EP1S80F1020C5 - Stratix 80,640 LEs 1020-BGA FPGA | Altera
부품 번호: EP1S80F1020C5 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $980 | $980.00 |
| 10 | $920 | $9,200.00 |
| 100 | $860 | $86,000.00 |
| 500 | $800 | $400,000.00 |
| 1,000 | $745 | $745,000.00 |
EP1S80F1020C5 개요
An FPGA (Field Programmable Gate Array) is a programmable logic device containing configurable logic blocks (LEs/ALMs), programmable interconnect, and hard IP blocks such as block RAM, DSP multipliers, PLLs, and I/O serdes. FPGAs are programmed via HDL (VHDL/Verilog) and synthesized into bitstreams that configure the device at power-up. Compared to ASICs, FPGAs offer faster time-to-market, lower NRE, and field re-programmability; compared to CPLDs, FPGAs provide higher logic density, larger embedded memory, and parallel DSP throughput. The Stratix family occupies the high-density, feature-rich tier of the FPGA hierarchy: FPGA → programmable logic → digital IC → semiconductor.
Key features include 80,640 logic elements organized in 7,904 LABs, 12 embedded DSP blocks, 12 PLLs, 6 phase-locked clock networks, and 7,427,520 bits of TriMatrix memory split across M512, M4K, and M-RAM blocks. The device supports 21 multi-standard I/O banks with LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCI/PCI-X interfaces. Per the Stratix Device Family Data Sheet, the EP1S80F1020C5 is the largest density in the Stratix family and is suited to the most aggressive ASIC-prototyping and system-on-chip integration tasks of its era.
The EP1S80F1020C5 is used in communications infrastructure, ASIC prototyping, high-performance DSP, video/image processing, military/aerospace signal processing, and storage system designs where 80 K LEs of logic and large embedded memory are required. Typical applications include software-defined radio, multi-channel baseband processing, encryption accelerators, and high-speed bridging between legacy parallel buses and serial interfaces.
When designing with the EP1S80F1020C5, careful PCB layout is required for the 1020-ball 33×33 mm FCBGA package, including BGA escape routing, matched-length differential pairs for LVDS, and a multilayer PCB with dedicated power and ground planes. Heat removal on the C5 speed grade is generally passive in typical indoor enclosures, but thermally-challenged enclosures may require airflow or a heat spreader.
드롭인 대체품: EP1S80F1020C5 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S80F1020C5 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, RoHS Status, Speed Grade, Package Type, Logic Elements.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S80F1020C6
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1180 / 개
데이터시트 보기 →EP1S80F1020C7
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$195 / 개
데이터시트 보기 →EP1S80F1020I6
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP1S80F1020C5N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →EP1S80F1020C5AA
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP1S80F1020C5 최대 정격 & 전기적 특성
| Family | Stratix |
| Logic Elements | 80,640 |
| Logic Array Blocks (LABs) | 7,904 |
| Total RAM Bits | 7,427,520 |
| Embedded DSP Blocks | 12 (9-bit × 9-bit multipliers) |
| PLLs | 12 |
| Maximum User I/Os | 773 |
| I/O Banks | 21 |
| 패키지 | 1020-ball FCBGA, 33 × 33 mm, 1 mm pitch |
| Process Technology | 0.13 µm CMOS |
| 동작 온도 | 0 °C to 85 °C (Commercial) |
| Speed Grade | C5 |
| 공급 전압 | Stratix core/I/O multi-rail (per datasheet) |
| Logic Family | CMOS |
| 실장 유형 | Surface Mount (BGA) |
EP1S80F1020C5 1020-ball fcbga, 33 × 33 mm, 1 mm pitch 핀 구성 가이드
EP1S80F1020C5(1020-ball fcbga, 33 × 33 mm, 1 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S80F1020C5.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S80F1020C5 적합 용도: 6 애플리케이션s: ASIC Prototyping and Emulation, Communications Infrastructure - Baseband and Protocol Processing, High-Performance DSP and Image Processing, Software-Defined Radio (SDR) Front Ends, Military and Aerospace Signal Processing, Storage System Controllers and Protocol Bridges.
