EP1S80F1020C6N - Stratix 79,040 Logic Elements FPGA | Intel (Altera) | 1020-BGA
부품 번호: EP1S80F1020C6N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $145 | $14,500.00 |
| 500 | $125 | $62,500.00 |
| 1,000 | $110 | $110,000.00 |
EP1S80F1020C6N 개요
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnect, and I/O blocks, all controlled by a user-defined bitstream. FPGAs sit between fixed-function ASICs (high NRE cost, low unit cost) and microcontroller-based designs (low flexibility, low performance) in the semiconductor hierarchy, enabling rapid prototyping, mid-volume production, and hardware-acceleration of DSP, networking, and signal-processing workloads. The Stratix family specifically targets high-performance applications that require embedded multipliers, memory blocks, and high-speed transceivers.
Key features include 79,040 logic elements organized into 7904 LABs/CLBs, 773 user I/Os, and a 1020-ball FBGA package, all backed by the Stratix family's TriMatrix memory architecture and DSP blocks. The device integrates RAM blocks, PLL-based clock management, and high-speed LVDS I/O support for demanding parallel and serial interfaces.
The EP1S80F1020C6N utilizes Altera's Stratix architecture with embedded DSP blocks and high-speed memory, supporting core frequencies up to 450 MHz in Stratix-family devices per the FindIC comparison data. The 130 nm process node delivers a balance of logic density, performance, and power efficiency typical of early-2000s high-end FPGAs, while the 1 mm-pitch FBGA package enables high pin count on a manageable board footprint.
Typical applications include telecommunications infrastructure (SONET/SDH framer, protocol bridging), high-speed data acquisition and DSP signal processing, ASIC prototyping, broadcast video processing, and military/aerospace signal-processing subsystems where the 79K LE density provides ample headroom for complex datapaths.
When designing with this part, ensure the PCB layout supports the 33 x 33 mm, 1 mm-pitch BGA with full fan-out, including 6-8 routing layers and microvia stacks. Confirm configuration memory interface design (EPCS serial flash) and thermal management for the C6N (commercial) speed grade. Devices in this family are typically sourced as NRND/EOL inventory - verify lead time before committing to production.
드롭인 대체품: EP1S80F1020C6N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S80F1020C6N (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, RoHS Status, Package Type, Speed Grade, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S80F1020C6
✅ 드롭인✓ 재고 있음
$1180 / 개
데이터시트 보기 →EP1S80F1020C7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1S80F1020C5N
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP1S80F1020I6N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1S60F1020C6N
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP1S40F1020C6N
✅ 드롭인✓ 재고 있음
$695 / 개
데이터시트 보기 →EP1S80F1020C6N 최대 정격 & 전기적 특성
| Manufacturer | Intel (formerly Altera) |
| Series | Stratix |
| Logic Cells / Logic Elements | 79,040 |
| Equivalent Gate Count | 7,427,520 |
| Number of LABs/CLBs | 7904 |
| Number of User I/Os | 773 |
| 패키지 | 1020-ball FBGA (FC-FBGA), 33 x 33 mm, 1 mm pitch |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| 동작 온도 | 0C to 85C (Commercial) |
| Speed Grade | C6 |
| 실장 유형 | Surface Mount (SMT) |
| Operating Frequency (typ.) | 450 MHz (Stratix family max) |
| Configuration Memory Interface | Serial (EPCS) or parallel - per Stratix family |
EP1S80F1020C6N 핀 구성
| 핀 A1 | GND — Ground (representative; full 1020-ball BGA pinout in Stratix Family Data Sheet) |
| 핀 B5 | VCC — 1.5 V core supply (representative) |
| 핀 C12 | IO — User I/O bank pin (representative) |
| 핀 D18 | CLK — Dedicated clock input (representative) |
| 핀 AA1 | GND — Ground (representative) |
| 핀 AJ33 | I/O — User I/O bank pin (representative) |
| 핀 AN32 | CONFIG — Configuration mode select (representative) |
| 핀 AK28 | TMS — JTAG Test Mode Select (representative) |
일반적인 애플리케이션
EP1S80F1020C6N 적합 용도: 6 애플리케이션s: Telecommunications Framer and Protocol Bridging, ASIC Prototyping and Emulation, High-Performance DSP Signal Processing, Broadcast Video Processing and Format Conversion, Industrial Control and Test Equipment, Aerospace and Defense Signal Processing.
