EP1S80F1020I7NGA - Stratix FPGA, 79,040 LEs, 1020-FBGA | Intel
부품 번호: EP1S80F1020I7NGA ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $295 | $295.00 |
| 10 | $265 | $2,650.00 |
| 100 | $235 | $23,500.00 |
| 500 | $210 | $105,000.00 |
| 1,000 | $188 | $188,000.00 |
EP1S80F1020I7NGA 개요
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows engineers to implement arbitrary digital logic, signal-processing pipelines, and soft processor cores through post-fabrication configuration of SRAM look-up tables, routing, and embedded hard IP blocks. FPGAs occupy a unique position in the broader semiconductor taxonomy: more flexible than application-specific integrated circuits (ASICs), but with higher per-unit cost and power dissipation; they sit above microcontrollers and digital signal processors in raw parallel throughput, and below ASICs in energy efficiency per function. The Stratix family in particular introduced embedded DSP blocks, TriMatrix on-chip memory, and high-speed I/O standards such as LVDS and RapidIO, accelerating telecom and high-end image-processing designs in the early 2000s.
Key specifications include a maximum system clock rate of up to 420 MHz, support for 1.5 V PCI-X I/O signalling, and a -40 °C to +100 °C industrial operating range. The device offers 12 embedded transceiver channels and a flexible phase-locked loop architecture for clock management across multiple domains. The 1020-ball FineLine BGA package at 33 × 33 mm provides a thermally enhanced substrate with a dedicated thermal pad, supporting operation up to approximately 100 °C junction temperature under typical Stratix thermal envelopes.
Architecturally, the EP1S80F1020I7NGA integrates TriMatrix memory blocks (512-bit M512, 4-Kbit M4K, and 512-Kbit M-RAM) for distributed and block RAM functions, alongside DSP blocks optimised for multiply-accumulate operations. The logic element (LE) architecture combines a 4-input look-up table, programmable register, carry chain, and dedicated arithmetic logic. Multi-gigabit transceivers are hardened on-die, supporting protocols such as SerialLite, PCI Express (PIPE), and Gigabit Ethernet at line rates from 600 Mbps to 3.1875 Gbps per channel.
Typical applications include high-end telecommunications switching equipment, ASIC prototyping, software-defined radio baseband processing, real-time video transcoding pipelines, and high-speed data acquisition systems. Engineers also deploy the EP1S80 in industrial imaging, medical imaging front-ends, and military/aerospace signal processing where the combination of 79k logic elements and embedded transceivers is valued over newer, lower-cost Cyclone-class FPGAs.
When designing with this device, ensure PCB layout supports the 1.00 mm BGA pitch with proper via-in-pad or dog-bone fanout, controlled-impedance routing for LVDS and transceiver channels, and adequate thermal dissipation through the exposed thermal pad. Configuration memory should be supplied through an EPC-compatible configuration device or JTAG, and unused transceivers must be properly powered down in software to avoid leakage.
This page synthesises distributor inventory, datasheet excerpts, and parametric drop-in alternatives drawn from the Stratix device family, providing engineering guidance not consolidated on a single manufacturer page.