ASIC Prototyping and Emulation
The EP1S80F1020C5's 80,640 logic elements and 7,427,520 RAM bits make it the highest-density member of the original Stratix family, ideal for ASIC prototyping and emulation where one FPGA must host hundreds of thousands of gates of pre-silicon RTL. The 12 embedded DSP blocks and 12 PLLs allow prototyping of complex DSP and clock-domain structures. In a typical ASIC-emulation flow the EP1S80F1020C5 sits on a multi-FPGAs board, partitioned by synthesis tools that target Quartus II. Its 773 user I/Os and 21 I/O banks deliver enough bandwidth to drive external logic analyzers and high-speed transactors during bring-up.
추천
Communications Infrastructure - Baseband and Protocol Processing
With 80 K LEs, 12 DSP blocks, and high I/O count, the EP1S80F1020C5 supports multi-channel baseband DSP, protocol bridging, and packet processing in legacy telecommunications infrastructure. The TriMatrix memory (M512 + M4K + M-RAM) provides the on-chip storage required for sample buffering and lookup tables in WCDMA/GSM channel cards, while the 12 PLLs synthesize the multiple clock domains needed for serial backplane and TDM interfaces. The 21 I/O banks with LVDS/SSTL/HSTL support connect directly to industry-standard backplane transceivers of its era. As of 2026, this application is in long-lifecycle support rather than new design.
추천
High-Performance DSP and Image Processing
The EP1S80F1020C5's 12 dedicated 9-bit × 9-bit DSP blocks deliver tens of billions of MAC operations per second for FIR filters, FFT engines, and motion-estimation kernels in real-time video and signal processing pipelines. The combination of 7.4 Mbit TriMatrix memory and 80 K LEs enables line buffers, coefficient storage, and frame buffers to be kept on-chip, avoiding external memory bandwidth bottlenecks. The 1020-ball FCBGA package supports enough LVDS pairs to drive multi-camera or multi-channel radar front ends. Designs targeting SDR, video codecs, and radar signal processing from the Stratix era benefit from this density tier.
추천
Software-Defined Radio (SDR) Front Ends
The EP1S80F1020C5 supports the digital down-conversion, channelization, and modulation/demodulation functions central to SDR platforms operating in the VHF/UHF band of its era. The 12 DSP blocks implement polyphase filterbanks, CORDIC rotator, and turbo-decoder kernels, while the 7,427,520 RAM bits hold sample buffers and constellation LUTs. LVDS I/O pairs connect to ADC and DAC front ends; 12 PLLs derive the multi-rate clocking required by modern radio architectures. While today's SDR designs use Zynq or Stratix 10 with RFSoC, the EP1S80F1020C5 remains a viable device for installed military and aerospace SDR systems.
추천
Military and Aerospace Signal Processing
The EP1S80F1020C5 in its I-grade (-40 °C to 100 °C) variant supports military and aerospace platforms where single-source long-lifecycle silicon is required for sustained production runs. With 80,640 LEs, the EP1S80 enables sensor-fusion, electronic-warfare, and radar-processing applications in deployed platforms where PCB redesign is impractical. 7.4 Mbit of TriMatrix memory and 12 DSP blocks support real-time pulse-Doppler, SAR, and beamforming kernels. The 1020-ball FCBGA withstands the shock and vibration profiles of airborne and naval environments when paired with proper underfill and substrate design.
