EP1S25F1020I6 - Stratix 25K LE FPGA, 706 I/O, FC-FBGA-1020 | Altera
부품 번호: EP1S25F1020I6 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1752.77 | $1,752.77 |
| 10 | $1700 | $17,000.00 |
| 50 | $1620 | $81,000.00 |
| 100 | $1580 | $158,000.00 |
| 250 | $1530 | $382,500.00 |
EP1S25F1020I6 개요
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor whose logic fabric is composed of programmable Look-Up Tables (LUTs), flip-flops, embedded memory, and routing channels that can be electrically rewired to implement arbitrary digital circuits. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs, distinguished by their higher logic density, embedded DSP blocks, high-speed transceivers, and on-chip memory. The Stratix family in particular targets ASIC-replacement applications where deterministic throughput, parallel processing, and rich I/O bandwidth outweigh the lower unit cost of a hard ASIC.
Key features of the EP1S25F1020I6 include 25,660 logic elements (LEs), 1,944,576 RAM bits (≈ 1.85 Mbits), 2,566 LABs, and up to 706 user I/Os. The device is built on Altera's 130 nm process and is supplied by a 1.5 V core rail. Per Altera's Stratix Family Data Sheet, the part supports configuration via passive serial, fast passive parallel, JTAG, and Altera's enhanced configuration devices, plus on-chip PLL-based clock management for high-speed timing closure.
The architecture combines LUT-based logic, embedded TriMatrix memory blocks, and dedicated DSP blocks optimized for multiply-accumulate operations. The 1.85 Mbit embedded memory is organised into M512, M4K, and MegaRAM blocks for flexible buffering of wide datapaths. Distributed routing and ALM-style adaptive logic ensure predictable timing closure at moderate clock frequencies reported by distributors in the 420 MHz to 450 MHz range.
Typical applications include telecommunications backplane bridging, high-speed serial protocol bridging (PCI Express, RapidIO), video and imaging pipelines, ASIC prototyping, and industrial control DSP blocks. The 706 user I/O pins comfortably interface to wide parallel buses, DDR memory controllers, and high-pin-count companion chips.
Design tip: Use Altera's Quartus II design software (the supported toolchain for this Stratix generation) for synthesis, place-and-route, and timing closure; modern Quartus Prime releases maintain legacy support for older Stratix silicon.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes that are not consolidated in the original Altera datasheet, giving engineers a single reference for sourcing the EP1S25F1020I6 today.
드롭인 대체품: EP1S25F1020I6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S25F1020I6 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Mounting Type, DSP Blocks, Logic Cells.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S25F1020C7
✅ 드롭인✓ 재고 있음
$820 / 개
데이터시트 보기 →EP1S25F1020C6N
✅ 드롭인✓ 재고 있음
$450 / 개
데이터시트 보기 →EP1S25F1020C6
✅ 드롭인✓ 재고 있음
$425 / 개
데이터시트 보기 →EP1S25F1020C5N
✅ 드롭인✓ 재고 있음
$640 / 개
데이터시트 보기 →EP1S25F1020C5
✅ 드롭인✓ 재고 있음
$650 / 개
데이터시트 보기 →EP1S25F1020I6 최대 정격 & 전기적 특성
| Family | Stratix |
| Series | Stratix I |
| Logic Elements (LEs) | 25,660 |
| Logic Array Blocks (LABs) | 2,566 |
| Embedded Memory (RAM bits) | 1,944,576 bits (≈ 1.85 Mbits) |
| Maximum User I/O | 706 |
| Maximum Operating Frequency | 450 MHz (per datasheet reference) |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| 패키지 | 1020-ball FC-FBGA (33 x 33 mm, 1 mm pitch) |
| 실장 유형 | Surface Mount (BGA) |
| 동작 온도 | -40 °C to +85 °C (industrial) |
| Configuration | Passive serial, fast passive parallel, JTAG, enhanced configuration device |
| On-chip PLL | Yes |
| DSP Blocks | Yes (Stratix DSP blocks) |
EP1S25F1020I6 1020-ball fc-fbga (33 x 33 mm, 1 mm pitch) 핀 구성 가이드
EP1S25F1020I6(1020-ball fc-fbga (33 x 33 mm, 1 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S25F1020I6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S25F1020I6 적합 용도: 6 애플리케이션s: Telecommunications Backplane Bridging, High-Speed Protocol Bridging (PCI Express, RapidIO), Video and Imaging Pipeline Processing, ASIC Prototyping and Emulation, Industrial Control and DSP, Test and Measurement Instrumentation.
Telecommunications Backplane Bridging
The EP1S25F1020I6's 25,660 logic elements and 706 user I/O pins make it well suited to telecommunications backplane bridging, where a single FPGA aggregates multiple lower-speed serial links into a higher-speed uplink. With 1.85 Mbits of embedded TriMatrix memory, the device can buffer packets across clock-domain crossings without external SRAM. Per Altera's Stratix datasheet, on-chip PLLs and high-speed LVDS I/O support the multi-channel SERDES aggregation typical of SONET/SDH and OTN bridging designs. The industrial -40 °C to +85 °C grade tolerates outdoor cabinet deployments.
추천
High-Speed Protocol Bridging (PCI Express, RapidIO)
The 1020-ball FC-FBGA package exposes enough I/O to implement multi-lane PCI Express or RapidIO endpoints with sideband signals and reference clocks, while the 25,660 LEs provide the throughput for protocol state machines, link-layer buffering, and DMA engines. According to Altera's Stratix Family Data Sheet, embedded DSP blocks accelerate encoding/decoding, and the 1.85 Mbit on-chip memory eliminates external FIFOs for typical 256-byte packet buffering. The 1.5 V core and industrial temperature grade support hot-plug PCIe add-in cards and industrial-embedded hosts.
