EP1S30F1020I6 - 32,470 Logic Elements Stratix FPGA | Intel
부품 번호: EP1S30F1020I6 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2321.69 | $2,321.69 |
| 10 | $2200 | $22,000.00 |
| 100 | $2050 | $205,000.00 |
| 500 | $1900 | $950,000.00 |
| 1,000 | $1750 | $1,750,000.00 |
EP1S30F1020I6 개요
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs occupy a unique position in the hierarchy between general-purpose microcontrollers and fixed-function ASICs: they offer hardware-timed parallelism, deterministic latency, and the ability to be reconfigured in the field. The Stratix family was Intel's (formerly Altera's) high-performance flagship before being succeeded by Stratix II/III/IV/V. Within the taxonomy, FPGAs sit under programmable logic devices (PLDs) within the broader semiconductor category.
Key features of the EP1S30F1020I6 include 32,470 logic elements (LEs), 3,317,184 RAM bits organized as TriMatrix memory blocks, 144 embedded 18x18 multipliers for DSP, 6 phase-locked loops (PLLs), and 12 dedicated clock networks. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL via 726 user I/O pins on the 1020-ball FC-FBGA package.
Architecturally, the Stratix EP1S30 uses a row-and-column structure with embedded DSP blocks interleaved between memory columns. The 130 nm process technology combined with a 1.5 V core supply and dedicated MultiTrack interconnect minimizes routing congestion and supports clock rates up to 450 MHz in DSP pipelines. Embedded memory and DSP blocks are hard-wired for predictable performance, while logic fabric handles glue logic and state machines.
Typical applications include high-speed digital signal processing (FFT engines, baseband processing), telecom backplane interfacing, military radar systems, medical imaging accelerators, and ASIC prototyping. The combination of high logic density, generous on-chip memory, and embedded multipliers makes it ideal for datapath-heavy designs requiring deterministic throughput.
When designing with this part, ensure your power budget accounts for the dynamic power of fast logic toggling - Intel provides the PowerPlay early power estimator tool. For the FC-FBGA-1020 package, PCB layout must use microvia technology and matched-length traces on high-speed LVDS pairs to maintain signal integrity.
This page synthesizes distributor pricing, same-package drop-in alternatives, FPGA design considerations, and lifecycle context not consolidated in the manufacturer datasheet. As of 2026-09-07, the part remains in NRND status with limited authorized distribution.
드롭인 대체품: EP1S30F1020I6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S30F1020I6 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Family, Package Type, Logic Elements, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S30F1020I6N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1750 / 개
데이터시트 보기 →EP1S30F1020C7N
✅ 드롭인✓ 재고 있음
$215 / 개
데이터시트 보기 →EP1S30F1020C7
✅ 드롭인✓ 재고 있음
$575 / 개
데이터시트 보기 →EP1S30F1020C6N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1015 / 개
데이터시트 보기 →EP1S30F1020C6
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$262 / 개
데이터시트 보기 →EP1S30F1020I6 최대 정격 & 전기적 특성
| Family | Stratix |
| Logic Elements | 32,470 |
| Embedded RAM | 3,317,184 bits |
| User I/O Count | 726 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Embedded Multipliers | 144 (18x18) |
| Phase-Locked Loops (PLLs) | 6 |
| Clock Networks | 12 dedicated |
| 패키지 | 1020-ball FC-FBGA (33x33 mm, 1.0 mm pitch) |
| 실장 유형 | Surface Mount (BGA) |
| 동작 온도 | -40C to +100C (Industrial) |
| Maximum Frequency | 450 MHz (DSP) |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
EP1S30F1020I6 1020-ball fc-fbga (33x33 mm, 1.0 mm pitch) 핀 구성 가이드
EP1S30F1020I6(1020-ball fc-fbga (33x33 mm, 1.0 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S30F1020I6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S30F1020I6 적합 용도: 6 애플리케이션s: High-Speed Digital Signal Processing, Telecom Backplane Interfacing, Military Radar and Electronic Warfare, Medical Imaging Accelerators, ASIC Prototyping and Emulation, High-Performance Industrial Control.
High-Speed Digital Signal Processing
The EP1S30F1020I6 is well suited for high-speed DSP pipelines such as FFT engines, baseband processing, and real-time signal analyzers. The combination of 144 embedded 18x18 multipliers and 3,317,184 bits of TriMatrix memory enables single-chip implementation of 256-point FFTs and multi-channel FIR filters at clock rates up to 450 MHz. The 32,470 logic elements accommodate control state machines and glue logic alongside the DSP datapath without offloading to external logic. Designers typically instantiate the MegaCore FFT IP with streaming flow control to keep data on-chip, eliminating external memory bottlenecks and reducing system latency to deterministic, hardware-timed values.
추천
Telecom Backplane Interfacing
The EP1S30F1020I6's 726 user I/O pins and support for LVDS, HSTL, and SSTL I/O standards make it ideal for telecom backplane bridging and line-card interfacing. The device supports multiple channelized data rates via its 12 dedicated clock networks and 6 PLLs, enabling timing flexibility across OC-48, Gigabit Ethernet, and proprietary serializer/deserializer interfaces. The 1020-ball FC-FBGA package routes high-speed LVDS pairs with controlled impedance and matched length, which is essential for sub-nanosecond skew budgets. Industrial temperature grade operation allows deployment in central office equipment without active cooling.
