1.5 V power rails: VCCINT (core), VCCIO (I/O banks), VCC_PLL (PLL analog), and VCC_PD (configuration). Each PLL analog rail must be cleanly filtered, and the JTAG chain must be impedance-matched to the 1.5 V reference to avoid configuration errors. Power-on sequencing (VCCINT before VCCIO with monotonic rise) is required to prevent latch-up.
This page synthesizes Intel/Altera Stratix specifications, distributor pricing snapshots, and pin-compatible variant guidance not found in the manufacturer datasheet alone.
드롭인 대체품: EP1S10F484I6N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S10F484I6N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Family, Configuration Method, DSP Blocks.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S10F484C7N
✅ 드롭인✓ 재고 있음
$162 / 개
데이터시트 보기 →EP1S10F484C7
✅ 드롭인✓ 재고 있음
$175 / 개
데이터시트 보기 →EP1S10F484C6N
✅ 드롭인✓ 재고 있음
$226.31 / 개
데이터시트 보기 →EP1S10F484C5N
✅ 드롭인✓ 재고 있음
$52 / 개
데이터시트 보기 →EP1S10F484I6N 최대 정격 & 전기적 특성
| Family | Stratix |
| Logic Elements | 10,570 |
| Logic Array Blocks (LABs) | 1,057 |
| Embedded Memory (Bits) | 920,448 |
| DSP Blocks | 48 |
| Maximum User I/O | 335 |
| Process Technology | 130 nm CMOS |
| Core Voltage (VCCINT) | 1.5 V |
| Number of PLLs | 6 |
| 동작 온도 | 0C to +85C (Industrial) |
| 패키지 | 484-ball FBGA (FCBGA), 23 x 23 mm, 1 mm pitch |
| 실장 유형 | Surface Mount (Flip-Chip BGA) |
| Peak Reflow Temperature | 245 C |
| Configuration Interface | JTAG (IEEE 1149.1), Passive Serial, Active Serial |
| Internal Core Speed | up to 450 MHz |
| Logic Family | CMOS |
| Terminal Finish | Tin-Silver-Copper (SnAgCu) |
EP1S10F484I6N 484-ball fbga (fcbga), 23 x 23 mm, 1 mm pitch 핀 구성 가이드
EP1S10F484I6N(484-ball fbga (fcbga), 23 x 23 mm, 1 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S10F484I6N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S10F484I6N 적합 용도: 6 애플리케이션s: Software-Defined Radio (SDR) Baseband Processing, Telecom Line-Card Glue Logic and Packet Processing, High-Speed Video and Image Processing Pipeline, Radar and Lidar Signal Acquisition Front-End, Industrial Test and Measurement Chassis, Medical Imaging Pre-Processing Back-End.
Software-Defined Radio (SDR) Baseband Processing
The EP1S10F484I6N's 10,570 logic elements and 48 dedicated DSP blocks deliver the parallel multiply-accumulate throughput needed for SDR baseband processing. Its 920,448 bits of embedded TriMatrix memory - split across M512, M4K, and M-RAM blocks - hold FIR filter coefficients, FFT twiddle factors, and packet buffers without external SRAM, reducing PCB complexity and latency. The six PLLs generate the multiple sample clocks (e.g. 122.88 MHz for LTE) required by multi-standard radio designs, while the 335 user I/O pins connect to high-speed ADC/DAC front-ends. Power budget at typical 200 MHz operation is dominated by dynamic switching; the 1.5 V core supply simplifies power-tree design versus newer 1.0 V FPGAs.
추천
Telecom Line-Card Glue Logic and Packet Processing
Stratix FPGAs were designed for telecom infrastructure, and the EP1S10F484I6N specifically targets line cards that need a high I/O count and flexible I/O standards. The 335 user I/Os accept LVDS, LVPECL, HSTL, and SSTL interfaces to framers, mappers, SERDES, and network processors, eliminating discrete glue logic. Its 450 MHz core performance runs header classification, CRC, and traffic-shaping algorithms in parallel, while the JTAG configuration interface enables in-system field updates for protocol changes. Industrial temperature grade (0-85C) suits central-office and outdoor-cabinet deployments.
추천
High-Speed Video and Image Processing Pipeline
The 48 dedicated DSP blocks each contain four 18x18 multipliers plus adders, enabling real-time video-processing kernels such as 2D filters, color-space conversion, and motion estimation at full HD resolutions. The 920 Kbits of on-chip memory hold line buffers and DCT coefficients without off-chip DRAM round-trips, eliminating the latency and bandwidth bottlenecks that limit video throughput. The 335 I/Os comfortably connect to CameraLink, HDMI transmitters, and DDR memory controllers. Industrial temperature grade suits machine-vision factory-floor cameras and broadcast equipment.