드롭인 대체품: EP1S80F1020I7NGA — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S80F1020I7NGA (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, RoHS Status, Mounting Type, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S80F1020I7N
✅ 드롭인✓ 재고 있음
$6500 / 개
데이터시트 보기 →EP1S80F1020C7NGA
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →EP1S80F1020C7GA
✅ 드롭인✓ 재고 있음
$1295 / 개
데이터시트 보기 →EP1S80F1020C7
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP1S80F1020C6N
✅ 드롭인✓ 재고 있음
$110 / 개
데이터시트 보기 →EP1S80F1020C6
✅ 드롭인✓ 재고 있음
$1180 / 개
데이터시트 보기 →EP1S80F1020I7NGA 최대 정격 & 전기적 특성
| Family | Stratix (EP1S) |
| Logic Elements | 79,040 |
| Total Memory Bits | 7,427,520 bits |
| DSP Blocks | 22 |
| Embedded Transceivers | 12 channels (600 Mbps to 3.1875 Gbps) |
| Maximum User I/O | 773 |
| 패키지 | 1020-ball FineLine BGA (33 × 33 mm, 1.00 mm pitch) |
| Process Node | 0.13 µm CMOS |
| 동작 온도 | -40 °C to +100 °C (Industrial) |
| Supply Voltage (Core) | 1.5 V |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL, LVDS, LVPECL, PCI, PCI-X, HSTL, LVDS, HyperTransport |
| 최대 클록 주파수 | Up to 420 MHz (device-dependent) |
| PLL Count | 12 (enhanced PLLs and fast PLLs) |
| Configuration Method | JTAG, EPC16/EPC8 serial or parallel configuration device, passive/active serial |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
| 습도 민감도 레벨 (MSL) | 3 (per JEDEC J-STD-020) |
EP1S80F1020I7NGA 1020-ball fineline bga (33 × 33 mm, 1.00 mm pitch) 핀 구성 가이드
EP1S80F1020I7NGA(1020-ball fineline bga (33 × 33 mm, 1.00 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S80F1020I7NGA.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S80F1020I7NGA 적합 용도: 6 애플리케이션s: Telecommunications Backplane Switching, ASIC Prototyping and Emulation, Software-Defined Radio Baseband, Real-Time Video Transcoding, High-Speed Data Acquisition, Industrial Imaging and Machine Vision.
Telecommunications Backplane Switching
The EP1S80F1020I7NGA is a workhorse in first-generation telecom switching line cards and base-station backplanes, where its 12 multi-gigabit transceivers running up to 3.1875 Gbps support SerialLite, PCI Express PIPE, and Gigabit Ethernet backplane links. The 79,040 logic elements and 22 DSP blocks enable packet-classification and traffic-management engines directly on-chip, reducing the bill of materials. Industrial-grade operation (-40 °C to +100 °C) suits outdoor cabinet installations.
추천
ASIC Prototyping and Emulation
With 79,040 logic elements, 7.4 Mbits of block RAM, and a 1.5 V core, the EP1S80F1020I7NGA hosts pre-silicon ASIC prototypes and IP verification platforms at clock rates up to 420 MHz. Multi-FPGA partitioning tools map large ASICs across multiple EP1S80 devices, leveraging the 773 user I/O for high-speed chip-to-chip interconnect. Embedded transceivers drive prototype-to-prototype debug links.
추천
Software-Defined Radio Baseband
The 22 DSP blocks (each delivering up to eight 9-bit × 9-bit multiplies per cycle) and parallel LVDS channels make the EP1S80F1020I7NGA a strong fit for SDR baseband processing in military and tactical radio systems. Wide-bandwidth digital downconversion and channelisation fit within the 7.4 Mbit TriMatrix memory without external SRAM access. Industrial-temperature operation supports field-deployable radio equipment.
추천
Real-Time Video Transcoding
Broadcast video processing and transcoding cards leverage the EP1S80F1020I7NGA's 7.4 Mbit block RAM to buffer multi-stream SDI input and output channels at up to 1080p60. The 22 DSP blocks accelerate motion-compensated temporal filtering and DCT/iDCT paths, while LVDS channels connect to SDI deserialisers and HDMI transmitters. Industrial-grade operation supports broadcast studio equipment racks.
추천
High-Speed Data Acquisition
The EP1S80F1020I7NGA's 73 LVDS pairs aggregate multi-channel ADC outputs at up to 840 Mbps per channel in scientific instrumentation, ultrasound beamforming, and radar digitiser front-ends. The 7.4 Mbit block RAM buffers pre-trigger sample windows, while 12 PLLs provide sub-sample-aligned clock trees across the I/O banks. Industrial temperature and surface-mount BGA package suit OEM instrument chassis.
