EP1S30F1020C7 - Stratix 32K LE FPGA 726 I/O FC-FBGA-1020 | Intel
부품 번호: EP1S30F1020C7 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $721.59 | $721.59 |
| 10 | $690 | $6,900.00 |
| 100 | $640 | $64,000.00 |
| 250 | $605 | $151,250.00 |
| 500 | $575 | $287,500.00 |
EP1S30F1020C7 개요
An FPGA (Field Programmable Gate Array) is a class of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. In the system hierarchy FPGAs sit alongside ASICs and microcontrollers but are distinguished by their in-system re-programmability via SRAM configuration bitstreams. The Stratix family was Intel/Altera's first generation to combine hard IP multipliers and TriMatrix memory blocks with a scalable logic fabric, making it suitable for high-throughput DSP and datapath applications.
Key features of the EP1S30F1020C7 include 3,247 Logic Array Blocks (LABs), embedded multiplier blocks for DSP, TriMatrix memory blocks for distributed and block RAM, dedicated clock management with PLLs, and configurable I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. Multiple I/O banks support mixed voltage signaling on a single device. The -C7 speed grade indicates a medium-speed bin, balancing performance against power for typical commercial designs.
The device architecture incorporates a MultiTrack interconnect that minimizes routing congestion and supports predictable timing closure for wide datapaths. The FC-FBGA-1020 substrate uses flip-chip solder bumps for low-inductance power delivery, essential for high-fanout synchronous designs. Dedicated hardware blocks reduce logic cell consumption for FFTs, FIR filters, and protocol bridging workloads.
Typical applications include high-speed digital signal processing (FFT cores, video processing), communications infrastructure (baseband processing, protocol bridging), ASIC prototyping, industrial imaging and machine vision, test and measurement equipment, and high-performance custom computing accelerators. The 726 I/O count and abundant DSP blocks make it well suited for parallel interface aggregation and bus-width conversion roles.
When designing with this device, plan power distribution carefully: the FC-FBGA substrate requires a multilayer PCB with low-impedance core and I/O voltage planes, and decoupling must follow Altera's pin-out-specific guidelines. Configuration scheme selection (AS, AP, PS, JTAG) must be locked early in the schematic, as the EPC configuration device companion dictates board layout. The legacy Quartus II design tool supports this device but is no longer the latest vendor IDE.
This page synthesizes distributor pricing, drop-in same-package alternatives, design notes, and selection guidance not found in a single datasheet table. Engineer-oriented pinout guidance, package drawings, and Q&A content are compiled from multiple verified sources to accelerate evaluation.
드롭인 대체품: EP1S30F1020C7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S30F1020C7 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package Type, Family, Logic Elements, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S30F1020C6
✅ 드롭인✓ 재고 있음
$262 / 개
데이터시트 보기 →EP1S30F1020C6N
✅ 드롭인✓ 재고 있음
$1015 / 개
데이터시트 보기 →EP1S30F1020C5
✅ 드롭인✓ 재고 있음
$99 / 개
데이터시트 보기 →EP1S30F1020C5N
✅ 드롭인✓ 재고 있음
$1095 / 개
데이터시트 보기 →EP1S25F1020C7
✅ 드롭인✓ 재고 있음
$820 / 개
데이터시트 보기 →EP1S30F1020C7 최대 정격 & 전기적 특성
| Series | Stratix |
| Logic Elements / Cells | 32470 |
| Logic Array Blocks (LABs) | 3247 |
| Number of I/O | 726 |
| Maximum Internal Frequency | 420.17 MHz |
| 공급 전압 | 1.5 V |
| 동작 온도 | 0 C to 85 C |
| Process Technology | 130 nm CMOS |
| Logic Family | CMOS |
| Package Type | FC-FBGA-1020 (flip-chip) |
| Package Dimensions | 33 x 33 mm, 1 mm pitch |
| 핀 수 | 1020 |
| Number of Terminals | 1020 |
| Terminal Form | Ball |
| 실장 유형 | Surface Mount |
| Configuration Method | SRAM (AS / AP / PS / JTAG) |
| Speed Grade | C7 (medium speed bin) |
EP1S30F1020C7 33 x 33 mm, 1 mm pitch 핀 구성 가이드
EP1S30F1020C7(33 x 33 mm, 1 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S30F1020C7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S30F1020C7 적합 용도: 6 애플리케이션s: High-Speed Digital Signal Processing, Telecommunications Infrastructure, ASIC Prototyping and Emulation, Industrial Imaging and Machine Vision, Test and Measurement Equipment, High-Performance Custom Computing.
High-Speed Digital Signal Processing
The EP1S30F1020C7 fits high-speed DSP workloads because its 32,470 logic cells and dedicated embedded multiplier blocks deliver high MAC throughput at the device's 420 MHz internal frequency. Hard multipliers reduce logic cell consumption for FIR filters, FFTs, and matrix operations compared to LUT-based implementations. The 726 user I/Os support wide parallel datapath ingress and egress, while TriMatrix memory blocks provide on-chip buffering for coefficient storage and line-delay elements. Typical designs include radar pulse compression, software-defined radio baseband processing, and high-frame-rate video pipelines.
추천
Telecommunications Infrastructure
Telecommunications infrastructure roles leverage the EP1S30F1020C7's abundant LVDS-capable I/O and PLLs for line-card aggregation, protocol bridging, and clock-domain conversion. The 726 I/Os comfortably host multiple SFI / XAUI interface widths, while dedicated PLLs synthesize low-jitter clocks required by serializer-deserializer companions. The 130 nm Stratix fabric implements framer-defamer state machines and protocol adaptation in a single device, replacing discrete ASSPs. Hardware engineers typically pair this part with external PHY devices and JTAG-based in-system programming for field upgrades.
