EP1S25F780C5 - Stratix I FPGA, 25,660 LEs, 597 I/O, 780-FBGA | Altera / Intel
부품 번호: EP1S25F780C5 ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1549.9 | $1,549.90 |
| 10 | $1472.5 | $14,725.00 |
| 25 | $1399.2 | $34,980.00 |
| 100 | $1299 | $129,900.00 |
| 250 | $1249.5 | $312,375.00 |
EP1S25F780C5 개요
An FPGA (Field-Programmable Gate Array) is a programmable logic device in the semiconductor hierarchy: FPGA -> programmable logic -> ASIC-class device -> integrated circuit. FPGAs are used to implement custom digital logic, glue logic, signal processing pipelines, and high-speed interfaces after the PCB has been fabricated, enabling late-stage design changes and accelerating time to market versus a full ASIC. Stratix I FPGAs were Altera's first generation to combine embedded multipliers, large TriMatrix memory blocks, and high-speed LVDS transceivers on a single die.
Key differentiating features include 80 (typical) embedded DSP blocks for 9x9-bit to 36x36-bit multiplication, 14 clock networks with up to 8 PLLs per device, support for external memory interfaces such as DDR SDRAM, QDR SRAM, and ZBT SRAM, and 1.5 V core operation. The 780-FBGA package exposes 597 user I/O across 8 banks, providing abundant LVDS pairs and routing flexibility for memory-rich and I/O-intensive designs.
The architecture is well suited to telecom line cards, digital video broadcasting equipment, and high-speed serial interfaces where a large logic budget plus embedded multipliers reduce external component count. The 'C5' speed grade trades absolute Fmax for lower static power, making the C5 variant a typical choice for industrial-grade designs that prioritize thermal margin over raw clock rate.
Typical applications include telecom baseband processing, software-defined radio (SDR), high-end image processing, and ASIC prototyping platforms. Designers should pay particular attention to power estimation with the Quartus II PowerPlay tool because the static current scales strongly with VCCINT and junction temperature.
드롭인 대체품: EP1S25F780C5 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S25F780C5 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, DSP Blocks, Mounting Type, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S25F780C6N
✅ 드롭인✓ 재고 있음
$780 / 개
데이터시트 보기 →EP1S25F780C7
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP1S25F780I7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1S25F780I6N
✅ 드롭인✓ 재고 있음
$1250 / 개
데이터시트 보기 →EP1S25F780C5N
✅ 드롭인✓ 재고 있음
$595 / 개
데이터시트 보기 →EP1S25F780C7N
✅ 드롭인✓ 재고 있음
$588.2 / 개
데이터시트 보기 →EP1S25F780C5 최대 정격 & 전기적 특성
| Family | Stratix I |
| Logic Elements | 25,660 |
| Logic Array Blocks (LABs) | 2,566 |
| Total RAM Bits | 1,944,576 |
| Embedded Multipliers (DSP blocks) | 80 (typical) |
| User I/O Count | 597 |
| 패키지 | 780-FBGA (29x29 mm) |
| Core Voltage (VCCINT) | 1.425 V to 1.575 V |
| Speed Grade | C5 |
| Operating Temperature (TJ) | 0 °C to +85 °C (commercial) |
| Process Technology | 0.13 µm CMOS, SRAM-based |
| LVDS Performance | Up to 7.6 Gbps (claim per family datasheet) |
| PLLs | Up to 8 per device |
| Global Clock Networks | 14 |
| 실장 유형 | Surface Mount (SMT, BGA) |
| RoHS 상태 | Compliant per Altera product page |
EP1S25F780C5 780-fbga (29x29 mm) 핀 구성 가이드
EP1S25F780C5(780-fbga (29x29 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S25F780C5.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S25F780C5 적합 용도: 6 애플리케이션s: Telecom Line-Card Interface, Software-Defined Radio (SDR) Baseband, High-End Video Broadcast Processing, ASIC Prototyping Platform, Industrial High-Speed Motion Control, Medical Imaging Pre-Processor.