Telecommunications Framer and Protocol Bridging
The EP1S80F1020C6N is well-suited for telecom framer and protocol bridging designs where 79,040 logic elements deliver the parallel-processing density required to handle multiple OC-48/STM-16 channels concurrently. With up to 773 user I/Os and Stratix DSP blocks, the device can implement SONET/SDH framers, ATM-to-IP/Port converters, and HDLC/PPP protocol engines in a single chip. Its 130 nm CMOS architecture delivers Fmax up to 450 MHz in Stratix-family DSP paths, sufficient for OC-192 framer datapaths. Pair with Altera/Intel EPCS serial configuration memory and a system clock PLL.
추천
ASIC Prototyping and Emulation
The EP1S80F1020C6N's 79,040 logic elements (7.4M equivalent gates) and 773 user I/Os make it a strong choice for ASIC prototyping where designers map large ASIC RTL onto multiple Stratix FPGAs via TDM partitioning. The 1.5 V core supply and 130 nm Stratix architecture support fast iteration cycles in Quartus II/Prime, while the 1020-FBGA package provides ample I/O for ASIC boundary-scan emulation. Compared to gate-array emulation ASICs, the FPGA route offers faster turnaround (weeks vs months). Target applications include multi-million-gate ASIC designs in networking, storage, and baseband signal processing.
추천
High-Performance DSP Signal Processing
The EP1S80F1020C6N integrates Stratix-family embedded DSP blocks optimized for high-throughput filtering, FFT, and baseband processing, with logic density supporting multi-channel radio baseband or radar signal chains. The 7904 LABs/CLBs enable parallel datapath implementation, while 773 user I/Os allow direct interface to high-speed ADCs and DACs without external bus multiplexing. According to Stratix family datasheets, DSP block Fmax up to 450 MHz supports 16-bit multiplications at >250 MHz sustained throughput. Pair with DDR memory controllers implemented in fabric for high-bandwidth data buffering.
추천
Broadcast Video Processing and Format Conversion
The EP1S80F1020C6N fits broadcast video processing applications including HD-SDI/SDI routing, format conversion (e.g., 1080i to 720p), and real-time video effects processing where the 773 user I/Os handle multiple parallel video streams. The 79K LE fabric supports line buffers, deinterlacers, and color-space converters while Stratix TriMatrix memory blocks implement frame buffers without external SRAM. The 130 nm process delivers low-latency logic paths suitable for real-time video at 148.5 MHz pixel clocks (1080p60). For new designs, evaluate Stratix IV/V/10 for higher video throughput.
추천
Industrial Control and Test Equipment
The EP1S80F1020C6N's 79K logic elements, 773 I/Os, and parallel-processing capability fit industrial test and measurement applications including protocol-aware test equipment, multi-channel data acquisition, and FPGA-based instrumentation. The commercial temperature grade (0C-85C) suits controlled-environment test racks, while the industrial variant EP1S80F1020I6N handles factory-floor deployments from -40C to +100C. Embedded PLLs and clock management support multi-rate sampling architectures, while high I/O count accommodates parallel bus interfaces to legacy industrial buses and modern high-speed ADC/DAC interfaces.