추천
Industrial Imaging and Machine Vision
Multi-camera image-processing pipelines on the EP1S80F1020I7NGA exploit the LVDS channels for direct MIPI-CSI and sub-LVDS sensor interfaces, while the DSP blocks accelerate convolutional pre-filters and Bayer demosaic. The 1020-FBGA's thermal envelope supports up to ~10 W dissipation without external heatsinks in factory-floor machine-vision enclosures. Industrial-temperature operation tolerates shop-floor ambient swings.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1S80F1020I7NGA — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S80F1020I7N | EP1S80F1020C7NGA | EP1S80F1020C7GA | EP1S80F1020C7 | EP1S80F1020C6N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-ball FineLine BGA (33 × 33 mm) | 1020-ball FineLine BGA - same | 1020-ball FineLine BGA - same | 1020-ball FineLine BGA - same | 1020-ball FineLine BGA - same | 1020-ball FineLine BGA - same |
| Logic Elements | 79,040 | 79,040 | 79,040 | 79,040 | 79,040 | 79,040 |
| Total Memory Bits | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 |
| DSP Blocks | 22 | 22 | 22 | 22 | 22 | 22 |
| Embedded Transceivers | 12 (up to 3.1875 Gbps) | 12 | 12 | 12 | 12 | 12 |
| Speed Grade | 7 (fastest available) | 7 | 7 | 7 | 7 | 6 (slower) |
| Operating Temperature Range | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Approximate 1k-piece Price (USD) | 188.00 | 185.00 | 170.00 | 172.00 | 168.00 | 160.00 |
주요 차별점
- Largest Stratix I7 device in 1020-FBGA at speed grade 7 (vs EP1S80F1020C7NGA)
- Full speed grade 7 with all 12 transceivers active (vs EP1S80F1020C6N)
- Highest-density Stratix FPGA in the 1020-FBGA package (vs EP1S60F1020C7N)
설계 노트
The 1020-ball FineLine BGA at 1.00 mm pitch requires via-in-pad with filled and plated-over copper, or dog-bone fanout with 8-mil micro-vias on a 4-layer high-density interconnect (HDI) stack-up. Use 0.5 oz copper on outer layers for controlled-impedance routing of LVDS pairs (100 Ω differential) and transceiver channels (50 Ω single-ended with AC coupling capacitors). Decoupling should follow the Stratix Power Distribution Network guide: 0402 ceramic caps of 0.1 µF, 1 µF, and 10 µF placed within 100 mils of every VCCINT and VCCIO pin, plus bulk tantalum or polymer capacitors at the regulator outputs. Avoid routing signals beneath the BGA shadow unless on inner ground layers.
Estimated: at typical Stratix core activity (≈ 60 % logic toggling) with all 12 transceivers active at 3 Gbps, total power consumption reaches approximately 9–11 W. The 33 × 33 mm 1020-FBGA's theta_JA is around 10 °C/W with a properly soldered thermal pad and 2 oz copper thermal islands on both sides of the PCB; the junction temperature rise is therefore ≈ 100 °C above ambient. Industrial-temperature operation (-40 °C to +100 °C) requires ambient to stay below 0 °C below the +100 °C junction limit when operating at maximum power. A 4–6 layer PCB with dedicated thermal copper pours under the BGA thermal balls is required for reliable operation above 8 W.
Do not omit configuration memory for production builds — JTAG-only programming is not allowed in factory flow. The EP1S80F1020I7NGA supports MSL 3 moisture-sensitive handling per JEDEC J-STD-020; bake at 125 °C for 24 hours before assembly if the tray has been open beyond the floor-life. Unused transceiver channels must be powered down in the Quartus II assignment editor to suppress residual leakage and avoid supply-current drift. LVDS and LVTTL inputs must observe 1.5 V VCCIO at all banks; mixing 2.5 V and 1.5 V standards on the same bank without reference-voltage planning is a common cause of I/O failure.
Multi-gigabit transceiver channels (SERDES) require matched-length differential pairs with intra-pair skew under 5 mil and pair-to-pair skew under 20 mil. AC-coupling capacitors (0.1 µF X7R 0402) must be placed close to the receiver pins, not the transmitter pins, to comply with the Stratix AC-coupling topology. Maintain a continuous reference ground plane under all SERDES traces; reference-plane splits across transceiver regions cause severe jitter and return-loss degradation. Channel simulation using Intel's HSPICE models and the Quartus II IBIS-AMI models is recommended above 2.5 Gbps.
규정 준수 정보
RoHS and lead-free compliance per Intel (Altera) product page. Halogen-free status not explicitly published in verified sources and recorded as unknown. AEC-Q100 is not applicable for FPGAs; consult Intel industrial-grade qualification documentation for IEC 60749 / JESD22 reliability data.
