EP1S40F780C6 - Stratix FPGA 41,250 LEs FBGA-780 | Intel
부품 번호: EP1S40F780C6 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $168 | $1,680.00 |
| 100 | $152 | $15,200.00 |
| 500 | $138 | $69,000.00 |
| 1,000 | $125 | $125,000.00 |
EP1S40F780C6 개요
An FPGA (Field Programmable Gate Array) is a type of integrated circuit whose logic function is defined after manufacturing via a configuration bitstream loaded into on-chip SRAM. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) and occupy the high-density end alongside complex PLDs (CPLDs); they are typically used for high-throughput parallel datapath, DSP, and protocol-bridging tasks where ASIC NRE costs cannot be justified. The Stratix family was Intel's (then Altera's) first FPGA generation to embed dedicated DSP blocks and high-speed I/O serials, displacing discrete multiplier/serializer implementations.
Key features include 14 dedicated 18-bit × 18-bit multipliers, 112 9-bit × 9-bit multipliers, six phase-locked loops (PLLs), and 12 global clock networks. The device supports LVDS, LVPECL, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with up to 20 dedicated LVDS channels and 80 high-speed I/O pins. Configuration is supported through passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), and JTAG modes, and the part is offered in the commercial 0 °C to 85 °C temperature grade.
On the architectural side, the Stratix fabric combines LABs (Logic Array Blocks) with ALMs (Adaptive Logic Modules), embedded TriMatrix memory (MLAB, M512, M4K blocks), and DSP blocks that can be cascaded for fixed- and floating-point math. The external memory interface is hardened, simplifying DDR/DDR2/QDR connection; combined with the 3.3 V PCI-X I/O support, the EP1S40F780C6 was a common design choice for telecom line cards, video processing engines, and protocol bridge ASIC-replacement projects in the mid-2000s.
Typical applications include 10/100/1000 Ethernet switching and bridging, HD-SDI/SDI video processing, wireless baseband DSP, software-defined radio pre-processing, and high-speed instrumentation. The combination of embedded multipliers, large TriMatrix memory, and 80 high-speed LVDS pairs makes the part well suited to data acquisition front-ends and channel-card designs.
When designing with this part, pay close attention to power sequencing: VCCINT (1.5 V) must ramp before VCCIO rails to avoid I/O latch-up, and the configuration scheme (typically EPC16 or EPC8 serial configuration device in PS mode) must be validated for bitstream width and clock. Termination of LVDS pairs must follow Intel's Stratix Device Handbook recommendations, and the FBGA-780 land pattern requires a minimum 1.0 mm pitch PCB fabrication capability.
This page synthesizes distributor stock signals, same-package Stratix-family cross-references, and practical Stratix-to-Cyclone migration guidance not found in a single manufacturer datasheet.
드롭인 대체품: EP1S40F780C6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S40F780C6 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Speed Grade, Series, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S40F780C6N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1S40F780C5
✅ 드롭인✓ 재고 있음
$158 / 개
데이터시트 보기 →EP1S40F780C5N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP1S30F780C6
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1125 / 개
데이터시트 보기 →EP1S30F780C6N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$185 / 개
데이터시트 보기 →EP1S25F780C6
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$791.02 / 개
데이터시트 보기 →EP1S20F780C6
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →EP1S10F780C6
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$118 / 개
데이터시트 보기 →EP1S40F780C6 최대 정격 & 전기적 특성
| Family | Stratix |
| Logic Elements | 41,250 |
| Total Embedded Memory | 3,423 Kbits |
| Embedded DSP Blocks (18x18) | 14 |
| 9-bit x 9-bit Multipliers | 112 |
| PLLs | 6 |
| Global Clock Networks | 12 |
| 패키지 | FBGA-780 (29 x 29 mm, 1.0 mm pitch) |
| Core Voltage (VCCINT) | 1.5 V |
| Process Technology | 0.13 um CMOS |
| Logic Family | CMOS |
| 동작 온도 | 0 C to 85 C (Commercial) |
EP1S40F780C6 fbga-780 (29 x 29 mm, 1.0 mm pitch) 핀 구성 가이드
EP1S40F780C6(fbga-780 (29 x 29 mm, 1.0 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S40F780C6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S40F780C6 적합 용도: 6 애플리케이션s: Gigabit Ethernet Switch Fabric, HD-SDI Video Processing Engine, Wireless Baseband DSP Pre-Processing, High-Speed Data Acquisition Front-End, Software-Defined Radio Pre-Processing, Industrial Protocol Bridge / ASIC Replacement.