Telecom Line-Card Interface
The EP1S25F780C5's 25,660 Logic Elements plus 80 embedded DSP blocks and 597 user I/O make it well suited for telecom line-card interfaces where multi-protocol bridging and packet processing must coexist on one board. Its TriMatrix embedded memory provides 1,944,576 bits for buffer descriptors, lookup tables, and traffic-shaping queues; the dedicated DDR/DDR2/QDR memory interface controllers centre DQS on byte lanes without external delay lines. With the C5 speed grade, designers trade absolute Fmax for lower static power in thermally constrained PoL bays. The 780-FBGA package's 29 × 29 mm footprint exposes enough LVDS pairs for SGMII, SPI-4.2, and POS-PHY Level 4 interconnects while keeping board layer count manageable. Compared to a discrete ASIC + companion FPGA design, the EP1S25F780C5 collapses glue logic, framer, and SERDES bridge into one silicon, simplifying the BOM.
추천
Software-Defined Radio (SDR) Baseband
For SDR baseband designs, the EP1S25F780C5's 80 dedicated 9 × 9-bit to 36 × 36-bit multipliers enable FFT, FIR, and channelisation pipelines that would otherwise need a separate DSP chip. The TriMatrix memory's true-dual-port blocks support simultaneous ADC sample buffering and DAC waveform generation at rates above 100 MSPS, while the 14 global clock networks and up to 8 PLLs allow multiple ADC/DAC clock domains with sub-ps jitter. The 597 I/O accommodate LVDS ADC data buses, control planes, and high-speed serial links without external muxing. Designers commonly use the C5 grade to balance thermal budget against Fmax, since SDR enclosures are usually sealed without forced-air cooling. The 1.5 V VCCINT core further lowers power relative to earlier 2.5 V FPGAs, helping meet MIL-STD-704 or ETSI EN 300 019 thermal envelopes.
추천
High-End Video Broadcast Processing
Broadcast video processing benefits from the EP1S25F780C5's 7.6 Gbps LVDS capability and 597 user I/O, which support HD-SDI, 3G-SDI, and dual-link SDI inputs in parallel with DVB-ASI or SMPTE 310 streams. Its 80 embedded multipliers handle chroma upsampling, scaling, and deinterlacing without external DSP chips; the 1,944,576-bit embedded RAM provides multiple line buffers for high-quality motion-adaptive deinterlacing. Designers use the C5 speed grade to keep static power in check for studio rack equipment that runs 24/7. The 780-FBGA's dense BGA fan-out also simplifies multilayer PCB stack-up for high-speed serial video. Compared to a multi-chip ASIC + FPGA approach, the EP1S25F780C5 reduces board area while supporting late-binding changes via SRAM-based configuration.
추천
ASIC Prototyping Platform
The EP1S25F780C5 is commonly used as a vehicle for ASIC prototyping because 25,660 LEs provide enough headroom to instantiate a multi-million-gate ASIC's RTL at lower clock rates while preserving functional accuracy. The Stratix I TriMatrix memory blocks, 597 I/O, and dedicated external memory interfaces allow prototype mapping of complex SoC subsystems, including ARM-style AHB/AXI bridges and DDR controllers. Quartus II's incremental compilation supports multi-engineer teams to bring up RTL blocks in parallel on the same device, shortening tape-out schedules. The C5 speed grade's slower Fmax is often sufficient for functional verification where the goal is feature bring-up rather than at-speed validation. The 780-FBGA package also routes cleanly into Logic Analyzer pods and breakout adapters, which is essential during multi-clock-domain debug sessions.
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Industrial High-Speed Motion Control
Industrial motion controllers benefit from the EP1S25F780C5's combination of 80 DSP blocks (for PID, state-space, and Kalman filters), 597 I/O (for encoder, resolver, and resolver-to-digital feedback channels), and 1.5 V low-power operation that suits 24 V industrial bus systems. The 14 global clock networks synchronise multiple axis loops without jitter skew, and the C5 commercial speed grade handles typical 50–200 kHz PWM switching frequencies with margin to spare. The 780-FBGA's package-level thermal performance supports fan-less operation when paired with adequate PCB copper pours. Designers can also integrate safety logic such as STO (Safe Torque Off) directly in the FPGA, eliminating external safety relays. According to the Stratix device handbook, the FPGA's configuration is reloadable on the factory floor for field upgrades, which is critical for serviceability in industrial automation.