추천
Radar and Lidar Signal Acquisition Front-End
The EP1S10F484I6N's combination of high-speed serial LVDS (840 Mbps), parallel 335 I/O count, and embedded DSP blocks makes it well-suited to radar pulse compression and lidar time-of-flight processing. The PLLs generate the precise 100+ MHz ADC sample clocks required by phased-array beamforming, and the TriMatrix memory holds chirp-replica tables for matched-filter correlation. Industrial 0-85C operation supports outdoor defense and automotive test installations. Power consumption at 200 MHz with moderate DSP utilization runs ~3-4 W typical, manageable with passive heatsinking.
추천
Industrial Test and Measurement Chassis
Test-and-measurement equipment such as protocol analyzers, logic-analyzer backends, and automated-test rigs demand high pin-count FPGAs that can interface to many parallel buses simultaneously. The Stratix EP1S10F484I6N's 335 I/Os handle multiple DUT channels in parallel, while its 6 PLLs generate the multi-rate clocks required for JTAG, SWD, I2C, SPI, and parallel-bus capture. On-chip DSP blocks accelerate post-processing such as eye-diagram statistics, and TriMatrix memory stores captured waveforms before offload to host PC. Industrial temperature grade supports bench-top and chassis-mounted test gear.
추천
Medical Imaging Pre-Processing Back-End
Medical imaging modalities - ultrasound, endoscopy, and digital X-ray - generate high-bandwidth data streams that require real-time beamforming, color-Doppler, and image reconstruction. The EP1S10F484I6N's DSP block density handles ultrasound beamformer requirements at 4-16 channels, while the TriMatrix memory stores line buffers for image reconstruction. Its industrial 0-85C operating range suits cart-based and stationary imaging equipment. JTAG configuration enables post-deployment firmware updates that are critical for medical-device lifecycle management.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1S10F484I6N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S10F484C7N | EP1S10F484C7 | EP1S10F484C6N | EP1S10F484C5N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-FBGA (23x23 mm, 1 mm pitch) | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Operating Temperature | 0C to +85C (Industrial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) |
| Speed Grade | 6 | 7 (fastest) | 7 (fastest) | 6 | 5 (slowest) |
| Logic Elements | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 |
| Embedded Memory | 920,448 bits | 920,448 bits | 920,448 bits | 920,448 bits | 920,448 bits |
| DSP Blocks | 48 | 48 | 48 | 48 | 48 |
| Number of PLLs | 6 | 6 | 6 | 6 | 6 |
| Maximum User I/O | 335 | 335 | 335 | 335 | 335 |
주요 차별점
- Industrial 0-85C temperature grade for harsh-environment deployment (vs EP1S10F484C7N)
- Balanced logic, memory, and DSP density for mid-complexity designs (vs EP1S20F484 / EP1S30F484)
- Standard 484-FBGA ball pitch enables mature PCB processes (vs Stratix II EP2S15F484C8 (256-pin BGA option))
설계 노트
The EP1S10F484I6N requires four distinct 1.5 V rails: VCCINT (core), VCCIO (I/O banks, set per bank to 1.5/1.8/2.5/3.3 V), VCC_PLL (PLL analog - must be filtered with ferrite beads and decoupled with 10 uF + 0.1 uF capacitors), and VCC_PD (configuration pre-driver). VCCINT and VCCIO must ramp monotonically; VCCINT must reach stable voltage before VCCIO per Stratix Hardware Reference manual. Use a power sequencer IC to enforce ordering.
The 484-ball FBGA has 1.0 mm ball pitch requiring microvia (HDI) PCB stack-up, ideally 1+N+1 with 4-6 layer construction. Escape routing requires 0.5 mm drill microvias to inner layers. The thermal pad array under the package (typical of Stratix flip-chip BGA) must be soldered to a copper pour with thermal vias (0.3 mm pitch, 12+ vias) to dissipate the ~3-5 W typical core power. Signal-integrity simulation with the IBIS model is recommended for LVDS at 600+ Mbps.
Stratix configuration memory is volatile - the FPGA loses all logic on power-down and must be reconfigured via JTAG or EPC configuration memory on every boot. Forcing the nCONFIG pin low at inappropriate times can leave the device in an unknown state. The MSEL[2:0] pins select configuration mode and must be pulled correctly; an incorrect setting causes configuration failure. Finally, the JTAG chain must be terminated to 1.5 V (not 3.3 V) to avoid I/O stress.
Stratix LVDS transmitters and receivers support up to 840 Mbps, but traces longer than ~5 inches require 100 ohm differential impedance control and matched length pairs within 5 ps. Use the LVDS-specific Altmega OBUF/IBUF primitives instead of generic I/O buffers; misconfigured LVDS termination can cause bit-error rates 10-100x worse than expected. For source-synchronous buses, place the FPGA and the companion ASIC/ADC in matched I/O banks with identical VCCIO.
규정 준수 정보
Terminal finish Tin-Silver-Copper (SnAgCu) per Partstack data is consistent with lead-free SMT; RoHS, REACH, AEC-Q100 status not stated in verified web data. Industrial grade (I-suffix) extends operating temperature to 85C but is not an automotive qualification.
