EP1S60F1020C5 - 57K-Cell Stratix FPGA, 1020-BGA | Altera/Intel
MPN: EP1S60F1020C5 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $171 | $171,000.00 |
Drop-in alternatives for EP1S60F1020C5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S60F1020C5N
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View Datasheet →EP1S60F1020C6N
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View Datasheet →EP1S60F1020C6
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View Datasheet →EP1S60F1020C7N
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View Datasheet →EP1S60F1020I6
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View Datasheet →EP1S60F1020I6N
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View Datasheet →EP1S60F1020C5 Maximum Ratings & Electrical Characteristics
| Series | Stratix |
| Family | Stratix (EP1S) |
| Logic Elements | 57,120 |
| Configurable Logic Blocks (CLBs) | 6,570 |
| Total RAM Bits | 5,215,104 (5.2 Mbit) |
| User I/O Pins | 773 |
| Number of PLLs | 12 |
| Core Voltage | 1.5 V |
| I/O Voltage Tolerance | 3.3 V (multi-standard) |
| Operating Temperature | 0 C to 85 C (Commercial) |
| Package Type | FBGA-1020 (FineLine BGA) |
| Package Dimensions | 33 x 33 mm |
| Ball Pitch | 1.0 mm |
| Process Technology | 0.13 µm CMOS, 1.5 V core |
| Speed Grade | C5 |
| Mounting Type | Surface Mount |
EP1S60F1020C5 33 x 33 mm Pin Configuration Guide
Complete pinout information for EP1S60F1020C5 (33 x 33 mm package) with 773 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S60F1020C5.
Refer to the datasheet for full pin configuration.
Estimated pin count: 773 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S60F1020C5 is suitable for 6 applications: Software-Defined Radio (SDR) Baseband, High-Speed Telecommunication Line Cards, Real-Time Video Processing and Broadcast, ASIC Prototyping and Emulation, Medical Imaging (Ultrasound Front-End), Industrial Test and Measurement Instrumentation.
Software-Defined Radio (SDR) Baseband
The EP1S60F1020C5's 57,120 logic elements, dedicated DSP blocks (with 18x18 multipliers and accumulators), and 5.2 Mbit TriMatrix RAM make it well suited for SDR baseband processing. The 500 MHz internal DSP performance supports multi-carrier demodulation, channelization filters, and FFT-based OFDM processing in a single device. The 773 user I/Os allow parallel LVDS interfaces to wideband ADC front-ends, while 12 PLLs generate the multiple clock domains needed for digital up/down conversion. Designers typically pair the EP1S60 with a high-speed ADC and dedicated DAC to build a complete radio platform, using Quartus II DSP Builder for high-level synthesis of the signal-processing chain.
Recommended
High-Speed Telecommunication Line Cards
Telecommunication line cards require high logic density, large packet buffers, and many high-speed serial interfaces, all of which the EP1S60F1020C5 delivers. The 5.2 Mbit embedded RAM is used for FIFO queues and traffic-shaping structures, while the 773 user I/Os support parallel RapidIO, Utopia, or POS-PHY interfaces to network processors. The 12 PLLs provide the multiple clock domains needed for ingress/egress timing and SONET/SDH framing. The FBGA-1020 package also enables dense PCB layouts with controlled-impedance routing for backplane signaling. Designers often pair the EP1S60 with a StrataXGS or IXP network processor.
Recommended
Real-Time Video Processing and Broadcast
The EP1S60F1020C5 is a strong fit for real-time video processing in broadcast and surveillance equipment. The DSP blocks accelerate 2D FIR filtering, motion estimation, and color-space conversion, while the TriMatrix memory supports line buffers and frame stores for 720p/1080i processing. The 773 user I/Os accept parallel D1/HD-SDI inputs from decoders and drive HDMI encoders or DVI transmitters. With 57,120 logic elements, the device can host multiple video pipelines in parallel. Designers typically use Quartus II SOPC Builder to integrate a Nios II soft-core for control-plane functions.
Recommended
ASIC Prototyping and Emulation
The EP1S60F1020C5 was widely deployed in ASIC prototyping platforms in the mid-2000s, where its 57,120 logic elements and 5.2 Mbit RAM could emulate medium-complexity ASICs in a single chip. Multiple FPGAs can be wired together via LVDS to emulate larger designs. The large FBGA-1020 package exposes 773 user I/Os for inter-FPGA signals, and the TriMatrix memory approximates embedded SRAM blocks typical in ASIC designs. Quartus II offers gate-level synthesis from VHDL or Verilog netlists, supporting testbench-driven validation at near-real-time speeds.
Recommended
Medical Imaging (Ultrasound Front-End)
Ultrasound front-end processing demands high parallelism and DSP throughput, both of which the EP1S60F1020C5 provides. The dedicated DSP blocks perform beamforming, harmonic filtering, and envelope detection across 64-128 channels simultaneously. TriMatrix memory buffers raw RF samples before digital down-conversion, and the 12 PLLs generate per-channel sampling clocks. The 773 I/Os connect to multi-channel ADC banks and DACs that drive the transmit pulsers. According to the Altera medical imaging reference designs, this density of Stratix FPGA was the industry benchmark for mid-range ultrasound systems before Cyclone V/Arria V took over.