추천
Medical Imaging Pre-Processor
Medical imaging pre-processing pipelines such as CT, ultrasound, and digital X-ray benefit from the EP1S25F780C5's parallel DSP capacity (80 multipliers) for beamforming, image reconstruction, and noise filtering. The TriMatrix memory's true-dual-port blocks enable simultaneous ADC sample ingestion and processed-frame transmission to a host CPU, while the DDR/DDR2 controllers handle large image frame buffers. With 597 I/O, the FPGA can connect to multiple analog front ends plus Camera Link or LVDS display outputs without glue logic. The C5 speed grade's lower static power also helps meet IEC 60601-1 thermal limits for medical cart equipment. Designers typically implement DICOM metadata insertion and on-screen overlay directly in the FPGA, offloading the host processor. The 780-FBGA package's 29 × 29 mm footprint simplifies routing of high-speed differential pairs on medical-grade PCBs.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1S25F780C5 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S25F780C6N | EP1S25F780C7 | EP1S25F780I7N | EP1S25F780I6N | EP1S25F780C5N |
|---|---|---|---|---|---|---|
| Package | 780-FBGA (29x29 mm) | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Speed Grade | C5 | C6 | C7 | I7 | I6 | C5 |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| User I/O Count | 597 | 597 | 597 | 597 | 597 | 597 |
| Embedded RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Embedded Multipliers (DSP) | 80 | 80 | 80 | 80 | 80 | 80 |
| Operating Temperature | 0°C to +85°C (Commercial) | 0°C to +85°C | 0°C to +85°C | -40°C to +100°C (Industrial) | -40°C to +100°C (Industrial) | 0°C to +85°C |
주요 차별점
- Highest mid-density Stratix I with 597 user I/O (vs EP1S20F780C5N)
- C5 grade balances Fmax against thermal margin (vs EP1S25F780C7N)
- TriMatrix memory architecture with 1,944,576 bits (vs EP1S10F780C5N)
설계 노트
Estimated: Stratix I devices draw 1–3 W of static current at 1.5 V VCCINT scaled with junction temperature and design utilisation. Designers must size the 1.5 V regulator to handle Icc_int peaks above 3 A during simultaneous block-RAM write bursts. Use Altera's PowerPlay Early Power Estimator before layout to balance decoupling against inductor saturation current, and add 220 µF bulk caps near each VCCINT pin group to suppress inrush during power-up.
The 780-FBGA's 1.0 mm ball pitch demands a minimum 8-layer PCB stack-up with 50 Ω controlled-impedance routing for LVDS pairs. According to Altera's Stratix I hardware design guidelines, all eight I/O banks require dedicated VCCIO rails that can be driven from independent supplies (1.5 V, 1.8 V, 2.5 V, 3.3 V). Decoupling: place 0.1 µF and 0.01 µF X7R ceramics within 100 mils of every VCCINT/VCCIO pin pair to suppress simultaneous switching noise.
Configuration will fail silently if the EPCS configuration memory is mis-sized for the bitstream; the EP1S25F780C5 typically needs an EPCS16 or larger. Always strap MSEL pins correctly for the chosen configuration mode (AS, PS, FPP, JTAG) before power-up; mixing modes causes the device to remain in reset. Also, the C5 speed grade trades Fmax for thermal margin—do not close timing at C7 margins and assume C5 will work without re-running the Quartus II timing analysis.
규정 준수 정보
RoHS compliance per Altera product page; 'N' suffix denotes Pb-free / RoHS ball finish. AEC-Q100 not applicable (FPGA is not an automotive-qualified IC at the part level).