추천
Military Radar and Electronic Warfare
Military radar, electronic warfare, and SIGINT systems benefit from the EP1S30F1020I6's deterministic parallelism and large on-chip memory. Embedded 18x18 multipliers support pulse-Doppler and chirp signal processing, while TriMatrix memory absorbs sample buffering between antenna channels. The device's industrial temperature range and demonstrated reliability in defense systems have made it a long-standing choice for ruggedized VPX and VME boards. Compared to microcontrollers, the FPGA delivers hardware-timed processing with deterministic latency, critical for phase-coherent beamforming.
추천
Medical Imaging Accelerators
The EP1S30F1020I6 accelerates real-time image processing in medical modalities such as ultrasound beamforming, CT reconstruction back-projectors, and MRI FFT pipelines. Hardware parallelism in the FPGA outperforms sequential DSP microcontrollers by an order of magnitude for pixel-rate operations. The 144 embedded multipliers support real-time convolution kernels for image filtering, while the 3,317,184 bits of TriMatrix memory cache line buffers and lookup tables without external SRAM. Medical-grade reliability and industrial temperature operation permit deployment in cart-based and bedside imaging systems.
추천
ASIC Prototyping and Emulation
The EP1S30F1020I6 serves as a high-density prototyping vehicle for ASIC and SoC designs before mask production. With 32,470 logic elements and generous TriMatrix memory, the FPGA accommodates single-chip emulations of mid-complexity ASICs, allowing firmware and validation teams to develop and test against real silicon years before tape-out. Industrial temperature operation permits verification under realistic environmental conditions. Multiple FPGAs can be ganged via board-level partitioning schemes to emulate larger ASICs, with the 726 user I/O pins providing ample inter-FPGA bandwidth for partition bridging.
추천
High-Performance Industrial Control
Industrial automation and motion control systems leverage the EP1S30F1020I6 for hardware-timed PID loops, multi-axis servo control, and deterministic Ethernet protocol bridging. The FPGA's 6 PLLs and 12 clock networks synchronize distributed motion axes with sub-microsecond jitter, while embedded multipliers handle real-time sensor fusion and resolver-to-digital conversion. The 726 user I/O pins accommodate parallel sensor arrays and high-speed encoder interfaces. Industrial temperature rating and robust BGA packaging support deployment in factory floor environments with vibration and extended thermal stress.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1S30F1020I6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S30F1020I6N | EP1S30F1020C7N | EP1S30F1020C7 | EP1S30F1020C6N | EP1S30F1020C6 |
|---|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA (33x33 mm) | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 32,470 | 32,470 | 32,470 | 32,470 | 32,470 | 32,470 |
| Embedded RAM | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits |
| User I/O Count | 726 | 726 | 726 | 726 | 726 | 726 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | I6 (industrial speed bin 6) | I6 | C7 | C7 | C6 | C6 |
주요 차별점
- Industrial temperature grade with full operating range (vs EP1S30F1020C7N)
- Faster speed grade for timing-critical paths (vs EP1S30F1020C6N)
- Mid-density sweet spot of original Stratix family (vs EP1S40F1020I6)
설계 노트
The EP1S30F1020I6 requires multiple supply rails: 1.5 V core, 3.3 V I/O, 2.5 V auxiliary, and PLL analog supplies. Use the PowerPlay early power estimator spreadsheet from Intel to model dynamic and static power for your specific design. Decoupling should include a minimum of 10 x 0.1 uF MLCCs near the device plus bulk polymer or tantalum capacitors on each rail. Inadequate decoupling causes configuration failures and intermittent logic errors during high-speed switching transients.
The 1020-ball FC-FBGA package with 1.0 mm pitch requires microvia (HDI) PCB technology with laser-drilled stacked vias. Use a 4-2-4 or higher layer-count stackup with dedicated power and ground planes adjacent to the BGA. LVDS pairs must have 100 ohm differential impedance and matched trace lengths within 150 mils for reliable DDR interfaces. Thermal vias under the BGA thermal pad are mandatory for heat dissipation - refer to Intel's package layout guidelines for via pattern density.
Stratix configuration via passive serial or Fast Passive Parallel modes requires careful attention to JTAG chain integrity - add pull-up resistors on nCONFIG, nSTATUS, and CONF_DONE lines. Confirm the EPC16 or EPC4 configuration device is sized correctly for your .sof or .pof bitstream, which can exceed 10 Mbits for fully-utilized designs. Do not operate the device without proper MSEL pin configuration for your chosen configuration mode - this is a common cause of first-board bring-up failures.
규정 준수 정보
RoHS, REACH, lead-free, and halogen-free status could not be verified from the provided web data - mark as unknown. AEC-Q100 is not applicable since this is a programmable logic device, not an automotive analog IC. For defense applications, look for source-controlled military part numbers (EP1S30F1020I6N with MIL-PRF-38535 processing).