추천
Storage System Controllers and Protocol Bridges
The EP1S80F1020C5 supports high-throughput storage controllers and protocol-bridge designs, including Fibre Channel, SAS, SATA, and legacy parallel-ATA bridging applications prevalent in the Stratix design era. The 773 user I/Os and LVDS capability deliver the bandwidth required for multi-port SAS controllers and RAID engines, while 7.4 Mbit of embedded RAM holds sector buffers, command queues, and XOR compute data. 12 PLLs synthesize the multiple clock domains required by independent storage ports. Engineers maintaining long-lifecycle enterprise storage products continue to source this part through authorized legacy-stock channels as of 2026.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1S80F1020C5 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S80F1020C6 | EP1S80F1020C7 | EP1S80F1020I6 | EP1S80F1020C5N | EP1S80F1020C5AA |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1020-ball FCBGA 33x33 mm | 1020-ball FCBGA 33x33 mm - same | 1020-ball FCBGA 33x33 mm - same | 1020-ball FCBGA 33x33 mm - same | 1020-ball FCBGA 33x33 mm - same | 1020-ball FCBGA 33x33 mm - same |
| Logic Elements | 80,640 | 80,640 | 80,640 | 80,640 | 80,640 | 80,640 |
| Speed Grade | C5 (slowest) | C6 (mid) | C7 (fastest) | I6 (industrial, mid) | C5 (same as base) | C5 (same as base) |
| Operating Temperature | 0C to 85C (Commercial) | 0C to 85C (Commercial) | 0C to 85C (Commercial) | -40C to 100C (Industrial) | 0C to 85C (Commercial) | 0C to 85C (Commercial) |
| Total RAM Bits | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 |
| Embedded DSP Blocks | 12 | 12 | 12 | 12 | 12 | 12 |
| Maximum User I/Os | 773 | 773 | 773 | 773 | 773 | 773 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- C5 is the lowest-cost speed grade in the EP1S80 family (vs EP1S80F1020C6)
- Same Stratix silicon available in industrial temperature (vs EP1S80F1020I6)
- Lead-free assembly option (vs EP1S80F1020C5N)
설계 노트
The 1020-ball FCBGA at 1 mm pitch requires a multilayer PCB (typically 8-12 layers) with microvia or stacked-via technology for BGA escape. Matched-length differential pairs are mandatory for LVDS pairs routed from the Stratix I/O banks. Per Altera Stratix hardware guidelines, dedicate at least two inner layers to GND and one to each Stratix core voltage rail. Use the Quartus II Pin Planner to verify pin assignments before final routing, and consider Xilinx/Altera reference designators and de-coupling capacitor placement guidelines (typically 0.1 µF + 10 µF per power pin group) to suppress simultaneous-switching-noise (SSN) on the 21 I/O banks.
Estimated: at 80% utilization with 200 MHz internal clock, the EP1S80F1020C5 dissipates roughly 5-8 W. The 33×33 mm FCBGA theta_JA is approximately 12 C/W with a JEDEC JESD51 still-air test board, so junction-to-ambient rise is 60-95 C above ambient. In an enclosed chassis with no airflow, supply temperature can push Tj close to the 85 C commercial limit. Recommended: 200-400 LFM airflow, copper heat spreader, or thermal interface material for production deployments. Industrial-temperature (-40 C to 100 C) variants of the same silicon exist as I-grade and are recommended for harsh environments.
Three pitfalls are common when designing with EP1S80F1020C5. First, configuring the device with the wrong JTAG chain or missing EPC configuration device renders the board unable to boot - always verify the configuration scheme (Passive Serial, Fast Passive Parallel, or JTAG) against the chosen EPC16/EPC64/EPC128 configuration memory. Second, ignoring the Stratix power-on sequence (VCCINT before VCCIO with specific rise-time requirements) can damage internal ESD structures during hot-plug events. Third, assuming the EP1S80F1020C5 bitstream is compatible with EP1S60F1020C5 - they are not, even though they share the same 1020-ball FCBGA package; recompilation in Quartus II is required.
규정 준수 정보
RoHS/lead-free status not explicitly confirmed in distributor data. Original Stratix family (130 nm) predates widespread RoHS conversion. Request latest material declaration from authorized legacy-stock distributors (Rochester Electronics) before using in RoHS-required designs. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. For new designs requiring automotive qualification, choose Cyclone IV/V or Arria families.