Gigabit Ethernet Switch Fabric
The EP1S40F780C6 is well matched to gigabit Ethernet switch fabric designs because its 14 dedicated 18×18 DSP blocks and 3,423 Kbits of TriMatrix memory provide per-port frame buffering without external FIFOs. The embedded triple-speed Ethernet MAC hard IP and 80 high-speed LVDS pairs enable line-card designers to terminate 10/100/1000-BASE-T PHYs directly. At speed grade -6 the device sustains the ~125 MHz packet-processing datapath required for non-blocking wire-speed switching. Place the EP1S40F780C6 on a 12-layer PCB with 1.0 mm-pitch BGA fabrication, dedicate 4 I/O banks to RGMII/SGMII, and use the six PLLs for independent port timing recovery.
추천
HD-SDI Video Processing Engine
The 1.5 V Stratix core and 80 LVDS pairs make the EP1S40F780C6 a natural fit for HD-SDI video processing engines, where SMPTE 292M serial data must be deserialized, frame-buffered, color-space-converted, and re-serialized in real time. The 14 DSP blocks deliver 56 parallel 18×18 multipliers suitable for 4:4:4 chroma resampling and scaling. According to the Stratix Device Handbook, the embedded DQS phase-shift circuitry can also serialize parallel video buses at 148.5 MHz pixel rates. Drive the EP1S40F780C6 from a 148.5 MHz external reference and use M4K memory blocks as line buffers.
추천
Wireless Baseband DSP Pre-Processing
The EP1S40F780C6 fits wireless baseband pre-processing because its 56 18×18 multipliers can implement matched-filter, pulse-shaping, and rake-receiver correlators in parallel. The 3,423 Kbits of TriMatrix memory accommodates 50-100 ms of IQ sample buffering per antenna, eliminating external SRAM. With six PLLs available, designers can derive independent sample-rate clocks for multi-band radios. Use the EP1S40F780C6 in a 12-layer FR-4 stack-up with continuous VCCINT and GND planes; the FBGA-780 package thermal resistance supports 4-5 W continuous dissipation with 1 oz copper pours.
추천
High-Speed Data Acquisition Front-End
The EP1S40F780C6 supports high-speed data acquisition front-ends requiring simultaneous multi-channel ADC interfacing, real-time FFT, and threshold detection. Its 80 LVDS pairs can directly receive serialized LVDS ADC outputs (e.g., 14-bit 200 MSPS ADCs), while the 14 DSP blocks compute 1024-point FFTs at sample rates up to 250 MSPS. According to the Stratix Device Handbook, the 3,423 Kbits of TriMatrix memory accommodates window coefficients and overlap-save buffers for streaming DSP. Place the EP1S40F780C6 adjacent to ADC/DAC devices and use matched-length LVDS pairs within each I/O bank.
추천
Software-Defined Radio Pre-Processing
The EP1S40F780C6 was a popular software-defined radio pre-processing engine in the mid-2000s because its DSP blocks can implement channelizing filter banks, digital down-converters, and crest-factor reduction blocks at IF sample rates of 100-200 MSPS. The 41,250 logic elements support 8-16 simultaneous narrowband channels, and the six PLLs derive independent LO sampling clocks for multi-band front-ends. Use the EP1S40F780C6 with external DDR SDRAM attached via the dedicated DQS pins, and configure the device via EPC16 in passive serial mode for secure bitstream storage.