Recommended
Industrial Test and Measurement Instrumentation
Test and measurement instruments such as oscilloscopes, logic analyzers, and protocol analyzers rely on FPGAs to capture and process wide parallel data streams in real time. The EP1S60F1020C5's 773 user I/Os and 500 MHz internal logic are well matched to multi-channel logic-analyzer probes running at hundreds of MHz. The 5.2 Mbit RAM stores pre-trigger samples, while the DSP blocks perform on-the-fly protocol decoding (PCI Express Gen 1, SATA, USB 2.0). The 1.5 V core and 0.13 µm process keep power manageable in dense instrument chassis.
Recommended
Recommended Products Summary
Engineering reference data for EP1S60F1020C5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S60F1020C5N | EP1S60F1020C6N | EP1S60F1020C6 | EP1S60F1020I6N | EP1S60F1020C7N | EP1S60F1020I6 |
|---|---|---|---|---|---|---|---|
| Package | FBGA-1020 (33x33 mm, 1.0 mm pitch) | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 57,120 | 57,120 | 57,120 | 57,120 | 57,120 | 57,120 | 57,120 |
| Embedded RAM | 5,215,104 bits (5.2 Mbit) | 5,215,104 bits | 5,215,104 bits | 5,215,104 bits | 5,215,104 bits | 5,215,104 bits | 5,215,104 bits |
| Speed Grade | C5 | C5 | C6 (faster) | C6 (faster) | C6 (faster) | C7 (fastest) | C6 (faster) |
| Operating Temperature | 0 C to 85 C (Commercial) | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | -40 C to 100 C (Industrial) | 0 C to 85 C | -40 C to 100 C (Industrial) |
| Lead-Free / RoHS | No (SnPb finish) | Yes (Pb-free, RoHS) | Yes (Pb-free, RoHS) | No (SnPb) | Yes (Pb-free, RoHS) | Yes (Pb-free, RoHS) | No (SnPb) |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
| Approx. Unit Price @ qty 100 (USD) | 228.00 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Pin-to-pin compatible lead-free variant available (vs EP1S60F1020C5N)
- Faster speed grade option exists for timing-critical designs (vs EP1S60F1020C6N)
- Industrial temperature variant for harsh environments (vs EP1S60F1020I6)
Design Notes
The EP1S60F1020C5 requires a 1.5 V VCCINT core rail and selectable VCCIO rails per I/O bank (1.5 V, 1.8 V, 2.5 V, 3.3 V). The Altera Stratix Device Family Data Sheet mandates that VCCINT ramp before or simultaneously with VCCIO to avoid I/O latch-up; a power-good sequencer or simple RC delay on the VCCIO gate driver is recommended. Estimated: with all 773 I/Os switching at 100 MHz into 5 pF loads, dynamic current on VCCINT can approach 3-4 A in addition to leakage, so the regulator must be sized with at least 30% headroom.
The FBGA-1020 package dissipates heat primarily through the inner ball grid and PCB inner-plane copper. Without thermal vias under the BGA and at least 6 inner copper planes, junction-to-ambient thermal resistance theta_JA exceeds 15 C/W, leading to junction temperatures above 100 C at typical utilization. Designers should populate a thermal-via array directly under the central ball grid (0.3 mm drill, 1.0 mm pitch) and consider an underside heatsink for sustained >70% logic utilization. Estimated: at 60% utilization with all PLLs active, junction temperature rise above ambient reaches 35-40 C on a properly designed 12-layer PCB.
Use a 12-layer (or minimum 10-layer) PCB with dedicated power and ground planes for VCCINT, VCCIO, VCCA_PLL, and VCCPD. Place 0.1 µF and 10 µF decoupling capacitors within 50 mm of every VCCINT pin group and within 25 mm of each PLL analog supply. Differential LVDS pairs must be length-matched within 20 mil (0.5 mm) and routed over a continuous reference plane to maintain 100 ohm differential impedance. The 1.0 mm BGA pitch requires laser-drilled microvias or sequential lamination to fan out the inner balls.
Three common pitfalls when designing with the EP1S60F1020C5: (1) Using Quartus Prime instead of Quartus II - the original Stratix family is only supported in Quartus II releases 5.1 through 13.0sp1; Quartus Prime will fail to detect the device. (2) Forgetting VCCPD (1.5 V pre-driver supply) - the I/O pre-drivers require this separate rail or the device will not configure. (3) Ignoring configuration mode - the device can boot in FPP, PS, AS, or JTAG modes, each requiring different EPC configuration memory and pin pull-ups; verify the mode in the Quartus II device settings before PCB layout.
Compliance Information
Standard EP1S60F1020C5 ships with SnPb (tin-lead) ball finish and is NOT RoHS compliant. RoHS-compliant lead-free variant is EP1S60F1020C5N (with 'N' suffix). REACH compliance follows Altera/Intel standard policy. AEC-Q100 is not applicable for commercial-grade FPGAs.