추천
ASIC Prototyping and Emulation
The EP1S30F1020C7 is widely used in ASIC prototyping because its 32,470 logic cells map complex SoC blocks to a single device, accelerating design validation prior to tape-out. Multi-FPGA partitioning tools such as Synopsys Certify and Mentor Graphic Precision support the Stratix architecture, and the 726 I/Os expose the wide bus widths typical of ASIC emulation workloads. Designers can re-target RTL between Quartus II and downstream ASIC flows with established synthesis libraries. The FC-FBGA-1020 package supports the high pin-count required for full ASIC-pin visibility during emulation.
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Industrial Imaging and Machine Vision
Industrial imaging and machine vision systems rely on the EP1S30F1020C7 to process parallel Camera Link, CoaXPress, or LVDS-based sensor streams at high frame rates. Its 32,470 logic cells implement real-time image preprocessing - Bayer demosaicing, color matrix conversion, gamma correction - within the 420 MHz fabric budget. The 726 I/Os accommodate multi-tap camera inputs and frame-buffer hand-off to downstream DDR memory controllers. Designers take advantage of the embedded multipliers for convolution kernels and TriMatrix memory for line buffering, enabling deterministic latency in quality-control inspection lines.
추천
Test and Measurement Equipment
Test and measurement instrument designers choose the EP1S30F1020C7 for its ability to synthesize arbitrary waveform patterns, trigger logic, and protocol analyzers in programmable logic. The 726 I/Os support parallel instrument buses and front-panel connector counts typical of benchtop instruments. PLLs provide sub-nanosecond jitter performance for high-precision timing generators, and embedded multipliers accelerate digital down-conversion in spectrum analyzer signal paths. The legacy-but-supported Quartus II toolchain remains available for design maintenance and field upgrades on long-life-cycle instruments.
추천
High-Performance Custom Computing
The EP1S30F1020C7 powers custom computing accelerators by mapping parallel algorithms - cryptography, genomic alignment, financial Monte Carlo - into its 32,470-cell logic fabric. Hard multipliers implement integer and fixed-point MAC operations efficiently, while TriMatrix memory provides low-latency operand and result buffers. The 726 I/Os expose wide datapath channels to external host CPUs or coprocessor meshes, and PLLs synchronize parallel pipelines. The FC-FBGA package's low-inductance power delivery keeps voltage droop under control during high-fanout switching, supporting sustained peak throughput.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1S30F1020C7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S30F1020C6 | EP1S30F1020C6N | EP1S30F1020C5 | EP1S30F1020C5N | EP1S25F1020C7 |
|---|---|---|---|---|---|---|
| Package | FC-FBGA-1020 (33x33 mm, 1 mm pitch) | FC-FBGA-1020 (33x33 mm, 1 mm pitch) - same | FC-FBGA-1020 (33x33 mm, 1 mm pitch) - same | FC-FBGA-1020 (33x33 mm, 1 mm pitch) - same | FC-FBGA-1020 (33x33 mm, 1 mm pitch) - same | FC-FBGA-1020 (33x33 mm, 1 mm pitch) - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Series | Stratix | Stratix | Stratix | Stratix | Stratix | Stratix |
| Speed Grade | C7 | C6 (slower) | C6 (slower) | C5 (slowest) | C5 (slowest) | C7 (same) |
| Logic Elements | 32470 | 32470 | 32470 | 32470 | 32470 | 25660 (-22%) |
| Number of I/O | 726 | 726 | 726 | 726 | 726 | 706 (-3%) |
| Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lead-Free (N suffix) | No (C7 no N suffix) | No | Yes (N suffix) | No | Yes (N suffix) | No |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Highest speed grade in the Stratix FC-FBGA-1020 family (vs EP1S30F1020C6 / EP1S30F1020C5)
- Highest-density member of the Stratix family in the 1020-ball footprint (vs EP1S25F1020C7)
- Mature design ecosystem with extensive reference designs (vs EP1S30F1020C7 vs newer Agilex / Stratix 10)
설계 노트
The FC-FBGA-1020 substrate requires a high-density multilayer PCB stack-up with dedicated power and ground planes directly beneath the device. Use of microvia or stacked-via technology under the 1 mm pitch BGA is mandatory; through-hole vias alone cannot escape the inner-ball grid. Designers should follow Altera's Stratix Hardware Reference Manual pin-out-specific decoupling guidelines, with high-frequency decoupling capacitors placed on the opposite side of the FPGA within the ball-array projection area to minimize power-rail inductance.
Estimated: at maximum toggle rate and high I/O utilization, the EP1S30F1020C7 can dissipate up to 8-10 W. With the FC-FBGA-1020 package mounted on a JEDEC-standard test board, junction-to-ambient thermal resistance (theta_JA) is typically 15-20 C/W, supporting passive cooling in still air up to ~5 W dissipation. For high-density designs approaching maximum toggle activity, attach a heatsink via thermal interface material to the package top surface and provide forced-air cooling to keep junction temperature below 100 C at 85 C ambient.
Common pitfalls when designing with this part include selecting the wrong configuration scheme, neglecting the CONFIG_DONE and nSTATUS pull-up resistors required for AS mode, and underestimating the configuration time for large bitstreams. Always include a JTAG header for boundary-scan testing and in-field programming access. The Quartus II software has been declared end-of-life by Intel - new designs should consider Stratix IV/V or Agilex for long-term support unless legacy compatibility is mandatory.
규정 준수 정보
RoHS, REACH, and halogen-free status were not explicitly confirmed in the verified web data; lead-free status inferred from absence of the N suffix in the MPN. AEC-Q100 is not applicable - this is an FPGA, not an automotive-qualified IC. Refer to manufacturer's product page for authoritative compliance documentation.