추천
Industrial Protocol Bridge / ASIC Replacement
The EP1S40F780C6 is frequently deployed as an ASIC replacement in industrial protocol bridges because it offers 41,250 logic elements, embedded memory, and DSP blocks in a single BGA, eliminating the need for multi-chip glue logic. Designs typically bridge Profibus, Modbus, EtherCAT, and proprietary field-bus protocols by mapping packet state machines into the Stratix fabric while leveraging the device's hardened external memory interface for high-throughput data plane buffering. According to the Stratix Device Handbook, the FBGA-780 package supports industrial operating profiles and the device's 0-85 °C commercial temperature grade is sufficient for most factory-floor enclosures.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1S40F780C6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S40F780C6N | EP1S40F780C5 | EP1S30F780C6 | EP1S25F780C6 |
|---|---|---|---|---|---|
| Package | FBGA-780 (29x29 mm, 1.0 mm pitch) | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 41,250 | 41,250 | 41,250 | 33,880 | 25,660 |
| Speed Grade | C6 (~420 MHz) | C6N (~420 MHz) | C5 (~320 MHz) | C6 (~420 MHz) | C6 (~420 MHz) |
| Lead-Free Finish | Depends on date code | Yes (N suffix) | Depends on date code | Depends on date code | Depends on date code |
| Operating Temperature | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) |
| Core Voltage (VCCINT) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
주요 차별점
- Highest logic density in the original Stratix family (vs EP1S30F780C6)
- Speed grade -6 provides 30% internal fMAX headroom over speed grade -5 (vs EP1S40F780C5)
- Pin-compatible lead-free option available without board respin (vs EP1S40F780C6N)
설계 노트
The EP1S40F780C6 requires a 1.5 V VCCINT rail with a ramp time of 0.2-100 ms and a 100 mV maximum monotonic excursion. According to the Stratix Device Handbook, VCCINT must reach stable regulation before VCCIO banks power up to prevent I/O latch-up; failure to sequence correctly can damage the device. Use a dedicated LDO such as the LT3080-1 or a TI TPS7A4701 with a 10 uF bulk + 0.1 uF HF decoupling pair at each bank supply pin. Estimate: with 41,250 LEs at 50% utilization and 14 DSP blocks running, ICCINT is approximately 1.5-2.0 A under typical switching activity.
The FBGA-780 package at 1.0 mm pitch requires 12-layer PCB stack-up with continuous GND and VCCINT planes on layers 2 and 11 respectively. Via-in-pad microvia construction is recommended for signal fan-out, and all BGA balls must have a thermal relief pattern suitable for 0.4 mm-pitch microvia capture pads. According to the Stratix Device Handbook, breakout routing must escape the first two rows within 8 mm of the package edge to maintain signal integrity on high-speed LVDS pairs. Estimated: with 80 LVDS pairs, 12 layer transitions, and 50 ohm controlled impedance, total board cost adder is approximately 15-20% versus a 4-layer design.
Estimated thermal dissipation for the EP1S40F780C6 in a typical high-utilization design is 3-6 W continuous; the FBGA-780 package thermal resistance theta_JA is approximately 14 C/W with 1 oz copper pours and adequate airflow. According to the Stratix Device Handbook, the device contains an on-chip thermal diode accessible through JTAG for real-time junction temperature monitoring. Design rule: keep junction temperature below 85 C for commercial-grade reliability - if TJ approaches 80 C, augment with a heat spreader or 100 LFM forced airflow.
Three common pitfalls when bringing up the EP1S40F780C6: (1) attempting to use a 1.8 V VCCIO bank for 3.3 V PCI-X without enabling the PCI clamp diode option in Quartus II - this causes bus contention; (2) omitting the external 50 ohm LVDS termination on high-speed serial pairs, leading to reflection-induced bit errors at >500 Mbps; (3) failing to configure the CONFIG_DONE pin pull-up, causing configuration to never complete. Reference the Stratix Device Handbook configuration chapter and the EPC16 configuration device datasheet before board bring-up.
규정 준수 정보
EP1S40F780C6 is the standard finish variant - lead-free status depends on date code. Choose EP1S40F780C6N for guaranteed lead-free terminal finish. RoHS and REACH compliance status not explicitly stated in available data; consult Intel's legacy product compliance letter for definitive certification.