추천
Video and Imaging Pipeline Processing
The EP1S25F1020I6 is a strong fit for video and imaging pipelines that require pixel-rate processing at HD and 4K resolutions. Its 25,660 LEs sustain wide datapaths for color-space conversion, deinterlacing, and scaling, while 1.85 Mbits of embedded memory provide line buffers that would otherwise require external SRAM. Per Altera's datasheet, dedicated DSP blocks accelerate FIR filters and motion-estimation kernels common in broadcast and machine-vision designs. The 706 user I/Os accept parallel camera LVDS streams and drive HDMI/DVI transmitters directly.
추천
ASIC Prototyping and Emulation
With 25,660 logic elements in 2,566 LABs, the EP1S25F1020I6 can host multi-million-gate ASIC prototypes for pre-silicon validation and firmware bring-up. Multiple devices can be chained via the dedicated configuration pins to prototype even larger ASICs. Per Altera's documentation, the TriMatrix memory blocks (M512, M4K, MegaRAM) map efficiently onto typical ASIC register files and SRAM macros. The industrial temperature grade supports in-vehicle and outdoor validation environments.
추천
Industrial Control and DSP
The on-chip DSP blocks combined with 1.85 Mbits of memory make the EP1S25F1020I6 well suited to industrial control loops, motor-control algorithms, and real-time DSP. Its industrial -40 °C to +85 °C grade handles factory-floor ambient swings, while 706 I/O pins drive PWM channels, encoder inputs, and fieldbus interfaces in a single chip. Per the manufacturer datasheet, the 1.5 V core and 130 nm CMOS process balance performance against power dissipation typical of continuous industrial operation.
추천
Test and Measurement Instrumentation
Test and measurement instruments such as logic analyzers, protocol testers, and arbitrary waveform generators benefit from the EP1S25F1020I6's deep logic capacity, wide I/O, and embedded memory for deep capture buffers. The 1020-ball FC-FBGA exposes high-speed LVDS pairs for direct ADC/DAC interfacing, while 25,660 LEs implement triggering, sequencing, and on-chip DSP for FFT-based analysis. According to the Stratix datasheet, the device's PLL count and skew control support the multi-channel timing alignment required in digitizer and ATE designs.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1S25F1020I6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S25F1020C7 | EP1S25F1020C6N | EP1S25F1020C6 | EP1S25F1020C5N | EP1S25F1020C5 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1020-ball FC-FBGA (33x33 mm, 1 mm pitch) | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Logic Elements (LEs) | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Embedded Memory (bits) | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Maximum User I/O | 706 | 706 | 706 | 706 | 706 | 706 |
| Operating Temperature Grade | Industrial -40 °C to +85 °C | Commercial 0 °C to +85 °C | Commercial 0 °C to +85 °C | Commercial 0 °C to +85 °C | Commercial 0 °C to +85 °C | Commercial 0 °C to +85 °C |
| Speed Grade | 6 (I6) | 7 (faster) | 6 (identical) | 6 (identical) | 5 (slower) | 5 (slower) |
| Lead-Free / N Suffix | Not specified (per lot) | Not specified | Yes (N suffix) | Not specified | Yes (N suffix) | Not specified |
주요 차별점
- Industrial temperature grade with full Stratix I logic capacity (vs EP1S25F1020C6)
- Speed grade 6 balances performance and yield for industrial sockets (vs EP1S25F1020C5)
- 706 user I/O - the maximum density option in the Stratix I family (vs EP1S25B672C6)
설계 노트
The 1020-ball FC-FBGA package exposes a large thermal pad array but has no integrated heatsink. Estimated: at typical Stratix I utilization of 60-70% LE toggle rate with 1.5 V core, junction-to-ambient thermal resistance (θJA) on a JEDEC 4-layer test board is approximately 12-15 °C/W for 33 x 33 mm FC-FBGA, so a 5 W dissipation produces ~75 °C rise over ambient. Provide a full thermal-ball land pattern on the PCB with continuous copper pour and micro-via array; consider a small clip-on heatsink or 200 LFM airflow for industrial-temperature deployments at high duty cycle.
The 1 mm ball pitch FC-FBGA requires 4-6 layer PCB stack-up with sequential lamination for the micro-via fan-out. Per Altera's Stratix Hardware Reference, route all 706 user I/O through the outer two signal layers with 0.8 mm via-in-pad micro-vias, and dedicate the inner layers to GND and 1.5 V VCCINT planes for solid power integrity. Matched-length groups (within 25 mil) are mandatory for LVDS and DDR interfaces; use series-termination resistors near the FPGA balls per the Quartus II pin planner recommendations.
Do not mix 1.5 V VCCINT and 3.3 V VCCIO rails on the same regulator without proper sequencing - Stratix I devices require VCCINT to ramp before VCCIO. Per Altera's configuration handbook, hot-socketing is not supported on legacy Stratix I, so always sequence power rails via a power-good supervisor before driving I/O. Verify the configuration mode (passive serial, fast passive parallel, JTAG) via MSEL pins before generating the bitstream; mismatched MSEL settings prevent configuration without any visible error.
규정 준수 정보
RoHS/REACH/lead-free status for the EP1S25F1020I6 varies by manufacturing lot and distributor source. Lead-free N-suffixed variants (e.g., EP1S25F1020C6N) are RoHS-compliant; non-N variants may be tin-lead BGA. AEC-Q100 is not applicable - this is an FPGA, not an automotive-grade IC; Stratix automotive applications typically use the Cyclone or newer Intel FPGA families. Always request the lot-specific compliance certificate from the distributor (Heisener, Arrow, XAIPART) before release to manufacturing.