추천
Aerospace and Defense Signal Processing
The EP1S80F1020C6N supports aerospace and defense applications such as radar signal processing, electronic warfare subsystems, and secure communications where high-throughput DSP and radiation-tolerant design margins are required. The 79,040 logic elements and Stratix DSP blocks enable multi-channel digital downconversion, pulse compression, and adaptive beamforming in radar receiver chains. For mission-critical designs, pair with the EP1S80F1020I6N industrial-temp variant (where applicable) or screen parts per MIL-STD-883 methods. New programs should evaluate Stratix IV/V/10 with enhanced rad-tolerance features.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1S80F1020C6N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S80F1020C6 | EP1S80F1020C7N | EP1S80F1020C5N | EP1S80F1020I6N | EP1S60F1020C6N | EP1S40F1020C6N |
|---|---|---|---|---|---|---|---|
| Package | 1020-FBGA (33x33 mm, 1 mm pitch) | 1020-FBGA - same | 1020-FBGA - same | 1020-FBGA - same | 1020-FBGA - same | 1020-FBGA - same | 1020-FBGA - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 79,040 | 79,040 | 79,040 | 79,040 | 79,040 | 57,120 | 41,250 |
| Number of LABs/CLBs | 7904 | 7904 | 7904 | 7904 | 7904 | 5710 | 4125 |
| User I/Os | 773 | 773 | 773 | 773 | 773 | 773 | 773 |
| Speed Grade | C6 (commercial) | C6 | C7 (faster) | C5 (slower) | I6 (industrial) | C6 | C6 |
| Operating Temperature | 0C to 85C (commercial) | 0C to 85C | 0C to 85C | 0C to 85C | -40C to +100C (industrial) | 0C to 85C | 0C to 85C |
| Lead-Free / RoHS | Lead-free (N suffix) | SnPb finish (no N) | Lead-free | Lead-free | Lead-free | Lead-free | Lead-free |
주요 차별점
- Highest logic density in Stratix family (79K LE) (vs EP1S60F1020C6N)
- Speed grade C6 (mid-tier Fmax in Stratix family) (vs EP1S80F1020C7N)
- Commercial temperature range (0C to 85C) (vs EP1S80F1020I6N)
설계 노트
Estimated: the 1020-FBGA package at 33 x 33 mm with 1 mm ball pitch requires 6-8 routing layers with microvia stacks for full fan-out. Per JEDEC BGA design guidelines (JESD51-series for thermal; IPC-7351 for land pattern), allow at least 0.6 mm trace width / 0.6 mm spacing on outer rows and use 0.4 mm microvia-in-pad for inner rows. The exposed die-attach pad on the package underside must be soldered to a central thermal pad with thermal via array (0.3 mm vias, 1.0 mm pitch) for heat dissipation.
Estimated: at full logic utilization (90% LE, 50% DSP block toggle rate) on the C6N speed grade, total power dissipation typically reaches 5-8 W. The 33 x 33 mm FBGA package has theta_JA around 15-20 C/W with a properly designed thermal via array and PCB copper pour. Provide 4-6 thermal vias directly under the die-attach pad and connect them to internal ground planes. For chassis-mounted designs, consider a small clip-on heatsink or forced-air cooling to maintain junction temperature below 85C.
Decouple the Stratix 1.5 V core supply with 10 uF bulk + 0.1 uF + 0.01 uF ceramic capacitor arrays placed within 5 mm of each VCC pin pair. Per Stratix Family Data Sheet power-pin guidelines, each VCCIO bank requires its own decoupling network sized to the I/O bank's switching current. Use separate analog and digital ground planes joined at a single point beneath the FPGA. For high-speed LVDS I/O, maintain 100 ohm differential impedance with matched trace lengths (within 150 mil tolerance) and route over a continuous ground reference plane.
Critical: Stratix EP1S80 devices in the 1020-FBGA package are NRND/EOL - confirm last-time-buy windows with Intel/Avnet before committing to production. Do not assume new-pinout parts in the same package are drop-in compatible: the EP1S30, EP1S40, EP1S60, and EP1S80 family members share the 1020-FBGA pinout per Stratix family convention, but check the Quartus II/Prime pinout file before PCB layout reuse. Configuration mode pins (MSEL) must be tied to the correct logic levels for AS/PS/JTAG modes per Quartus configuration scheme selection.
For 773 I/O signals at LVDS-25 and above, simulate signal integrity with the Stratix IBIS model in HyperLynx or equivalent. Per Stratix Family Data Sheet, simultaneous switching output (SSO) effects can cause ground-bounce noise on heavily loaded banks - limit simultaneous outputs to 20-30 per bank and stagger enable signals in firmware. For DDR/DDR2 SDRAM interfaces, use Stratix dedicated DQS phase-shift circuitry and follow JEDEC JESD79-series PCB layout rules (matched trace lengths +/- 25 mils, series stub resistors if needed).
규정 준수 정보
EP1S80F1020C6N is lead-free per the 'N' suffix (RoHS compliant). RoHS/REACH status per DigiKey product page; halogen-free status not explicitly stated in distributor data. AEC-Q100 not applicable (FPGA is not an automotive-qualified part).
